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PDF T16 Data sheet ( Hoja de datos )
| Número de pieza | T16 | |
| Descripción | TRIACS | |
| Fabricantes | ST Microelectronics | |
| Logotipo |  |
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® BTA16, BTB16 and T16 Series
SNUBBERLESS™, LOGIC LEVEL & STANDARD
16A TRIACS
Table 1: Main Features
Symbol
Value
IT(RMS)
16
VDRM/VRRM
600, 700 and 800
IGT (Q1)
10 to 50
Unit
A
V
mA
DESCRIPTION
Available either in through-hole or surface-mount
packages, the BTA16, BTB16 and T16 triac series
is suitable for general purpose AC switching. They
can be used as an ON/OFF function in applica-
tions such as static relays, heating regulation, in-
duction motor starting circuits... or for phase
control operation in light dimmers, motor speed
controllers, ...
The snubberless versions (BTA/BTB...W and T16
series) are specially recommended for use on in-
ductive loads, thanks to their high commutation
performances. By using an internal ceramic pad,
the BTA series provides voltage insulated tab (rat-
ed at 2500VRMS) complying with UL standards
(File ref.: E81734).
A2
G
A1
A2
A1 A2
G
D2PAK
(T16-G)
A2
A1
A2
G
TO-220AB Insulated
(BTA16)
A1
A2
G
TO-220AB
(BTB16)
Table 2: Order Codes
Part Number
BTA16-xxxxxRG
BTB16-xxxxxRG
T16xx-xxxG
Marking
See page table 8 on
page 8
February 2006
REV. 7
1/9
1 page  
BTA16, BTB16 and T16 Series
Figure 7: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width tp < 10 ms
and corresponding value of I2t
Figure 8: Relative variation of gate trigger
current, holding current and latching current
versus junction temperature (typical values)
ITSM(A), I2t (A2s)
3000
dI/dt limitation:
50A/µs
1000
Tj initial=25°C
ITSM
100
0.01
tp(ms)
0.10
I2t
1.00
10.00
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C]
2.5
2.0
IGT
1.5
IH & IL
1.0
0.5
Tj(°C)
0.0
-40 -20 0 20 40 60 80 100 120 140
Figure 9: Relative variation of critical rate of
decrease of main current versus (dV/dt)c
(typical values) (Snubberless & Logic level
types)
Figure 10: Relative variation of critical rate of
decrease of main current versus (dV/dt)c
(typical values) (Standard types)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
2.0
(dI/dt)c [Tj] / (dI/dt)c [Tj specified]
6
1.8 SW
1.6 C
B
1.4
5
4
1.2
1.0
0.8
0.6
0.4
0.1
T1635/CW/BW
3
2
(dV/dt)c (V/µs)
1.0 10.0
1
Tj(°C)
0
100.0
0 25 50 75 100 125
Figure 11: D2PAK Thermal resistance junction to
ambient versus copper surface under tab (printed
circuit board FR4, copper thickness: 35 µm)
Rth(j-a)(°C/W)
80
70
60
50
D2PAK
40
30
20
10
S(cm²)
0
0 4 8 12 16 20 24 28 32 36 40
5/9
5 Page | ||
| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet T16.PDF ] | |
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