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PDF NZL6V8AXV3T1 Data sheet ( Hoja de datos )

Número de pieza NZL6V8AXV3T1
Descripción Zener Voltage Regulators
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NZL5V6AXV3T1 Series
Preferred Devices
Zener Voltage Regulators
SC - 89 Dual Common Anode Zeners
for ESD Protection
These dual monolithic silicon zener diodes are designed for
applications requiring ESD protection capability. They are intended for
use in voltage and ESD sensitive equipment such as computers,
printers, business machines, communication systems, medical
equipment and other applications. Their dual junction common anode
design protects two separate lines using only one package. These
devices are ideal for situations where board space is at a premium.
Specification Features:
SC-89 Package Allows Either Two Separate Unidirectional
Configurations or a Single Bidirectional Configuration
Standard Zener Breakdown Voltage Ranges
ESD Rating of Class N (exceeding 16 kV) per the Human
Body Model and IEC61000-4-2
Low Leakage < 5.0 mA
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL94, VO
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
Use the Device Number to order the 7 inch/3,000 unit reel.
http://onsemi.com
PIN 1. CATHODE
2. CATHODE
3. ANODE
1
2
3
SC - 89
CASE 463C
STYLE 4
MARKING
DIAGRAM
3
xx D
12
xx = Device Code
D = Date Code
ORDERING INFORMATION
Device
Package
Shipping
NZL5V6AXV3T1 SC - 89 3000/Tape & Reel
NZL6V8AXV3T1 SC - 89 3000/Tape & Reel
NZL7V5AXV3T1 SC - 89 3000/Tape & Reel
Preferred devices are recommended choices for future use
and best overall value.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the table on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2003
June, 2003 - Rev. 0
1
Publication Order Number:
NZL5V6AXV3T1/D

1 page




NZL6V8AXV3T1 pdf
NZL5V6AXV3T1 Series
INFORMATION FOR USING THE SC - 89 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.53 0.53
1.10
SC - 89
Dimensions in Millimeters
0.50
SC - 89 POWER DISSIPATION
The power dissipation of the SC-89 is a function of the
drain pad size. This can vary from the minimum pad size
for soldering to a pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
determined by TJ(max), the maximum rated junction
temperature of the die, RθJA, the thermal resistance from
the device junction to ambient, and the operating
temperature, TA. Using the values provided on the data
sheet for the SC-89 package, PD can be calculated as
follows:
PD =
TJ(max) - TA
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values
into the equation for an ambient temperature TA of 25°C,
one can calculate the power dissipation of the device which
in this case is 240 milliwatts.
PD = 150°C - 25°C = 240 milliwatts
525 °C/W
The 525 °C/W for the SC-89 package assumes the use of
the recommended footprint on a glass epoxy printed circuit
board to achieve a power dissipation of TBD milliwatts.
There are other alternatives to achieving higher power
dissipation from the SC-89 package. Another alternative
would be to use a ceramic substrate or an aluminum core
board such as Thermal Clad®. Using a board material such
as Thermal Clad, an aluminum core board, the power
dissipation can be doubled using the same footprint.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
Always preheat the device.
The delta temperature between the preheat and
soldering should be 100°C or less.*
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference shall be a maximum of 10°C.
The soldering temperature and time shall not exceed
260°C for more than 10 seconds.
When shifting from preheating to soldering, the
maximum temperature gradient shall be 5°C or less.
After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied
during cooling.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
http://onsemi.com
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