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PDF FDMC6890NZ Data sheet ( Hoja de datos )
| Número de pieza | FDMC6890NZ | |
| Descripción | Dual N-Channel PowerTrench MOSFET | |
| Fabricantes | Fairchild Semiconductor | |
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FDMC6890NZ
Dual N-Channel PowerTrench® MOSFET
20V, 4A, Q1:68mΩ, Q2:100mΩ
Features
General Description
October 2006
tm
Q1: N-Channel
Max rDS(on) = 68mΩ at VGS = 4.5V, ID = 4A
Max rDS(on) = 100mΩ at VGS = 2.5V, ID = 3A
Q2: N-Channel
Max rDS(on) = 100mΩ at VGS = 4.5V, ID = 4A
Max rDS(on) = 150mΩ at VGS = 2.5V, ID = 2A
Low gate Charge
RoHS Compliant
FDMC6890NZ is a compact single package solution for DC to
DC converters with excellent thermal and switching
characteristics. Inside the Power 33 package features two
N-channel MOSFETs with low on-state resistance and low gate
charge to maximize the power conversion and switching
efficiency. The Q1 switch also integrates gate protection from
unclamped voltage input.
Application
DC - DC Conversion
Up
S1 D1/S2 D2
G1 D1/S2 G2
Power 33
Bottom
G1 D1/S2 G2
D1 D2
S1 D1/S2 D2
D2
4
D1/S2 5
S1
6
G2
3
2 D1/S2
1 G1
MOSFET Maximum Ratings TA = 25°C unless otherwise noted
Symbol
VDS
VGS
ID
Drain to Source Voltage
Gate to Source Voltage
-Continuous
-Pulsed
Parameter
PD
Power Dissipation (Steady State) Q1
Power Dissipation (Steady State) Q2
TJ, TSTG
Operating and Storage Junction Temperature Range
Thermal Characteristics
(Note 1a)
Q1 Q2
20 20
±12 ±12
4
10
1.92
1.78
-55 to +150
Units
V
V
A
W
°C
RθJA
RθJA
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Package Marking and Ordering Information
Q1
Q2
(Note 1a)
65
70
°C/W
Device Marking
6890N
Device
FDMC6890NZ
Package
Power 33
Reel Size
7inch
Tape Width
8mm
Quantity
3000 units
©2006 Fairchild Semiconductor Corporation
FDMC6890NZ Rev.C
1
www.fairchildsemi.com
1 page  
Typical Characteristics (Q1 N-Channel)TJ = 25°C unless otherwise noted
4.5
4.0 VDD = 8V
3.5
3.0 VDD = 10V
2.5
2.0 VDD = 12V
1.5
1.0
0.5
0.0
0.0 0.5 1.0 1.5 2.0 2.5
Qg, GATE CHARGE(nC)
Figure 7. Gate Charge Characteristics
3.0
400
Ciss
100 Coss
f = 1MHz
VGS = 0V
Crss
20
0.1 1 10
VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure8. CapacitancevsDrain
to Source Voltage
20
6
5
4
3 TJ = 25oC
2
TJ = 125oC
1
0.01
0.1 1
tAV, TIME IN AVALANCHE(ms)
Figure9. UnclampedInductive
Switching Capability
10
20
10
100us
1 1ms
OPERATION IN THIS
AREA MAY BE
0.1 LIMITED BY rDS(on)
0.01
0.1
SINGLE PULSE
TJ = MAX RATED
TA = 25OC
1 10
10ms
100ms
1s
10s
DC
60
VDS, DRAIN to SOURCE VOLTAGE (V)
Figure 10. Forward Bias Safe
Operating Area
100
VGS = 10V
10
FOR TEMPERATURES
ABOVE 25oC DERATE PEAK
CURRENT AS FOLLOWS:
I = I25
1----5---0-1---2-–--5---T---A---
TA = 25oC
1
0.510-4
SINGLE PULSE
10-3
10-2
10-1
100
101
t, PULSE WIDTH (s)
Figure 11. Single Pulse Maximum Power Dissipation
102
103
FDMC6890NZ Rev.C
5 www.fairchildsemi.com
5 Page 
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.
ACEx™
ActiveArray™
Bottomless™
FACT Quiet Series™
GlobalOptoisolator™
GTO™
OCX™
OCXPro™
OPTOLOGIC®
SILENT SWITCHER®
SMART START™
SPM™
UniFET™
UltraFET®
VCX™
Build it Now™
CoolFET™
HiSeC™
I2C™
OPTOPLANAR™
PACMAN™
Stealth™
SuperFET™
Wire™
CROSSVOLT™
i-Lo™
POP™
SuperSOT™-3
DOME™
ImpliedDisconnect™ Power247™
SuperSOT™-6
EcoSPARK™
E2CMOS™
EnSigna™
FACT™
FAST®
IntelliMAX™
ISOPLANAR™
LittleFET™
MICROCOUPLER™
MicroFET™
PowerEdge™
PowerSaver™
PowerTrench®
QFET®
QS™
SuperSOT™-8
SyncFET™
TCM™
TinyBoost™
TinyBuck™
FASTr™
MicroPak™
QT Optoelectronics™ TinyPWM™
FPS™
FRFET™
MICROWIRE™
MSX™
Quiet Series™
RapidConfigure™
TinyPower™
TinyLogic®
MSXPro™
RapidConnect™
TINYOPTO™
Across the board. Around the world.™
The Power Franchise®
µSerDes™
ScalarPump™
TruTranslation™
UHC™
Programmable Active Droop™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO
IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE
OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE
RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS,
SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT
THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which,
(a) are intended for surgical implant into the body, or (b) support
or sustain life, or (c) whose failure to perform when properly used
in accordance with instructions for use provided in the labeling,
can be reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life support device
or system whose failure to perform can be reasonably expected
to cause the failure of the life support device or system, or to
affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Advance Information
Preliminary
No Identification Needed
Product Status
Formative or In
Design
First Production
Full Production
Definition
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I20
FDMC6890NZ Rev. C 11 www.fairchildsemi.com
11 Page | ||
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| PDF Descargar | [ Datasheet FDMC6890NZ.PDF ] | |
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