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PDF VS6650 Data sheet ( Hoja de datos )
| Número de pieza | VS6650 | |
| Descripción | 1.0 Megapixel SMIA Camera Module | |
| Fabricantes | ST Microelectronics | |
| Logotipo |  |
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VS6650
1.0 Megapixel SMIA Camera Module
DATA BRIEF
FEATURES
■ 1.0 Megapixel resolution (1152H x 864V)
■ SMIA1 1.0 profile 1 compliant imager
■ CCP 2.0 serial video interface
■ Two-wire control port (CCI)
■ On-chip PLL based on 13 MHz system clock
■ Up to 30 frame per second (fps) progressive
scan, with smooth frame rate control
■ Horizontal downscale from 1x to 4.5x in 1/16
steps
■ Operation from 2.4 V analog power supply
■ Low EMI 1.8 V digital and I/O power supply
■ 30 µW power-down consumption
■ 10-bit on-chip ADC
■ Small size 1/3 inch lens fixed focus module
■ Integral EMC shielding
DESCRIPTION
The VS6650 is a 1.0 Megapixel camera module for
use across a range of mobile phone platforms.
The camera module, which is SMIA 1.0 profile 1
compliant, can generate 1.0 Megapixel images up
to 30 fps.
Based on the SMIA architectural concepts, the
VS6650 can be used with or without image pro-
cessor (i.e. STV0976 or STV0984). The module is
suitable for performance-driven camera phones
and cost-driven high volume designs. The embed-
ded horizontal scaler typically enables the realiza-
tion of power-efficient viewfinder that uses host
software processing. For performance driven ap-
plications or when a different video interface is re-
quired, the STV0976 mobile imaging processor
ensures state-of-the-art image reconstruction and
compression at up to 15 fps.
The VS6650 features allow straightforward inte-
gration into mobile phone designs: low EMI video
interface and package/socket shielding, low wire
count (8 total), embedded power management (30
µW power-down) and embedded PLL. A minimal
list of external components is required: supply de-
coupling capacitors, CCI pull-ups and a charge-
pump capacitor.
The VS6650 3-element lens design ensures high
quality image capture while maintaining low mod-
ule height. The overall optical stack, including lens
system, IR filter and sensor optical structures is
developed within ST.
The VS6650 package uses the second generation
of SmOP2 packaging technology. Sensor and lens
are assembled in a fully automated test and focus
process for high volume and low cost production.
This 1.0 Megapixel sensor fits within the SMIA95
form factor (9.5 x 9.5 x 7.6 mm3).
APPLICATIONS
■ Mobile phone
■ PDA
■ Wireless security camera
1.Standard Mobile Imaging Architecture, visit
www.smia-forum.org
Table 1. Order Codes
Part Number
Description
VS6650S02F/T2 SmOP2 SMIA95 22” tape and reel
October 2004
Rev. 1
1/3
1 page | ||
| Páginas | Total 3 Páginas | |
| PDF Descargar | [ Datasheet VS6650.PDF ] | |
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