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PDF NCP1423 Data sheet ( Hoja de datos )

Número de pieza NCP1423
Descripción 400mA Sync-Rect PFM Step-Up DC-DC Converter
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No Preview Available ! NCP1423 Hoja de datos, Descripción, Manual

NCP1423, SCV1423
400 mA Sync-Rect PFM
Step-Up DC-DC Converter
with True-Cutoff and
Ring-Killer
NCP1423 is a monolithic micropower high frequency step−up
switching converter IC specially designed for battery operated
hand−held electronic products. It integrates Synchronous Rectifier for
improving efficiency as well as eliminating the external Schottky
Diode. High switching frequency (up to 600 kHz) allows low profile
inductor and output capacitor being used. When the IC is disabled,
internal conduction path from LX or BAT to OUT is blocked, OUT pin
is isolated from the battery. This achieves True−Cutoff. Ring−Killer is
also integrated to eliminate the high frequency ringing in discontinuous
conduction mode. Low−Battery Detector, Cycle−by−Cycle Current
Limit, Overvoltage Protection and Thermal Shutdown provide
value−added features for various battery operated application. With all
of these functions ON, the quiescent supply current is only 9.0 mA. This
device is available in compact Micro10 package.
Features
High Efficiency: 92% for 3.3 V Output@ 400 mA from 2.5 V Input
87% for 1.8 V Output@ 70 mA from 1.2 V Input
High Switching Frequency, up to 600 kHz (not hitting current limit)
Low Quiescent Current of 9.0 mA
Low Battery Detector
0.8 V Startup
External Adjustable Output Voltage
±1.5% Output Voltage Accuracy
Ring−Killer for Discontinuous Conduction Mode
Thermal Shutdown
1.2 A Cycle−by−Cycle Current Limit
Output Current up to 400 mA @ VOUT = 3.3 V,
200 mA @ VOUT = 1.8 V
Overvoltage Protection
Low Profile and Minimum External Part
Open Drain Low−Battery Detector Output
Compact Micro10 Package
SCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
Typical Applications
Wireless Optical Mouse
Wireless Headsets
Internet Audio Players
Personal Digital Assistants (PDAs)
Hand−held Instruments
Conversion from one/two NiMH or NiCd cells to 1.8 V / 3.3 V
http://onsemi.com
MARKING
DIAGRAM
Micro10
DM SUFFIX
CASE 846B
XXX
AYWG
G
XXX = DAR (NCP1423)
= GEN (SCV1423)
A = Assembly Location
Y = Year
W = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
EN 1
REF 2
FB 3
GND 4
OUT 5
Micro10
10 LBO
9 LBI
8 ADEN
7 LX
6 BAT
(Top View)
ORDERING INFORMATION
Device
Package
Shipping
NCP1423DMR2G Micro10 4000 Tape & Reel
(Pb−Free)
SCV1423DMR2G Micro10 4000 Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
October, 2014 − Rev. 8
1
Publication Order Number:
NCP1423/D

1 page




NCP1423 pdf
NCP1423, SCV1423
TYPICAL OPERATING CHARACTERISTICS
1.27
1.25
1.23
CREF = 0.1 mF
VIN = 1.2 V
VOUT = 3.3 V
TA = 25°C
1.25
1.23
1.21
1.21 1.19
1.19
1.17
1.15
1
10 100
ILOAD, OUTPUT CURRENT (mA)
1000
Figure 3. Reference Voltage vs. Output Current
1.210
1.205
1.200
1.195
1.190
1.185
1.180
−50
VOUT = 3.3 V
CREF = 0.1 mF
IREF = 0 mA
−25 0 25 50 75
TA, AMBIENT TEMPERATURE (°C)
100
Figure 5. Reference Voltage vs. Temperature
1.17
1.15
1.13
1.5
CREF = 0.1 mF
IREF = 0 mA
TA = 25°C
2 2.5 3 3.5 4 4.5 5
VOUT, VOLTAGE AT OUT PIN, (V)
Figure 4. Reference Voltage vs. Voltage at OUT Pin
1.0
VOUT = 3.3 V
0.8
0.6
P−FET (M2)
0.4
N−FET (M1)
0.2
0.0
−40 −20
0
20 40 60 80 100
TA, AMBIENT TEMPERATURE, (°C)
Figure 6. Switch ON Resistance vs. Temperature
0.56
0.54
18
VOUT = 3.3 V
15
0.52 12
0.50 9
0.48 6
0.46
0.44
−50
TA = 25°C
−25 0 25 50 75
TA, AMBIENT TEMPERATURE (°C)
100
Figure 7. Low Battery Detect Voltage vs.
Temperature
3
0−50 −25
0
25 50 75 100
TA, AMBIENT TEMPERATURE (°C)
Figure 8. Operation Current vs. Temperature
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NCP1423 arduino
NCP1423, SCV1423
IC is enabled again, and the internal circuit typically
consumes 9 mA of current from the OUT pin during normal
operation.
comparator output turns off the 50 W low side switch. When
this occurs, Pin 10 becomes high impedance and its voltage
is pulled high again.
Low−Battery Detection
A comparator with 15 mV hysteresis is applied to perform
the low−battery detection function. When Pin 9 (LBI) is at
a voltage (defined by a resistor divider from the battery
voltage) lower than the internal reference voltage of 0.5 V,
the comparator output turns on a 50 W low side switch. It
pulls down the voltage at Pin 10 (LBO) which requires a
hundred to a thousand kW of external pull−high resistance.
If the Pin 9 voltage is higher than 0.5 V+15 mV, the
Auto Discharge
Auto discharge function is using for ensure the output
voltage status after the power down occur. This function is
using for communication with a digital signal. When auto
discharge function is enabled, the ADEN is set high; the
output capacitor will be discharged after the device is
shutdown. The capacitors connected to the output are
discharged by an integrated switch of 100 W. The residual
voltage on VOUT will be less than 0.4 V after auto discharge.
APPLICATIONS INFORMATION
Output Voltage Setting
A typical application circuit is shown in Figure 1, The
output voltage of the converter is determined by the external
feedback network comprised of R1 and R2 and the
relationship is given by:
ǒ ǓVOUT + 0.5 V
1
)
R1
R2
where R1 and R2 are the upper and lower feedback resistors,
respectively.
Low Battery Detect Level Setting
The Low Battery Detect Voltage of the converter is
determined by the external divider network comprised of R3
and R4 and the relationship is given by:
ǒ ǓVLBI + 0.5 V
1
)
R3
R4
where R3 and R4 are the upper and lower divider resistors
respectively.
Inductor Selection
The NCP1423 is tested to produce optimum performance
with a 5.6 mH inductor at VIN = 1.3 V, VOUT = 3.3 V,
supplying an output current up to 200 mA. For other input
/ output requirements, inductance in the range 3 mH to 10 mH
can be used according to end application specifications.
Selecting an inductor is a compromise between output
current capability, inductor saturation limit and tolerable
output voltage ripple. Low inductance values can supply
higher output current but also increase the ripple at output
and decrease efficiency. On the other hand, high inductance
values can improve output ripple and efficiency; however,
it also limited the output current capability at the same time.
Another parameter of the inductor is its DC resistance.
This resistance can introduce unwanted power loss and
reduce overall efficiency. The basic rule is to select an
inductor with lowest DC resistance within the board space
limitation of the end application.
Capacitors Selection
In all switching mode boost converter applications, both
the input and output terminals see impulsive voltage /
current waveforms. The currents flowing into and out of the
capacitors multiply with the Equivalent Series Resistance
(ESR) of the capacitor to produce ripple voltage at the
terminals. During the Syn−Rect switch−off cycle, the
charges stored in the output capacitor are used to sustain the
output load current. Load current at this period and the ESR
combined and reflect as ripple at the output terminals. For all
cases, the lower the capacitor ESR, the lower the ripple
voltage at output. As a general guideline, low ESR
capacitors should be used.
PCB Layout Recommendations
Good PCB layout plays an important role in switching
mode power conversion. Careful PCB layout can help to
minimize ground bounce, EMI noise, and unwanted
feedback that can affect the performance of the converter.
Hints suggested below can be used as a guideline in most
situations.
Grounding
A star−ground connection should be used to connect the
output power return ground, the input power return ground,
and the device power ground together at one point. All
high−current paths must be as short as possible and thick
enough to allow current to flow through and produce
insignificant voltage drop along the path. The feedback
signal path must be separated from the main current path and
sense directly at the anode of the output capacitor.
Components Placement
Power components (i.e. input capacitor, inductor and
output capacitor) must be placed as close together as
possible. All connecting traces must be short, direct and
thick. High current flowing and switching paths must be
kept away from the feedback (FB, Pin 3) terminal to avoid
unwanted injection of noise into the feedback path.
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