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PDF LC0406FCxxC Datasheet ( Hoja de datos )

Número de pieza LC0406FCxxC
Descripción LOW CAPACITANCE FLIP CHIP ARRAY
Fabricantes Protek Devices 
Logotipo Protek Devices Logotipo

Total 6 Páginas
		
LC0406FCxxC Hoja de datos, Descripción, Manual
Only One Name Means ProTek’Tion™
LC0406FC3.3C
thru
LC0406FC36C
LOW CAPACITANCE FLIP CHIP ARRAY
APPLICATIONS
Cellular Phones
Personal Digital Assistant (PDA)
Notebook Computers
SMART Cards
IEC COMPATIBILITY (EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
61000-4-4 (EFT): 40A - 5/50ns
FEATURES
ESD Protection > 25 kilovolts
Available in Voltages Ranging From 3.3V to 36V
200 Watts Peak Pulse Power per Line (tp = 8/20µs)
Low Clamping Voltage
Bidirectional Configuration & Monolithic Structure
Protects 3 to 5 Lines
LOW CAPACITANCE
LOW LEAKAGE CURRENT
RoHS Compliant in Lead-Free Versions
MECHANICAL CHARACTERISTICS
Standard EIA Chip Size: 0406
Weight 0.73 milligrams (Approximate)
Available in Tin-Lead or Lead-Free Plating
Solder Reflow Temperature:
Tin-Lead - Sn/Pb, 85/15: 240-245°C
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
Flammability Rating UL 94V-0
8mm Plastic & Paper Tape and Reel Per EIA Standard 481
Device Marking On Reel
Top Contacts: Solder Bump 0.004” in Height (Nominal)
0406
(Single Chip Shown)
PIN CONFIGURATION
05158.R5 4/05
1 www.protekdevices.com

1 page

LC0406FCxxC pdf
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
TOP
E
F
END
H
I
LC0406FC3.3C
thru
LC0406FC36C
PACKAGE DIMENSIONS
DIM MILLIMETERS
INCHES
A 0.56 NOM 0.022 NOM
B 0.86 NOM 0.034 NOM
C 0.99 ± 0.0254 0.039 ± 0.001
E 0.15 SQ
0.006 SQ
F
1.5 ± 0.0254
0.059 ± 0.001
G 0.15 NOM 0.006 NOM
H 0.127 MAX 0.005 MAX
0.076 MIN
0.003 MIN
I
0.406 NOM
0.016 NOM
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
MOUNTING PAD LAYOUT - Option 1
D
CA
DIE
SOLDER
BUMPS
I
PAD DIMENSIONS
DIM MILLIMETERS
A 0.51
C 0.30
D 0.46
E 0.20
F 0.15 SQ
G 0.71
H 0.99
I 0.51
INCHES
0.020
0.012
0.018
0.008
0.006 SQ
0.028
0.039
0.020
NOTE:
1. Preferred: Using 0.1mm (0.004”) stencil.
SOLDER PRINT
0.010” - 0.012” DIA.
SOLDER PADS
SOLDER MASK
Outline & Dimensions: Rev 3 - 11/02, 06023
05158.R5 4/05
5 www.protekdevices.com

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