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PDF UPS1040E3 Data sheet ( Hoja de datos )

Número de pieza UPS1040E3
Descripción LOW VF Schottky BARRIER RECTIFIER
Fabricantes Microsemi Corporation 
Logotipo Microsemi Corporation Logotipo



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SCOTTSDALE DIVISION
UPS1040e3
10 A LOW VF Schottky BARRIER RECTIFIER
DESCRIPTION
This UPS1040e3 in the Powermite3® package is a high efficiency Schottky rectifier
that is also RoHS compliant offering high current/power capabilities previously
found only in much larger packages. They are ideal for SMD applications that
operate at high frequencies. In addition to its size advantages, the Powermite3®
package includes a full metallic bottom that eliminates the possibility of solder flux
entrapment during assembly and a unique locking tab act as an efficient heat path to
the heat-sink mounting. Its innovative design makes this device ideal for use with
automatic insertion equipment.
IMPORTANT: Forthemostcurrentdata,consultMICROSEMI’s website: http://www.microsemi.com
ABSOLUTE MAXIMUM RATINGS AT 25º C
(UNLESS OTHERWISE SPECIFIED)
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
Non-Repetitive Peak Forward Surge Current
8.3 ms Single half sine wave Superimposed
on Rated Load@ Tc =90ºC
Storage Temperature
Junction Temperature
VRRM
VRWM
VR
V R (RMS)
Io
IFSM
TSTG
TJ
40
28
10
150
-55 to +150
-55 to +150
V
V
A
A
ºC
ºC
THERMAL CHARACTERISTICS
Thermal Resistance
Junction-to-case (bottom)
RθJC
3.2 ºC/ Watt
Junction to ambient (1)
RθJA
65 ºC/ Watt
(1) When mounted on FR-4 PC board using 2 oz copper with recommended minimum foot print
Powermite 3™
KEY FEATURES
ƒ Very low thermal resistance package
ƒ RoHS Compliant with e3 suffix part
number
ƒ Guard-ring-die construction for transient
protection
ƒ Efficient heat path with Integral locking
bottom metal tab
ƒ Low forward voltage
ƒ Full metallic bottom eliminates flux
entrapment
ƒ Compatible with automatic insertion
ƒ Low profile-maximum height of 1mm
ƒ Options for screening in accordance with
MIL-PRF-19500 for JAN, JANTX,
JANTXV, and JANS are available by
adding MQ, MX, MV, or MSP prefixes
respectively to part numbers. For
example, designate MXUPS1040e3 for a
JANTX (consult factory for Tin-Lead
plating).
ƒ Optional 100% avionics screening
available by adding MA prefix for 100%
temperature cycle, thermal impedance
and 24 hours HTRB (consult factory for
Tin-Lead plating)
APPLICATIONS/BENEFITS
ƒ Switching and Regulating Power
Supplies.
ƒ Silicon Schottky (hot carrier) rectifier for
minimal reverse voltage recovery
ƒ Elimination of reverse-recovery
oscillations to reduce need for EMI
filtering
ƒ Charge Pump Circuits
ƒ Reduces reverse recovery loss with low
IRM
ƒ Small foot print
190 X 270 mils (1:1 Actual size)
See mounting pad details on pg 3
MECHANICAL & PACKAGING
CASE: Void-free transfer molded
thermosetting epoxy compound
meeting UL94V-0
FINISH: Annealed matte-Tin plating
over copper and readily solderable per
MIL-STD-750 method 2026 (consult
factory for Tin-Lead plating)
POLARITY: See figure (left)
MARKING: S1040•
WEIGHT: 0.072 gram (approx.)
Package dimension on last page
Tape & Reel option: 16 mm tape per
Standard EIA-481-B, 5000 on 13” reel
Copyright © 2005
6-09-2005 REV D
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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