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PDF SA58631 Data sheet ( Hoja de datos )
| Número de pieza | SA58631 | |
| Descripción | 2W BTL Audio Amplifier | |
| Fabricantes | NXP Semiconductors | |
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SA58631
3 W BTL audio amplifier
Rev. 01 — 8 March 2006
Product data sheet
1. General description
The SA58631 is a one channel audio amplifier in an HVSON8 package. It provides power
output of 3 W with an 8 Ω load at 9 V supply. The internal circuit is comprised of a BTL
(Bridge Tied Load) amplifier with a complementary PNP-NPN output stage and
standby/mute logic. The SA58631 is housed in an 8-pin HVSON package which has an
exposed die attach paddle enabling reduced thermal resistance and increased power
dissipation.
2. Features
s Low junction-to-ambient thermal resistance using exposed die attach paddle
s Gain can be fixed with external resistors from 6 dB to 30 dB
s Standby mode controlled by CMOS-compatible levels
s Low standby current < 10 µA
s No switch-on/switch-off plops
s High power supply ripple rejection: 50 dB minimum
s ElectroStatic Discharge (ESD) protection
s Output short circuit to ground protection
s Thermal shutdown protection
3. Applications
s Professional and amateur mobile radio
s Portable consumer products: toys and games
s Personal computer remote speakers
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Philips Semiconductors
SA58631
3 W BTL audio amplifier
9. Limiting values
Table 4: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
VCC supply voltage
VI input voltage
operating
−0.3
−0.3
IORM
Tstg
Tamb
VP(sc)
Ptot
repetitive peak output current
storage temperature
ambient temperature
short-circuit supply voltage
total power dissipation
non-operating
operating
HVSON8
-
−55
−40
[1] -
-
[1] AC and DC short-circuit safe voltage.
Max
+18
VCC + 0.3
1
+150
+85
10
2.3
Unit
V
V
A
°C
°C
V
W
10. Thermal characteristics
Table 5:
Symbol
Rth(j-a)
Rth(j-sp)
Thermal characteristics
Parameter
thermal resistance from junction to
ambient
thermal resistance from junction to
solder point
Conditions
free air
9.7 cm2 (1.5 in2)
heat spreader
32 cm2 (5 in2)
heat spreader
Typ
80
[1] 32
[1] 28
5
Unit
K/W
K/W
K/W
K/W
[1] Thermal resistance is 28 K/W with DAP soldered to 32 cm2 (5 in2), 35 µm copper (1 ounce copper) heat
spreader.
SA58631_1
Product data sheet
Rev. 01 — 8 March 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
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Philips Semiconductors
SA58631
3 W BTL audio amplifier
3.0
P
(W)
2.0
VCC = 9.0 V
7.5 V
002aac033
1.0 5.0 V
0
0 1.0 2.0 3.0 4.0
Po (W)
Fig 16. Power dissipation versus output power;
RL = 8.0 Ω; Gv = 20 dB; 32 cm2 (5 in2)
heat spreader
1.6
P
(W)
1.2
0.8
VCC = 9.0 V
7.5 V
5.0 V
0.4
002aac034
0
0 1.0 2.0 3.0
Po (W)
Fig 17. Power dissipation versus output power;
RL = 16 Ω; Gv = 20 dB; 32 cm2 (5 in2)
heat spreader
102
THD+N
(%)
101
1
VCC = 5.0 V
7.5 V
9.0 V
002aac035
102
THD+N
(%)
101
1
VCC = 5.0 V
7.5 V
9.0 V
002aac036
10-1
10-1
10-2
10-2
10-1
a. f = 1 kHz; RL = 4 Ω
1 101
Po (W)
10-2
10-2
10-1
b. f = 1 kHz; RL = 8 Ω
102
THD+N
(%)
101
1
VCC = 5.0 V
7.5 V
9.0 V
002aac037
1 101
Po (W)
10-1
10-2
10-2
c. f = 1 kHz; RL = 16 Ω
Fig 18. THD+N versus output power
10-1
1 101
Po (W)
SA58631_1
Product data sheet
Rev. 01 — 8 March 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
11 of 20
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