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PDF 908E425 Datasheet ( Hoja de datos )

Número de pieza 908E425
Descripción Integrated Quad Half H-Bridge
Fabricantes Freescale Semiconductor 
Logotipo Freescale Semiconductor Logotipo
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908E425 datasheet

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908E425 pdf
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltage
Analog Chip Supply Voltage under Normal Operation, Steady State
Analog Chip Supply Voltage under Transient Conditions (1)
Microcontroller Chip Supply Voltage
Input Pin Voltage
Analog Chip
Microcontroller Chip
Maximum Microcontroller Current per Pin
All Pins Except VDD, VSS, PTA0:PTA6, PTC0:PTC1
Pins PTA0:PTA6, PTC0:PTC1
Maximum Microcontroller VSS Output Current
Maximum Microcontroller VDD Input Current
LIN Supply Voltage
Normal Operation (Steady-State)
Transient Conditions (1)
ESD Voltage (2)
Human Body Model (HBM)
Machine Model (MM)
Charge Device Model (CDM)
VSUP(SS)
VSUP(PK)
VDD
-0.3 to 28
-0.3 to 40
-0.3 to 6.0
VIN (ANALOG)
VIN (MCU)
-0.3 to 5.5
VSS-0.3 to VDD+0.3
IPIN(1)
IPIN(2)
IMVSS
IMVDD
±15
± 25
100
100
VBUS(SS)
VBUS(DYNAMIC)
VESD
-18 to 28
40
± 3000
± 150
± 500
V
V
mA
mA
mA
V
V
THERMAL RATINGS
Storage Temperature
TSTG
°C
Ambient Operating Temperature
Operating Case Temperature (3)
Operating Junction Temperature (4)
Peak Package Reflow Temperature During Solder Mounting (5)
TA
TC
TJ
TSOLDER
0 to 85
0 to 85
0 to 125
245
°C
°C
°C
°C
Notes
1. Transient capability for pulses with a time of t < 0.5 sec.
2. ESD voltage testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ), ESD voltage testing is
performed in accordance with the Machine Model (CZAP =200 pF, RZAP = 0 , ESD voltage testing is performed in accordance with
Charge Device Model, robotic (CZAP =4.0 pF).
3. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
4. The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation on the analog die. The analog die temperature must not exceed 150°C under these conditions.
5. Pin soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause
malfunction or permanent damage to the device.
Analog Integrated Circuit Device Data
Freescale Semiconductor
908E425
5

5 Page

908E425 arduino
MICROCONTROLLER
ELECTRICAL CHARACTERISTICS
MICROCONTROLLER
Table 5. Microcontroller Description
For a detailed microcontroller description, refer to the MC68HC908EY16 data sheet.
Module
Description
Core
High-Performance HC08 Core with a Maximum Internal Bus Frequency of 8.0 MHz
Timer
Two 16-Bit Timers with Two Channels (TIM A and TIM B)
Flash
16 K Bytes
RAM
512 Bytes
ADC
10-Bit Analog-to-Digital Converter
SPI SPI Module
ESCI
Standard Serial Communication Interface (SCI) Module
Bit-Time Measurement
Arbitration
Prescaler with Fine Baud-Rate Adjustment
ICG Internal Clock Generation Module (25% Accuracy with Trim Capability to 2%)
BEMF Counter
Special Counter for SMARTMOS™ BEMF Output
Analog Integrated Circuit Device Data
Freescale Semiconductor
908E425
11

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