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PDF FMA3009 Data sheet ( Hoja de datos )

Número de pieza FMA3009
Descripción BROADBAND MMIC AMPLIFIER
Fabricantes Filtronic 
Logotipo Filtronic Logotipo



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No Preview Available ! FMA3009 Hoja de datos, Descripción, Manual

2-20GHZ BROADBAND MMIC AMPLIFIER
FMA3009
Preliminary Datasheet v2.1
FEATURES:
Cascode Configuration
10dB Gain
Single Supply
23dBm P1dB Output Power at 8.0V
pHEMT Technology
Bias Control
Input Return Loss <-10dB
Output Return Loss <-10dB
FUNCTIONAL SCHEMATIC:
VDD
RF Input
RF Output
GENERAL DESCRIPTION:
The FMA3009 is a high performance 2-20GHz
Gallium Arsenide monolithic travelling wave
amplifier. It is suitable for use in broadband
communication, instrumentation and electronic
warfare applications. The die is fabricated
using the Filtronic 0.25µm process. The Circuit
is DC blocked at both the RF input and the RF
output. Bias control is achieved using a
combination of three on chip bias resistors
connected to ground, using the bond wires.
TYPICAL APPLICATIONS:
Test Instrumentation
Electronic Warfare
Broadband Communication Infrastructure
ELECTRICAL SPECIFICATIONS:
PARAMETER
Small Signal Gain
Gain Ripple
Input Return Loss
Output Return Loss
Reverse Isolation
Output Power at 1dB
compression point
Power Roll-off
Saturated Output Power
Drain Current
Note: TAMBIENT = +25°C, Z0 = 50Ω
CONDITIONS
2-20GHz
2-20GHz
2-20GHz
2-20GHz
2-20GHz
10GHz
20GHz
2-20GHz
10GHz
20GHz
8.0V
MIN
9.0
TYP
10
±0.7
<-10
<-10
<-45
27
22
5
28
24
287
MAX
UNITS
dB
dB
dB
dB
dB
dBm
dB
dBm
mA
Tel: +44 (0) 1325 301111
1
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: +44 (0) 1325 306177
Website: www.filtronic.com

1 page




FMA3009 pdf
PREFERRED ASSEMBLY INSTRUCTIONS:
GaAs devices are fragile and should be
handled with great care. Specially designed
collets should be used where possible.
The recommended die attach is gold/tin
eutectic solder under a nitrogen atmosphere.
Stage temperature should be 280-290°C;
maximum time at temperature is one minute.
The recommended wire bond method is
thermo-compression wedge bonding with 0.7
or 1.0 mil (0.018 or 0.025 mm) gold wire.
Stage temperature should be 250-260°C.
Bonds should be made from the die first and
then to the mounting substrate or package.
The physical length of the bondwires should be
minimised especially when making RF or
ground connections.
FMA3009
Preliminary Datasheet v2.1
ORDERING INFORMATION:
PART NUMBER
FMA3009
DESCRIPTION
Die in Waffle-pack
(Gel-pak available on request)
HANDLING
PRECAUTIONS:
To avoid damage to the devices care should
be exercised during handling. Proper
Electrostatic Discharge (ESD) precautions
should be observed at all stages of storage,
handling, assembly, and testing. These
devices should be treated as Class 1A (0-500
V) as defined in JEDEC Standard No. 22-
A114. Further information on ESD control
measures can be found in MIL-STD-1686 and
MIL-HDBK-263.
APPLICATION NOTES & DESIGN DATA:
Application Notes and design data including S-
parameters, noise data and large-signal
models are available on request.
DISCLAIMERS:
This product is not designed for use in any
space based or life sustaining/supporting
equipment.
5
Tel: +44 (0) 1325 301111
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: +44 (0) 1325 306177
Website: www.filtronic.com

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