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PDF VHM40-06P1 Data sheet ( Hoja de datos )
| Número de pieza | VHM40-06P1 | |
| Descripción | CoolMOS Power MOSFET | |
| Fabricantes | IXYS Corporation | |
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VHM40-06P1
CoolMOS Power MOSFET
in ECO-PAC 2
N-Channel Enhancement Mode
Low RDSon, High VDSS MOSFET
Package with Electrically Isolated Base
Preliminary data sheet
MOSFET
Symbol
VDSS
VGS
ID25
ID90
dv/dt
EAS
EAR
Conditions
TVJ = 25°C to 150°C
TC = 25°C
TC = 90°C
VDS < VDSS; IF ≤ 50A;diF/dt≤ 200A/µs
TVJ = 150°C
ID = 10 A; L = 36 mH; TC = 25°C
ID = 20 A; L = 5 µH; TC = 25°C
L4
L6
K 12 L 9
NTC
K 13
P 18
R 18
T 18
V 18
X 18
F10
K10
Maximum Ratings
600 V
±20 V
38 A
25 A
6 V/ns
1.8 J
1 mJ
Symbol
Conditions
Characteristic Values
(TVJ = 25°C, unless otherwise specified)
min. typ. max.
RDSon
VGS = 10 V; ID = ID90
VGSth
VDS = 20 V; ID = 3 mA;
3.5
IDSS VDS = VDSS; VGS = 0 V; TVJ = 25°C
TVJ = 125°C
60
IGSS VGS = ±20 V; VDS = 0 V
Q
g
Qgs VGS= 10 V; VDS = 350 V; ID = 50 A
Qgd
220
55
125
t
d(on)
tr
t
d(off)
tf
V = 10 V; V = 380 V;
GS DS
ID = 25 A; RG = 1.8 Ω
30
95
100
10
VF (reverse conduction) IF = 20 A; VGS = 0 V
0.9
RthJC
per MOSFET
Data according to IEC 60747 refer to a single diode or transistor unless otherwise stated
70 mΩ
5.5 V
25 µA
µA
100 nA
nC
nC
nC
ns
ns
ns
ns
1.1 V
0.45 K/W
ID25 = 38 A
VDSS = 600 V
RDSon = 70 mΩ
1)
Pin arangement see outlines
Features
● ECO-PAC 2 with DCB Base
- Electrical isolation towards the heatsink
- Low coupling capacitance to the heatsink for
reduced EMI
- High power dissipation
- High temperature cycling capability
of chip on DCB
- solderable pins for DCB mounting
● fast CoolMOS power MOSFET - 2nd generation
- High blocking capability
- Low on resistance
- Avalanche rated for unclamped
inductive switching (UIS)
- Low thermal resistance
due to reduced chip thickness
● Enhanced total power density
Applications
● Switched mode power supplies (SMPS)
● Uninterruptible power supplies (UPS)
● Power factor correction (PFC)
● Welding
● Inductive heating
1) CoolMOS is a trademark of Infineon Technologies AG.
IXYS reserves the right to change limits, test conditions and dimensions.
© 2002 IXYS All rights reserved
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