DataSheet.es 908E425 Hoja de datos PDF


PDF 908E425 Datasheet ( Hoja de datos )

Número de pieza 908E425
Descripción Integrated Quad Half H-Bridge
Fabricantes Freescale Semiconductor 
Logotipo Freescale Semiconductor Logotipo
Vista previa
Total 49 Páginas
		
908E425 datasheet

1 Page

908E425 pdf
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltage
Analog Chip Supply Voltage under Normal Operation, Steady State
Analog Chip Supply Voltage under Transient Conditions (1)
Microcontroller Chip Supply Voltage
Input Pin Voltage
Analog Chip
Microcontroller Chip
Maximum Microcontroller Current per Pin
All Pins Except VDD, VSS, PTA0:PTA6, PTC0:PTC1
Pins PTA0:PTA6, PTC0:PTC1
Maximum Microcontroller VSS Output Current
Maximum Microcontroller VDD Input Current
LIN Supply Voltage
Normal Operation (Steady-State)
Transient Conditions (1)
ESD Voltage (2)
Human Body Model (HBM)
Machine Model (MM)
Charge Device Model (CDM)
VSUP(SS)
VSUP(PK)
VDD
-0.3 to 28
-0.3 to 40
-0.3 to 6.0
VIN (ANALOG)
VIN (MCU)
-0.3 to 5.5
VSS-0.3 to VDD+0.3
IPIN(1)
IPIN(2)
IMVSS
IMVDD
±15
± 25
100
100
VBUS(SS)
VBUS(DYNAMIC)
VESD
-18 to 28
40
± 3000
± 150
± 500
V
V
mA
mA
mA
V
V
THERMAL RATINGS
Storage Temperature
TSTG
°C
Ambient Operating Temperature
Operating Case Temperature (3)
Operating Junction Temperature (4)
Peak Package Reflow Temperature During Solder Mounting (5)
TA
TC
TJ
TSOLDER
0 to 85
0 to 85
0 to 125
245
°C
°C
°C
°C
Notes
1. Transient capability for pulses with a time of t < 0.5 sec.
2. ESD voltage testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ), ESD voltage testing is
performed in accordance with the Machine Model (CZAP =200 pF, RZAP = 0 , ESD voltage testing is performed in accordance with
Charge Device Model, robotic (CZAP =4.0 pF).
3. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
4. The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation on the analog die. The analog die temperature must not exceed 150°C under these conditions.
5. Pin soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause
malfunction or permanent damage to the device.
Analog Integrated Circuit Device Data
Freescale Semiconductor
908E425
5

5 Page

908E425 arduino
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 4. Dynamic Electrical Characteristics
All characteristics are for the analog chip only. Please refer to the specification for 68HC908EY16 for characteristics of the
microcontroller chip. Characteristics noted under conditions 9.0 V VSUP 16 V, 0°C TJ 125°C unless otherwise noted.
Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic
Symbol Min Typ Max Unit
LIN PHYSICAL LAYER
Propagation Delay (10), (11)
TXD LOW to LIN LOW
TXD HIGH to LIN HIGH
LIN LOW to RXD LOW
LIN HIGH to RXD HIGH
TXD Symmetry
RXD Symmetry
Output Falling Edge Slew Rate (10), (12)
80% to 20%
Output Rising Edge Slew Rate (10), (12)
20% to 80%, RBUS > 1.0 k, CBUS < 10 nF
LIN Rise/Fall Slew Rate Symmetry (10), (12)
HALL-EFFECT SENSOR INPUTS (H1:H3)
t TXD-LIN-low
t TXD-LIN-high
t LIN-RXD-low
t LIN-RXD-high
t TXD-SYM
t RXD-SYM
SRF
- 2.0
- 2.0
-1.0
4.0
4.0
- 2.0
6.0
6.0
8.0
8.0
2.0
2.0
- 3.0
µs
V/µs
SRR
V/µs
1.0 2.0 3.0
SRS
-2.0 –
2.0 µs
Propagation Delay
AUTONOMOUS WATCHDOG (AWD)
t HPPD
– 1.0 –
µs
AWD Oscillator Period
t OSC
– 40 – µs
AWD Period Low = 512 tOSC
t AWDPH
16
22
28
ms
AWD Period High = 256 tOSC
t AWDPL
8.0
11
14
ms
AWD Cyclic Wake-Up On Time
t AWDHPON
90
µs
Notes
10. All LIN characteristics are for initial LIN slew rate selection (20 kBaud) (SRS0:SRS1= 00).
11. See Figure 2.
12. See Figure 3.
908E425
10
Analog Integrated Circuit Device Data
Freescale Semiconductor

10 Page





PáginasTotal 49 Páginas
PDF Descargar[ 908E425.PDF ]

Enlace url


Hoja de datos destacado

Número de piezaDescripciónFabricantes
908E425Integrated Quad Half H-BridgeFreescale Semiconductor
Freescale Semiconductor

Número de piezaDescripciónFabricantes
SSM2604

Low Power Audio Codec.

Analog Devices
Analog Devices
SLG3NB3331

32.768 kHz and MHz GreenCLK.

Silego
Silego
SLA6805M

High Voltage 3 phase Motor Driver IC.

Sanken
Sanken
SDC1742

12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters.

Analog Devices
Analog Devices
SDC1741

12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters.

Analog Devices
Analog Devices


DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares,
permitiéndote verlos en linea o descargarlos en PDF.


Index : 0  1  2  3  4  5  6  7  8  9  A  B  C  D  E  F  G  H  I  J  K  L  M  N  O  P  Q  R  S  T  U  V  W  X  Y  Z


www.DataSheet.es    |   2018   |  Contacto  |  Buscar