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PDF KF2002-GF41A Data sheet ( Hoja de datos )

Número de pieza KF2002-GF41A
Descripción Compact high speed thick film thermal printhead
Fabricantes ROHM Semiconductor 
Logotipo ROHM Semiconductor Logotipo



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Printheads
Compact high speed thick film
thermal printhead (8dots / mm)
KF2002-GF41A
KF2002-GF41A
Using its expertise in LSI technology, ROHM has developed new high density driver chips for use in the KF2002-GF41A .
Capable of being employed for both thermal and thermal transfer printing, with a print speed of 200mm/s, the resulting
printheads are the fastest in their class. The high-speed and high-density printing answers the needs of ATM, kiosk and
ticket printing devices, which are increasingly being called upon to produce graphical output.
!Applications
Label printers
Ticket printers
POS printers
ATM printers
KIOSK printers
Terminal printers
!Features
1) The use of a special partial glaze and the latest heating element structure, along with new high-density driver chips that
can accept big current, has allowed ROHM to achieve print speeds of 200mm/s, the fastest in its class.
2) One rank resistance value of 650Ω ± 3% eliminates the inconvenience of rank selection.
3) 2-inch, 3-inch and 4-inch series are available.
!External dimensions (Units : mm)
65
56 (Effective Print Width)
Dot #448
Dot #1
Max.1.7
(5.1)
4±0.2
No.28
Connector
No.1
55±0.2
5±0.2
Exposed Conductor Side
2-M3 (Effective Depth 3)
1/4

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KF2002-GF41A pdf
Appendix
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of
whatsoever nature in the event of any such infringement, or arising from or connected with or related
to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or
otherwise dispose of the same, no express or implied right or license to practice or commercially
exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document use silicon as a basic material.
Products listed in this document are no antiradiation design.
The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level of
reliability and the malfunction of with would directly endanger human life (such as medical instruments,
transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other
safety devices), please be sure to consult with our sales representative in advance.
About Export Control Order in Japan
Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control
Order in Japan.
In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)
on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.
Appendix1-Rev1.0

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