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PDF BAS16XV2T1 Data sheet ( Hoja de datos )

Número de pieza BAS16XV2T1
Descripción Switching Diode
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BAS16XV2T1
Preferred Device
Switching Diode
High−Speed Switching Applications
Lead Finish: 100% Matte Sn (Tin)
Qualified Reflow Temperature: 260°C
Extremely Small SOD−523 Package
MAXIMUM RATINGS
Rating
Symbol Value
Unit
Continuous Reverse Voltage
VR 75 Vdc
Peak Forward Current
IF 200 mAdc
Peak Forward Surge Current
IFM(surge)
500
mAdc
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not normal
operating conditions) and are not valid simultaneously. If these limits are exceeded,
device functional operation is not implied, damage may occur and reliability may
be affected.
THERMAL CHARACTERISTICS
Characteristic
Symbol Max
Unit
Total Device Dissipation
FR-5 Board (Note 1)
TA = 25°C
Derate above 25°C
PD 200 mW
1.57 mW/°C
Thermal Resistance
Junction−to−Ambient
RθJA
635 °C/W
Junction and Storage Temperature
TJ, Tstg
−55 to
150
°C
1. FR-4 Minimum Pad.
2. 300 mW for 1 in. copper.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol Min Max Unit
OFF CHARACTERISTICS
Reverse Voltage Leakage Current
(VR = 75 Vdc)
(VR = 75 Vdc, TJ = 150°C)
(VR = 25 Vdc, TJ = 150°C)
Reverse Breakdown Voltage
(IBR = 100 mAdc)
Forward Voltage
(IF = 1.0 mAdc)
(IF = 10 mAdc)
(IF = 50 mAdc)
(IF = 150 mAdc)
Diode Capacitance (VR = 0, f = 1.0 MHz)
Forward Recovery Voltage
(IF = 10 mAdc, tr = 20 ns)
Reverse Recovery Time
(IF = IR = 10 mAdc, RL = 50 Ω)
Stored Charge
(IF = 10 mAdc to VR = 5.0 Vdc,
RL = 500 Ω)
IR
V(BR)
VF
CD
VFR
trr
QS
mAdc
− 1.0
− 50
− 30
75 − Vdc
mV
− 715
− 855
− 1000
− 1250
− 2.0 pF
− 1.75 Vdc
− 6.0 ns
− 45 pC
http://onsemi.com
1
CATHODE
2
ANODE
2
1
SOD−523
CASE 502
PLASTIC
MARKING
DIAGRAM
A6 MG
1 G2
A6 = Specific Device Code
M = Month Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
BAS16XV2T1
Package
Shipping
SOD−523 3000/Tape & Reel
BAS16XV2T1G SOD−523 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2005
September, 2005 − Rev. 3
1
Publication Order Number:
BAS16XV2T1/D

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