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PDF P0406FCxxC Data sheet ( Hoja de datos )
| Número de pieza | P0406FCxxC | |
| Descripción | FLIP CHIP ARRAY | |
| Fabricantes | Protek Devices | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de P0406FCxxC (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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Only One Name Means ProTek’Tion™
P0406FC3.3C*
thru
P0406FC36C*
FLIP CHIP ARRAY
APPLICATIONS
✔ Cellular Phones
✔ MCM Boards
✔ Wireless Communication Circuits
✔ IR LEDs
✔ SMART & PCMCIA Cards
IEC COMPATIBILITY (EN61000-4)
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
FEATURES
✔ ESD Protection > 25 kilovolts
✔ Available in Multiple Voltage Types Ranging From 3.3V to 36V
✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔ Bidirectional Configuration & Monolithic Structure
✔ Protects 3 to 5 Lines
✔ RoHS in Lead-Free Versions
MECHANICAL CHARACTERISTICS
✔ Standard EIA Chip Size: 0406
✔ Weight 0.73 milligrams (Approximate)
✔ Available in Tin-Lead or Lead-Free Plating
✔ Solder Reflow Temperature:
Tin-Lead - Sn/Pb, 85/15: 240-245°C
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
✔ Flammability Rating UL 94V-0
✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔ Device Marking On Reel
✔ Top Contacts: Solder Bump 0.004” in Height (Nominal)
PIN CONFIGURATION
0406
(Single Chip Shown)
05155.R4 3/05
*U.S. Patent No. Des. “D456,367S”
1 www.protekdevices.com
1 page  
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
TOP
E
F
END
H
I
P0406FC3.3C*
thru
P0406FC36C*
PACKAGE DIMENSIONS
DIM MILLIMETERS
INCHES
A 0.56 NOM 0.022 NOM
B 0.86 NOM 0.034 NOM
C 0.99 ± 0.0254 0.039 ± 0.001
E 0.15 SQ
0.006 SQ
F
1.5 ± 0.0254
0.059 ± 0.001
G 0.15 NOM 0.006 NOM
H 0.127 MAX 0.005 MAX
0.076 MIN
0.003 MIN
I
0.406 NOM
0.016 NOM
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
MOUNTING PAD LAYOUT - Option 1
D
CA
DIE
SOLDER
BUMPS
I
PAD DIMENSIONS
DIM MILLIMETERS
A 0.51
C 0.30
D 0.46
E 0.20
F 0.15 SQ
G 0.71
H 0.99
I 0.51
INCHES
0.020
0.012
0.018
0.008
0.006 SQ
0.028
0.039
0.020
NOTE:
1. Preferred: Using 0.1mm (0.004”) stencil.
SOLDER PRINT
0.010” - 0.012” DIA.
SOLDER PADS
SOLDER MASK
Outline & Dimensions: Rev 3 - 11/02, 06023
05155.R4 3/05
*U.S. Patent No. Des. “D456,367S”
5 www.protekdevices.com
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet P0406FCxxC.PDF ] | |
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