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PDF UPC1676B Data sheet ( Hoja de datos )
| Número de pieza | UPC1676B | |
| Descripción | BANDWIDTH LOW NOISE SILICON MMIC AMPLIFIER | |
| Fabricantes | NEC | |
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UPC1676B
1.2 GHz BANDWIDTH LOW UPC1676G
NOISE SILICON MMIC AMPLIFIER UPC1676P
FEATURES
• WIDE BANDWIDTH:
1200 MHz at 3 dB Point for UPC1676G
1300 MHz at 3 dB Point for UPC1676B, UPC1676P
• HIGH POWER GAIN: 22 dB TYP AT f = 500 MHz
• HIGH ISOLATION
• SINGLE POWER SUPPLY: VCC = 5 V
• INPUT/OUTPUT MATCHED TO 50 Ω
• AVAILABLE IN TAPE AND REEL (UPC1676G)
DESCRIPTION
The UPC1676 is a silicon monolithic integrated circuit de-
signed for wide-band amplifiers covering the VHF to UHF
bands. The series is available in two package styles: a surface
mount package (UPC1676G), and an 8 lead ceramic flat
package (UPC1676B). Also available in chip form (UPC1676P).
NEC's stringent quality assurance and test procedures en-
sure the highest reliability and performance.
UPC1676G
NOISE FIGURE AND GAIN
vs. FREQUENCY AND VOLTAGE
30
VCC = 5.5 V
GP
20
5.0 V
4.5 V
10
VCC = 5.5 V
10 NF
5
5.0 V
4.5 V
0
60 100
200
0
500 1000 2000
Frequency, f (MHz)
ELECTRICAL CHARACTERISTICS (TA = 25°C, VCC = 5 V, f = 500 MHz)
PART NUMBER
PACKAGE OUTLINE
UPC1676B1
B08
UPC1676G
39
UPC1676P
CHIP
SYMBOLS
PARAMETERS AND CONDITIONS
UNITS MIN TYP MAX MIN TYP MAX MIN TYP MAX
ICC
GS
PSAT
BW
NF
RLIN
RLOUT
ISOL
RTH(J-C)
Supply Current
Small Signal Gain
Saturated Output Power
Bandwidth 3 dB down from gain at 100 MHz
Noise Figure
Input Return Loss
Output Return Loss
Isolation
Thermal Resistance (Junction to Case)
mA
dB
dBm
MHz
dB
dB
dB
dB
°C/W
14 19 24 14 19 24 14 19 24
18 20 22 19 22 24 19 22 24
3.5 5.5
35
35
1000 1300
1000 1200
1000 1300
4.5 6
4.5 6
4.5 6
18 21
9 12
21
10 13
69
13
24 28
24 28
24 28
50
Note:
1. Case must be connected to GND for stable RF operation and optimum thermal dissipation.
California Eastern Laboratories
1 page  
UPC1676B, UPC1676G, UPC1676P
OUTLINE DIMENSIONS
UPC1676P (CHIP)
(Units in µm)
4
5
12
CHIP FEATURES
• Die Size: 0.60 mm x 0.65 mm
• Thickness: 170 ± 30 µm
• Pad Size: 100 µm x 100 µm
• Ti/Pt/Au Metallization
3
BONDING INFORMATION
BONDING
PAD NO.
1
2
3
4
5
BONDING PAD (mm)
X AXIS
-185
-5
+185
+185
-175
Y AXIS
210
-210
-210
-210
+210
PAD
CONNECTION
INPUT
GND
GND
OUTPUT
VCC
Note:
All dimensions are typical unless otherwise specified.
ORDERING INFORMATION
PART NUMBER
UPC1676G-T1
QTY
3000 / Reel
UPC1676B
PACKAGE OUTLINE B08
(Units in mm)
1.27±0.1 1.27±0.1
(LEADS 2, 4, 6, 8) 0.6
0.4 (LEADS 1, 3, 5, 7)
43 2
10.6 MAX
5
3.8±0.2
1
678
3.8±0.2
10.6 MAX
LEAD
CONNECTIONS
1. Input 5. Output
2. GND 6. GND
3. GND 7. VCC
4. GND 8. GND
1.7 MAX
0.2
+0.05
-0.02
UPC1676G
PACKAGE OUTLINE 39
(Units in mm)
+0.2
2.8 -0.3
+0.2
1.5 -0.1
+0.10
0.4 -0.05
(LEADS 2, 3, 4)
2.9 ± 0.2 0.95
0.85
2
3
1.9
1
+0.10
0.6 -0.05
4
1.1+-00..21 0.8
PIN
CONNECTIONS
1. GND
2. Output
3. VCC
4. Input
5˚
0.16
+0.10
-0.06
5˚
0 to 0.1
EXCLUSIVE NORTH AMERICAN AGENT FOR
RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279
24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM
DATA SUBJECT TO CHANGE WITHOUT NOTICE
PRINTED IN USA ON RECYCLED PAPER -3/97
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet UPC1676B.PDF ] | |
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