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PDF BC01B Data sheet ( Hoja de datos )
| Número de pieza | BC01B | |
| Descripción | Single Chip Bluetooth Device | |
| Fabricantes | ETC | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de BC01B (archivo pdf) en la parte inferior de esta página. Total 15 Páginas | ||
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Product Data Sheet
Device Features
Compliant to Bluetooth specificatioTnM V1.1
Small footprint in 8mm x 8mm 81-ball BGA
Fully integrated RF block with no external
adjustments or trim
USB V1.1 compliant
Qualified Bluetooth firmware included
Extensive built-in-self-test to minimise end
product final test time
RF reference designs available
Low power consumption/optimisation
Support for up to 7 slaves
General Description
BlueCore01bTM is a single chip radio and baseband IC
for BluetoothTM 2.4GHz radios, and is implemented in
CMOS technology.
When used with external flash containing the CSR
Bluetooth software stack, it provides a fully compliant
Bluetooth system for data and voice communications.
RAM
SPI
BlueCoreTM01b
Single Chip Bluetooth Device
Product Data Sheet For:
BC01b-USB
(USB and UART version)
(BGA Packaging)
BC01b-URT
(UART only version)
(BGA Packaging)
BC01bv-USB
(USB and UART version)
(VFBGA Packaging)
BC01bv-URT
(UART only version)
(VFBGA Packaging)
Applications
Laptop and desktop PCs
Mobile Phones
Cordless Headsets
Personal Digital Assistants (PDAs)
Computer Accessories (Compact Flash,
PCMCIA and SD cards)
Domestic and industrial appliances
RF IN
2.4GHz
Radio
RF OUT
DSP
µP
UART/USB
The design is optimised to require very few external
I/O
RF components to facilitate rapid design of the applica-
tion printed wiring board, and therefore the fastest pos-
PIO sible time to market and lowest overall cost.
A low intermediate frequency receiver is utilised to
allow on-chip channel filtering. All hardware is fully
PCM compliant with the Bluetooth specification.
The device operates from a regulated supply in the
range 2.7V to 3.3V and is available in an 81-ball BGA
package.
XTAL
EXTERNAL
FLASH
Figure 1: BlueCore01b Block Diagram
bc01b-ds-003d
Production Information
1 page  
Product Data Sheet
Device Terminal Functions
Terminal Name
Radio
RF_IN
TX_A
TX_B
PIO[0] / RXEN
PIO[1] / TXEN
TX_PWR
Synthesiser and Oscillator
XTAL_IN
XTAL_OUT
LOOP_FILTER
External Memory Port
A[17:0]
D[15:0]
Pad Type
-
-
-
Bidirectional
pulled down
Bidirectional
pulled down
Current DAC
-
-
-
CMOS output
Bidirectional
WEB
CMOS output
REB
CMOS output
CSB
CMOS output
PCM Interface
PCM_SYNC
Bidirectional
pulled down
PCM_CLK
Bidirectional
pulled down
PCM_IN
PCM_OUT
CMOS input
pulled down
CMOS output
Note:
(1) See Address and Data Bus tables at the end of this section.
Device Terminal Functions
Ball Description
E1 Receiver RF input
G1 Transmitter RF output
F1 Transmitter RF output (complement of TX_A)
D2
Control output for external switch or LNA
(if fitted)
F3 Control output for external switch or PA (if fitted)
D1 Current DAC output to set external PA level
J4 Sense for crystal or external clock input
J3 Drive for crystal
H2 Synthesiser external loop filter
(1) Address bus for external memory
(1) Data bus for external memory
A7 Write Enable for external memory (active low)
G9 Read Enable for external memory (active low)
F9 Chip Select for external memory (active low)
B5 Synchronous data strobe
D5 Synchronous data clock
C5 Synchronous 8kss-1 data input
E3 Synchronous 8kss-1 data output
bc01b-ds-003d
Production Information
Page 5 of 15
5 Page 
Product Data Sheet
Package Dimensions
Package Dimensions
Top View
Bottom View
PIN A1
A
B
C
D
E
F
G
H
J
D D1
123 4 5 6 7 8 9
A
B
C
D
E
F
G
H
J
9 8 7 65 4 3 2 1
DETAIL K
SEE DETAIL K
(A3)
A
(A2)
A1
DIM MIN
MAX
A 1.1
1.50
A1 0.25
0.35
A2 0.36 REF
A3 0.8 REF
b 0.35
0.45
D 8 BSC
E 8 BSC
e 0.8 BSC
D1 6.4 BSC
E1 6.4 BSC
NOTES
1 DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER PARALLEL TO DATUM
PLANE Z.
2 DATUM Z IS DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
3 PARALLELISM MEASUREMENT SHALL EXCLUDE
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
BC01b-USB/URT BGA 81 BALLS
8X8X1 PKG PITCH POD
(JEDEC MO-225-A)
UNIT
MM
DIM MIN
MAX
A 0.8
1
A1 0.25
0.35
A2 0.22 REF
A3 0.45 REF
b 0.35
0.45
D 8 BSC
E 8 BSC
e 0.8 BSC
D1 6.4 BSC
E1 6.4 BSC
NOTES
1 DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER PARALLEL TO DATUM
PLANE Z.
2 DATUM Z IS DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
3 PARALLELISM MEASUREMENT SHALL EXCLUDE
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
BC01bv-USB/URT VFBGA 81 BALLS
8X8X1 PKG PITCH POD
(JEDEC MO-225-A)
UNIT
MM
Z2
SEATING
PLANE
PIN A1
8X e
81X b 1
3
0.1 Z
0.1 Z
bc01b-ds-003d
Figure 4: BlueCore01b package dimensions
Production Information
Page 11 of 15
11 Page | ||
| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet BC01B.PDF ] | |
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