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Número de pieza | TDA7850 | |
Descripción | 4 x 50W MOSFET Quad Bridge Power Amplifier Plus HSD | |
Fabricantes | ST Microelectronics | |
Logotipo | ||
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TDA7850
4 x 50W MOSFET
Quad bridge power amplifier plus HSD
Features
■ Superior output power capability:
4 x 50W/4Ω Max.
4 x 30W/4Ω @ 14.4V, 1KHz, 10%
4 x 80W/2Ω Max.
4 x 55W/2Ω @ 14.4V, 1KHz, 10%
■ MOSFET Output power stage
■ Excellent 2Ω driving capability
■ HI-FI class distortion
■ Low output noise
■ ST-BY Function
■ Mute function
■ Automute at min. supply voltage detection
■ Low external component count:
– Internally fixed gain (26dB)
– No external compensation
– No bootstrap capacitors
■ On board 0.35A high side driver
Protections:
■ Output short circuit to GND, to Vs, across the
load
■ Very inductive loads
■ Overrating chip temperature with soft thermal
limiter
■ Output DC offset detection
■ Load dump voltage
■ Fortuitous open GND
■ Reversed battery
■ ESD
Flexiwatt25
(Vertical)
Flexiwatt25
(Horizontal)
Description
The TDA7850 is a breakthrough MOSFET
technology class AB audio power amplifier in
Flexiwatt 25 package designed for high power car
radio. The fully complementary P-Channel/N-
Channel output structure allows a rail to rail
output voltage swing, which, combined with high
output current and minimised saturation losses,
sets new power references in the car-radio field,
with unparalleled distortion performances.
The TDA7850 integrates a DC offset detector.
Order codes
Part number
TDA7850
TDA7850H
Package
Flexiwatt25 (Vertical)
Flexiwatt25 (Horizontal)
Packing
Tube
Tube
November 2006
Rev 1
1/14
www.st.com
1
1 page www.DataSheet4U.com
TDA7850
Block diagram and pin description
1 Block diagram and pin description
Figure 1. Block diagram
Vcc1
ST-BY
MUTE
IN1
0.1μF
IN2
0.1μF
IN3
0.1μF
IN4
0.1μF
AC-GND
0.47μF
SVR
47μF
Vcc2
HSD
TAB S-GND
Figure 2. Pin connection (Top view)
470μF
100nF
HSD/VOFF_DET
OUT1+
OUT1-
PW-GND
OUT2+
OUT2-
PW-GND
OUT3+
OUT3-
PW-GND
OUT4+
OUT4-
PW-GND
D94AU158D
TAB
P-GND2
OUT2-
ST-BY
OUT2+
VCC
OUT1-
P-GND1
OUT1+
SVR
IN1
IN2
S-GND
IN4
IN3
AC-GND
OUT3+
P-GND3
OUT3-
VCC
OUT4+
MUTE
OUT4-
P-GND4
HSD
1
25
D94AU159A
Vertical
TAB
P-GND2
OUT2-
ST-BY
OUT2+
VCC
OUT1-
P-GND1
OUT1+
SVR
IN1
IN2
S-GND
IN4
IN3
AC-GND
OUT3+
P-GND3
OUT3-
VCC
OUT4+
MUTE
OUT4-
P-GND4
HSD
1
25
D06AU1655
Horizontal
5/14
5 Page www.DataSheet4U.com
TDA7850
4 Package Information
Package Information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 5. Flexiwatt25 (vertical) mechanical data & package dimensions
DIM.
A
MIN.
4.45
mm
TYP. MAX. MIN.
4.50 4.65 0.175
B 1.80 1.90 2.00 0.070
C 1.40
D 0.75 0.90 1.05 0.029
E 0.37 0.39 0.42 0.014
F (1)
0.57
G 0.80 1.00 1.20 0.031
G1 23.75 24.00 24.25 0.935
H (2) 28.90 29.23 29.30 1.139
H1 17.00
H2 12.80
H3 0.80
L (2) 22.07 22.47 22.87 0.869
L1 18.57 18.97 19.37 0.731
L2 (2) 15.50 15.70 15.90 0.610
L3 7.70 7.85 7.95 0.303
L4 5
L5 3.5
M 3.70 4.00 4.30 0.145
M1 3.60 4.00 4.40 0.142
N 2.20
O2
R 1.70
R1 0.5
R2 0.3
R3 1.25
R4 0.50
V 5˚ (T p.)
V1 3˚ (Typ.)
V2 20˚ (Typ.)
V3 45˚ (Typ.)
(1): dam-bar protusion not included
(2): molding protusion included
inch
TYP.
0.177
0.074
0.055
0.035
0.015
0.040
0.945
1.150
0.669
0.503
0.031
0.884
0.747
0.618
0.309
0.197
0.138
0.157
0.157
0.086
0.079
0.067
0.02
0.12
0.049
0.019
MAX.
0.183
0.079
0.041
0.016
0.022
0.047
0.955
1.153
0.904
0.762
0.626
0.313
0.169
0.173
OUTLINE AND
MECHANICAL DATA
Flexiwatt25 (vertical)
V
B
V3
Pin 1
H3
G
C
H
H1
H2
V
A
R3
R4
N
V2
R2
R
L L1
V1
V1
G1 F
R2 R1
D
L5
FLEX25ME
R1 R1
E
M M1
7034862
11/14
11 Page |
Páginas | Total 14 Páginas | |
PDF Descargar | [ Datasheet TDA7850.PDF ] |
Número de pieza | Descripción | Fabricantes |
TDA7850 | 4 x 50W MOSFET Quad Bridge Power Amplifier Plus HSD | ST Microelectronics |
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