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PDF NUF6105FC Data sheet ( Hoja de datos )
| Número de pieza | NUF6105FC | |
| Descripción | 6 Channel EMI Pi-Filter Array | |
| Fabricantes | ON Semiconductor | |
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NUF6105FC
6 Channel EMI Pi−Filter
Array with ESD Protection
This device is a 6 channel EMI filter array for data lines. Greater
than −35 dB attenuation is obtained at frequencies from 800 MHz to
2.2 GHz. It also offers ESD protection − clamping transients from
static discharges to protect delicate data line circuitry.
Features
• EMI Filtering and ESD Protection for Data Lines
• Integration of 30 Discretes Offers Cost and Space Savings
• Exceeds IEC61000−4−2 (Level 4) Specifications
• Low Profile Flip−Chip Packaging
• MSL 1
• Pb−Free Package is Available
Typical Applications
• EMI Filtering and ESD Protection for Data Lines
• Cell Phones
• Handheld Portables
• Notebook Computers
• MP3 Players
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Value
Unit
ESD Discharge IEC61000−4−2,
− Air Discharge
− Contact Discharge
Human Body Model
VPP
kV
30
30
16
DC Power per Resistor
PR 100 mW
DC Power per Package
PT 600 mW
Junction Temperature
TJ 150 °C
Operating Temperature Range
Top
−40 to +85
°C
Storage Temperature Range
Tstg
−55 to +150
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 3
1
A1
D1
A2
D3
A3
D5
A4
D7
A5
D9
A6
D11
http://onsemi.com
CIRCUIT DESCRIPTION
R1
C1 C2
D2
C1
R2
C3 C4
R3
C5 C6
C2
D4
B1
C3
D6
R4
C7 C8
R5
C9 C10
C4
D8
B2
C5
D10
R6
C11 C12
C6
D12
B3
FLIP−CHIP
CASE 499D
PLASTIC
A1
MARKING DIAGRAM
NUF6105AYWWG
G
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NUF6105FCT1 Flip−Chip 3000/Tape & Reel
NUF6105FCT1G Flip−Chip 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
NUF6105FC/D
1 page  
NUF6105FC
PACKAGE DIMENSIONS
15 PIN FLIPCHIP CSP
CASE 499D−01
ISSUE O
4X
0.10 C
TERMINAL A1
LOCATOR
ÈÈÈÈ
D
AB
E
0.10 C
0.05 C
A1
A2 A C
SEATING
PLANE
D1
e /2
e
C
15 X b
B
0.05 C A B A
0.03 C
12345 6
E1
e1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM MIN MAX
A −−− 0.700
A1 0.210 0.270
A2 0.380 0.430
D 2.960 BSC
E 1.330 BSC
b 0.290 0.340
e 0.500 BSC
e1 0.435 BSC
D1 2.500 BSC
E1 0.870 BSC
http://onsemi.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet NUF6105FC.PDF ] | |
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