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PDF S72WS256P Data sheet ( Hoja de datos )
| Número de pieza | S72WS256P | |
| Descripción | based MCP/PoP Products | |
| Fabricantes | SPANSION | |
| Logotipo |  |
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S72WS-P based MCP/PoP Products
1.8 Volt-only x16 Flash Memory and SDRAM on Split Bus
Simultaneous Read/Write, Burst Mode NOR Flash
NAND Flash or NAND Interface ORNAND™ Flash
on Bus 1 Mobile SDRAM on Bus 2
S72WS-P based MCP/PoP Products Cover Sheet
Data Sheet (Advance Information)
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.
Publication Number S72WS-P_00 Revision A Amendment 4 Issue Date May 29, 2006
1 page  
Data Sheet (Advance Information)
2. MCP Block Diagram
2.1 NOR Flash + DRAM Products
A0-Amax
A0-Amax
F-RDY
F-CLK
F-ADV#
F-CE#
F-OE#
F-RST#
F-ACC
F-WP#
F-WE#
RDY
CLK
ADV#
CE#
OE#
RESET#
ACC
WP#
WE#
WS-P
NOR Flash
Memory
DQ0-DQ15
VSS
VSSQ
VCC
VCCQ
D-RAS#
D-CAS#
D-BA0
D-BA1
D-CKE
D-WE#
D-CE#
D-A0 - D-Amax
D-VCC
D-VCCQ
RAS#
CAS#
BA0
BA1
CKE
WE#
CE#
A0-Amax
VCC
VCCQ
DDR
DRAM
MEMORY
CLK
CLK#
DQS0
DQS1
LDQM
UDQM
DQ15-DQ0
VSS
VSSQ
F-DQ15 - F-DQ0
F-VSS
F-VSS Q
F-VCC
F-VCC Q
D-CLK
D-CLK#
D-D QS0
D-D QS1
D-DM0
D-DM1
D-DQ15 - D-DQ0
D-VSS
D-VSSQ
S72WS-P_00_A4 May 29, 2006
S72WS-P based MCP/PoP Products
3
5 Page 
Data Sheet (Advance Information)
4. Ordering Information
The order number is formed by a valid combinations of the following:
S72WS 512 P D0 HF
0 L G0
PACKING TYPE
0 = Tray
2 = 7” Tape and Reel
3 = 13” Tape and Reel
MODEL NUMBER 2
G = 66MHz/133MHz Speed, No Data Flash
H = 66MHz/133MHz Speed, Spansion MS-P as Data Flash
J = 66MHz/133MHz Speed, NAND Type 1 as Data Flash
R = 80MHz/104MHz Speed, No Data Flash
D = 80MHz/133MHz Speed, Spansion MS-P as Data Flash
E = 80MHz/133MHz Speed, NAND Type 1 as Data Flash
MODEL NUMBER 1
L = x16 DDR DRAM Type 5
G = x16 DDR DRAM Type 1
H = x16 DDR DRAM Type 2
1 = x16 SDR DRAM Type 2
PACKAGE DESCRIPTOR
Depends on Character 12. For a more detailed description see Table 4.1.
PACKAGE TYPE & MATERIAL SET
HF = 1.2mm MCP FBGA, Pb-free
KF = 1.2mm POP FBGA, Pb-free
JF = 1.4mm MCP FBGA, Pb-free
DRAM & ORNAND FLASH DENSITY
D0 = 128 Mb DRAM, No Data Flash
EF = 256Mb DRAM, 512Mb NAND Flash
FF = 512Mb DRAM, 512Mb NAND Flash
E0 = 256Mb DRAM, No Data Flash
PROCESS TECHNOLOGY
P = 90 nm, MirrorBitTM Technology
CODE FLASH DENSITY
256 = 256Mb
512 = 512Mb
PRODUCT FAMILY
S72WS Stacked Products (MCP/PoP)
1.8 V NOR Flash and ORNAND Flash on Bus 1 with Mobile DRAM on Bus 2
Character 12
H, J, or G
Table 4.1 Character Position Descriptions (Sheet 1 of 2)
Character 13
0
1
2
3
4
5
6
7
8
9
Package Area
7x9 mm
7x9 mm
8x11.6 mm
8x11.6 mm
9x12 mm
9x12 mm
9x12 mm
11x13 mm
11x13 mm
11x13 mm
Character 14 Description
Package Ball Count
56
80
64
84
84
115
137
84
115
137
Raw Ball Size
0.35 mm
S72WS-P_00_A4 May 29, 2006
S72WS-P based MCP/PoP Products
9
11 Page | ||
| Páginas | Total 17 Páginas | |
| PDF Descargar | [ Datasheet S72WS256P.PDF ] | |
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