DataSheet.es 908E626 Hoja de datos PDF


PDF 908E626 Datasheet ( Hoja de datos )

Número de pieza 908E626
Descripción Integrated Stepper Motor Driver
Fabricantes Freescale Semiconductor 
Logotipo Freescale Semiconductor Logotipo
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908E626 datasheet

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908E626 pdf
MAXIMUM RATINGS
MAXIMUM RATINGS
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted. Exceeding limits on any terminal may cause permanent damage
to the device.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltage
Analog Chip Supply Voltage under Normal Operation (Steady-
State)
Analog Chip Supply Voltage under Transient Conditions (1)
Microcontroller Chip Supply Voltage
VSUP(SS)
VSUP(PK)
VDD
-0.3 to 28
-0.3 to 40
-0.3 to 6.0
V
Input Terminal Voltage
Analog Chip
Microcontroller Chip
Maximum Microcontroller Current per Terminal
All Terminals Except VDD, VSS, PTA0:PTA6, PTC0:PTC1
Terminals PTA0:PTA6, PTC0:PTC1
Maximum Microcontroller VSS Output Current
VIN (ANALOG)
VIN (MCU)
IPIN(1)
IPIN(2)
IMVSS
-0.3 to 5.5
VSS-0.3 to VDD+0.3
±15
± 25
100
V
mA
mA
Maximum Microcontroller VDD Input Current
IMVDD
100 mA
LIN Supply Voltage
Normal Operation (Steady-State)
Transient Conditions (1)
ESD Voltage
Human Body Model (2)
Machine Model (3)
Charge Device Model (4)
VBUS(SS)
VBUS(DYNAMIC)
VESD1
VESD2
VESD3
-18 to 28
40
± 3000
± 150
± 500
V
V
THERMAL RATINGS
Storage Temperature
Operating Case Temperature (5)
TSTG
TC
-40 to 150
-40 to 115
°C
°C
Operating Junction Temperature(6)
TJ
-40 to 135
°C
Peak Package Reflow Temperature During Solder Mounting (7)
TSOLDER
245
°C
Notes
1. Transient capability for pulses with a time of t < 0.5 sec.
2. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ).
3. ESD2 testing is performed in accordance with the Machine Model (CZAP =200 pF, RZAP = 0 ).
4. ESD3 testing is performed in accordance with Charge Device Model, robotic (CZAP =4.0 pF).
5. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
6. The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation on the analog die. The analog die temperature must not exceed 150°C under these conditions
7. Terminal soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Analog Integrated Circuit Device Data
Freescale Semiconductor
908E626
5

5 Page

908E626 arduino
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
All characteristics are for the analog chip only. Please refer to the 68HC908EY16 datasheet for characteristics of the
microcontroller chip. Characteristics noted under conditions 9.0 V VSUP 16 V, -40°C TJ 135°C unless otherwise noted.
Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max Unit
LIN PHYSICAL LAYER
Propagation Delay (11), (12)
TXD LOW to LIN LOW
TXD HIGH to LIN HIGH
LIN LOW to RXD LOW
LIN HIGH to RXD HIGH
TXD Symmetry
RXD Symmetry
t TXD-LIN-LOW
t TXD-LIN-HIGH
t LIN-RXD-LOW
t LIN-RXD-HIGH
t TXD-SYM
t RXD-SYM
- 2.0
- 2.0
4.0
4.0
µs
6.0
6.0
8.0
8.0
2.0
2.0
Output Falling Edge Slew Rate (11), (13)
80% to 20%
SRF V/µs
-1.0 -2.0 -3.0
Output Rising Edge Slew Rate (11), (13)
20% to 80%, RBUS > 1.0 k, CBUS < 10 nF
SRR
V/µs
1.0 2.0 3.0
LIN Rise/Fall Slew Rate Symmetry (11), (13)
SRS -2.0 –
2.0 µs
AUTONOMOUS WATCHDOG (AWD)
AWD Oscillator Period
AWD Period Low = 512 tOSC
tOSC – 40 – µs
t AWDPH
16
22
28 ms
AWD Period High = 256 tOSC
t AWDPL
8.0
11
14 ms
Notes
11. All LIN characteristics are for initial LIN slew rate selection (20 kbaud) (SRS0:SRS1= 00).
12. See Figure 4, page 12.
13. See Figure 5, page 12.
908E626
10
Analog Integrated Circuit Device Data
Freescale Semiconductor

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