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PDF W3EG6433S-D3 Data sheet ( Hoja de datos )

Número de pieza W3EG6433S-D3
Descripción 256MB - 2x16Mx64 DDR SDRAM UNBUFFERED
Fabricantes White Electronic 
Logotipo White Electronic Logotipo



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White Electronic Designs
W3EG6433S-D3
-JD3
PRELIMINARY*
256MB – 2x16Mx64 DDR SDRAM UNBUFFERED
FEATURES
DDR266 and DDR333
Double-data-rate architecture
Bi-directional data strobes (DQS)
Differential clock inputs (CK & CK#)
Programmable Read Latency 2,2.5 (clock)
Programmable Burst Length (2,4,8)
Programmable Burst type (sequential & interleave)
Edge aligned data output, center aligned data input.
Auto and self refresh
Serial presence detect
Dual Rank
Power supply: 2.5V ± 0.2V
JEDEC 184 pin DIMM package
• JD3www.DataSheet4U.com PCB height: 30.48 (1.20")
DESCRIPTION
The W3EG6433S is a 2x16Mx64 Double Data Rate
SDRAM memory module based on 256Mb DDR SDRAM
component. The module consists of sixteen 16Mx8 DDR
SDRAMs in 66 pin TSOP packages mounted on a 184
pin FR4 substrate.
Synchronous design allows precise cycle control with the
use of system clock. Data I/O transactions are possible on
both edges and Burst Lengths allow the same device to be
useful for a variety of high bandwidth, high performance
memory system applications.
* This product is under development, is not qualified or characterized and is subject to
change without notice.
NOTE: Consult factory for availability of:
• RoHS compliant products
• Vendor source control options
• Industrial temperature option
Clock Speed
CL-tRCD-tRP
OPERATING FREQUENCIES
DDR333@CL=2.5
166MHz
2.5-3-3
DDR266 @CL=2
133MHz
2-2-2
DDR266 @CL=2
133MHz
2-3-3
DDR266 @CL=2.5
133MHz
2.5-3-3
November 2005
Rev. 2
1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

1 page




W3EG6433S-D3 pdf
White Electronic Designs
Parameter
Input Capacitance (A0-A11)
Input Capacitance (RAS#,CAS#,WE#)
Input Capacitance (CKE0, CKE1, CKE2)
Input Capacitance (CLK0, CLK1, CLK2)
Input Capacitance (CS0#, CS1#)
Input Capacitance (DMO ~ DM7)
Input Capacitance (BA0-BA1)
Data input/output capacitance (DQ0-DQ63)(DQS)
Data input/output capacitance (CB0-CB7)
CAPACITANCE
TA = 25°C. f = 1MHz, VCC = 2.5V
Symbol
CIN1
CIN2
CIN3
CIN4
CIN5
CIN6
CIN7
COUT
COUT
W3EG6433S-D3
-JD3
PRELIMINARY
Max Unit
81 pF
81 pF
50 pF
34 pF
50 pF
12 pF
81 pF
12 pF
- pF
November 2005
Rev. 2
5 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

5 Page





W3EG6433S-D3 arduino
White Electronic Designs
W3EG6433S-D3
-JD3
PRELIMINARY
ORDERING INFORMATION FOR D3
Part Number
W3EG6433S335D3
Speed
166MHz/333Mb/s
CAS Latency
2.5
tRCD
3
tRP
3
Height*
30.48 (1.20")
W3EG6433S262D3
133MHz/266Mb/s
2
2 2 30.48 (1.20")
W3EG6433S263D3
133MHz/266Mb/s
2
3 3 30.48 (1.20")
W3EG6433S265D3
133MHz/266Mb/s
2.5
3 3 30.48 (1.20")
NOTES:
• Consult Factory for availability of RoHS compliant products. (G = RoHS Compliant)
• Vendor specific part numbers are used to provide memory components source control. The place holder for this is shown as lower case “x” in the part numbers above and is to
be replaced with the respective vendors code. Consult factory for qualified sourcing options. (M = Micron, S = Samsung & consult factory for others)
• Consult factory for availability of industrial temperature (-40°C to 85°C) option
PACKAGE DIMENSIONS FOR D3
3.99
(0.157 (2x))
17.78
(0.700)
10.01
(0.394)
6.35
(0.250)
133.48
(5.255" MAX.)
131.34
(5.171")
128.95
(5.077")
64.77
(2.550)
6.35
(0.250)
1.78
(0.070)
1.27
49.53 (0.050 TYP.)
(1.950)
2.54
(0.100)
30.48
(1.20)
MAX
3.99
(0.157)
(MIN)
2.31
(0.091)
(2x)
3.00
(0.118)
(4x)
1.27 ± 0.10
(0.050 ± 0.004)
November 2005
Rev. 2
* ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES)
11 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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