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PDF 908E626 Datasheet ( Hoja de datos )

Número de pieza 908E626
Descripción Integrated Stepper Motor Driver
Fabricantes Freescale Semiconductor 
Logotipo Freescale Semiconductor Logotipo

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908E626 Hoja de datos, Descripción, Manual
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Freescale Semiconductor
Technical Data
Integrated Stepper Motor Driver
with Embedded MCU and LIN
Serial Communication
Document order number: MM908E626
Rev 3.0, 12/2005
908E626
The 908E626 is an integrated single-package solution that includes
a high-performance HC08 microcontroller with a SMARTMOSTM
analog control IC. The HC08 includes flash memory, a timer, enhanced
serial communications interface (ESCI), an analog-to-digital converter
(ADC), serial peripheral interface (SPI) (only internal), and an internal
clock generator (ICG) module. The analog control die provides fully
protected H-Bridge outputs, voltage regulator, autonomous watchdog,
and local interconnect network (LIN) physical layer.
The single-package solution, together with LIN, provides optimal
application performance adjustments and space-saving PCB design. It
is well suited for the control of automotive stepper applications like
climate control and light-levelling.
STEPPER MOTOR DRIVER
WITH EMBEDDED MCU AND LIN
Features
• High-Performance M68HC08EY16 Core
• 16 K Bytes of On-Chip Flash Memory
• 512 Bytes of RAM
• Internal Clock Generation Module
• Two 16-Bit, 2-Channel Timers
• 10-Bit Analog-to-Digital Converter
• Four Low RDS(ON) Half-Bridge Outputs
• 13 Microcontroller I/Os
DWB SUFFIX
98ARL105910
54-TERMINAL SOICWB-EP
Device
MM908E626AVDWB
Temperature
Range (TA)
-40°C to 115°C
908E626 Simplified Application Diagram
Package
54 SOIC
WB-EP
LIN
VREFH
VDDA
EVDD
VDD
908E626
VSUP[1:3]
VREFL
VSSA
EVSS
VSS
RST
RST_A
IRQ
IRQ_A
SS
PTB1/AD1
RXD
PTE1/RXD
PTD1/TACH1
FGEN
BEMF
PTD0/TACH0/BEMF
GND[1:2] EP
HB1
HB2
HB3
HB4
HVDD
Port A I/Os
Port B I/Os
Port C I/Os
Bipolar
N
S
Step
Motor
Switchable Internal
VDD Output
Microcontroller
Ports
Figure 1. 908E626 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2005. All rights reserved.

1 page

908E626 pdf
MAXIMUM RATINGS
MAXIMUM RATINGS
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted. Exceeding limits on any terminal may cause permanent damage
to the device.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltage
Analog Chip Supply Voltage under Normal Operation (Steady-
State)
Analog Chip Supply Voltage under Transient Conditions (1)
Microcontroller Chip Supply Voltage
VSUP(SS)
VSUP(PK)
VDD
-0.3 to 28
-0.3 to 40
-0.3 to 6.0
V
Input Terminal Voltage
Analog Chip
Microcontroller Chip
Maximum Microcontroller Current per Terminal
All Terminals Except VDD, VSS, PTA0:PTA6, PTC0:PTC1
Terminals PTA0:PTA6, PTC0:PTC1
Maximum Microcontroller VSS Output Current
VIN (ANALOG)
VIN (MCU)
IPIN(1)
IPIN(2)
IMVSS
-0.3 to 5.5
VSS-0.3 to VDD+0.3
±15
± 25
100
V
mA
mA
Maximum Microcontroller VDD Input Current
IMVDD
100 mA
LIN Supply Voltage
Normal Operation (Steady-State)
Transient Conditions (1)
ESD Voltage
Human Body Model (2)
Machine Model (3)
Charge Device Model (4)
VBUS(SS)
VBUS(DYNAMIC)
VESD1
VESD2
VESD3
-18 to 28
40
± 3000
± 150
± 500
V
V
THERMAL RATINGS
Storage Temperature
Operating Case Temperature (5)
TSTG
TC
-40 to 150
-40 to 115
°C
°C
Operating Junction Temperature(6)
TJ
-40 to 135
°C
Peak Package Reflow Temperature During Solder Mounting (7)
TSOLDER
245
°C
Notes
1. Transient capability for pulses with a time of t < 0.5 sec.
2. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ).
3. ESD2 testing is performed in accordance with the Machine Model (CZAP =200 pF, RZAP = 0 ).
4. ESD3 testing is performed in accordance with Charge Device Model, robotic (CZAP =4.0 pF).
5. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
6. The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation on the analog die. The analog die temperature must not exceed 150°C under these conditions
7. Terminal soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Analog Integrated Circuit Device Data
Freescale Semiconductor
908E626
5

5 Page

908E626 arduino
MICROCONTROLLER PARAMETRICS
MICROCONTROLLER PARAMETRICS
MICROCONTROLLER
For a detailed microcontroller description, refer to the MC68HC908EY16 datasheet.
Core
Module
Description
High-Performance HC08 Core with a Maximum Internal Bus Frequency of 8.0 MHz
Timer
Two 16-Bit Timers with Two Channels (TIM A and TIM B)
Flash
16 K Bytes
RAM
512 Bytes
ADC
10-Bit Analog-to-Digital Converter
SPI SPI Module
ESCI
Standard Serial Communication Interface (SCI) Module
Bit-Time Measurement
Arbitration
Prescaler with Fine Baud-Rate Adjustment
ICG Internal Clock Generation Module
BEMF Counter
Special Counter for SMARTMOS BEMF Output
Analog Integrated Circuit Device Data
Freescale Semiconductor
908E626
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