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PDF EMIF010-COM01F2 Data sheet ( Hoja de datos )

Número de pieza EMIF010-COM01F2
Descripción EMI FILTER INCLUDING ESD PROTECTION
Fabricantes ST Microelectronics 
Logotipo ST Microelectronics Logotipo



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No Preview Available ! EMIF010-COM01F2 Hoja de datos, Descripción, Manual

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®
IPAD™
EMIF10-COM01F2
EMI FILTER
INCLUDING ESD PROTECTION
MAIN PRODUCT CHARACTERISTICS
EMI filtering and ESD protection for:
Computers and printers
Communication systems
Mobile phones
DESCRIPTION
The EMIF10-COM01F2 is a highly integrated
device designed to suppress EMI / RFI noise in all
systems subjected to electromagnetic interfer-
ences. The EMIF10 Flip-Chip packaging means
the package size is equal to the die size.
Additionally, this filter includes an ESD protection
circuitry which prevents the protected device from
destruction when subjected to ESD surges up to
15 kV.
BENEFITS
EMI symmetrical (I/O) low-pass filter
Lead free package
Very low PCB space consuming: < 6mm2
Very thin package: 0.65 mm
High efficiency in ESD suppression on both
input & output pins
High reliability offered by monolithic integration
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2 level 4
15kV (air discharge)
8kV (contact discharge)
Flip-Chip
(25 Bumps)
Table 1: Order Code
Part Number
EMIF010-COM01F2
Marking
FE
Figure 1: Pin Configuration (Ball side)
EDCBA
I5 I4 I3 I2 I1 1
I10 I9 I8 I7 I6 2
GND GND GND GND GND 3
010 09 08 07 06 4
05 04 03 02 01 5
Figure 2: Basic cell configuration
Input
Low-pass Filter
Output
TM: IPAD is a trademark of STMicroelectronics.
April 2005
REV. 2
RI/O = 200
Cline = 45 pF
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EMIF010-COM01F2 pdf
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EMIF10-COM01F2
Figure 10: Ordering Information Scheme
EMIF yy - xxx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip-Chip
x = 1: 500µm, Bump = 315µm
= 2: Leadfree Pitch = 500µm, Bump = 315µm
= 3: Leadfree Pitch = 400µm, Bump = 250µm
Figure 11: FLIP-CHIP Package Mechanical Data
500µm ± 50
315µm ± 50
650µm ± 65
2.42mm ± 50µm
Figure 12: Foot print recommendations
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 315µm copper pad diameter
Figure 13: Marking
Dot, ST logo
xx = marking
z = packaging location
yww = datecode
(y = year
ww = week)
All dimensions in µm
545 400
E
xxz
y ww
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