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PDF NUF4105FC Data sheet ( Hoja de datos )

Número de pieza NUF4105FC
Descripción 4 Channel EMI Pi-Filter Array
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NUF4105FC
4 Channel EMI Pi−Filter
Array with ESD Protection
+4 ESD Diodes
This device is a 4 channel EMI filter array for data lines. Greater
than −40 dB attenuation is obtained at frequencies from 800 MHz to
2.2 GHz. It also offers ESD protection − clamping transients from
static discharges to protect delicate data line circuitry. It is offered in
300 mm and 350 mm solder spheres.
Features
EMI Filtering and ESD Protection for Data Lines
Integration of 26 Discretes Offers Cost and Space Savings
Exceeds IEC61000−4−2 (Level 4) Specifications
Low Profile Flip−Chip Packaging
MSL 1
300 mm Solder Spheres (NUF4105), Case 499D
Typical Applications
EMI Filtering and ESD Protection for Data Lines
Cell Phones
Handheld Portables
Notebook Computers
MP3 Players
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Value
Unit
ESD Discharge IEC61000−4−2,
− Air Discharge
− Contact Discharge
Human Body Model
VPP
kV
30
30
16
DC Power per Resistor
PR 100 mW
DC Power per Package
PT 400 mW
Junction Temperature
TJ 150 °C
Operating Temperature Range
Top
−40 to +85
°C
Storage Temperature Range
Tstg
−55 to +150
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
http://onsemi.com
A1
D1
A2
D3
A3
D5
A4
D7
A5
D9
CIRCUIT DESCRIPTION
C1 C2
D2
C1
R2
C3 C4
R3
C5 C6
C2
D4
B1
C3
D6
R4
C7 C8
R5
C9 C10
C4
D8
B2
C5
D10
A6
D11
C11 C12
C6
D12
B3
A1 FLIP−CHIP
CASE 499D
300 mm Bumps
DEVICE MARKING
ON
NUF4105YYWW
YY = Year
WW = Work Week
ORDERING INFORMATION
Device
Package
Shipping
NUF4105FCT1 Flip−Chip 3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2004
November, 2004 − Rev. 1
1
Publication Order Number:
NUF4105FC/D

1 page




NUF4105FC pdf
4X
0.10 C
TERMINAL A1
LOCATOR
ÈÈÈÈ
NUF4105FC
PACKAGE DIMENSIONS
15 PIN FLIP−CHIP CSP
CASE 499D−01
ISSUE O
D AB
E
0.10 C
0.05 C
A1
A2 A C
SEATING
PLANE
D1
e /2
e
C
15 X b
B
0.05 C A B A
0.03 C
12345 6
E1
e1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM MIN MAX
A −−− 0.700
A1 0.210 0.270
A2 0.380 0.430
D 2.960 BSC
E 1.330 BSC
b 0.290 0.340
e 0.500 BSC
e1 0.435 BSC
D1 2.500 BSC
E1 0.870 BSC
http://onsemi.com
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