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PDF EMIF06-10006F1 Data sheet ( Hoja de datos )
| Número de pieza | EMIF06-10006F1 | |
| Descripción | 6 LINES EMI FILTER AND ESD PROTECTION | |
| Fabricantes | ST Microelectronics | |
| Logotipo |  |
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®
IPADTM
EMIF06-10006F1
6 LINES EMI FILTER
AND ESD PROTECTION
MAIN PRODUCT CHARACTERISTICS
Where EMI filtering in ESD sensitive equipment is required:
s Mobile phones and communication systems
s Computers, printers and MCU Boards
DESCRIPTION
The EMIF06-10006F1 is a highly integrated devices
designed to suppress EMI/RFI noise in all systems
subjected to electromagnetic interferences. The
EMIF04 flip-chip packaging means the package size
is equal to the die size.
This filter includes an ESD protection circuitry which
prevents the device from destruction when subjected
to ESD surges up 15kV. This device includes four
EMIF filters and 4 separated ESD diodes.
BENEFITS
s EMI symmetrical (I/O) low-pass filter
s High efficiency in EMI filtering
s Very low PCB space consuming:
2.92mm x 1.29mm
s Very thin package: 0.65 mm
s High efficiency in ESD suppression
(IEC61000-4-2 level 4)
s High reliability offered by monolithic integration
s High reducing of parasitic elements through
integration and wafer level packaging.
COMPLIES WITH THE FOLLOWING STANDARDS :
IEC 61000-4-2 level 4:
15kV (air discharge)
8 kV (contact discharge)
MIL STD 883E - Method 3015-6 Class 3
BASIC CELL CONFIGURATION
Input 1
Output 1
®
Flip-Chip package
PIN CONFIGURATION (ball side)
987
654
32 1
I6 I5 I4 I3 I2 I1 A
Gnd
Gnd
Gnd
B
O6 O5 O4 O3 O2 O1 C
Input 4
Output 4
Input 2
Output 2
Input 5
Output 5
Input 3
GND
TM : IPAD is a trademark of STMicroelectronics.
January 2003 - Ed: 1
Output 3
Input 6
Filtering cells: Ri/o = 100Ω
Cline = 60pF
GND
Output 6
1/6
1 page  
EMIF06-10006F1
ORDER CODE
EMIF yy - xxx zz F 1
EMI Filter
Pitch = 500µm
Bump = 315µm
Number of lines
FLIP CHIP
x: resistance value (Ω) z: capacitance value / 10 (pF)
or
application (3 letters) and version (2 digits)
PACKAGE MECHANICAL DATA
500µm ± 50
250µm ± 50
315µm ± 50
650µm ± 65
2.92mm ± 50µm
FOOT PRINT RECOMMENDATIONS
MARKING
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 300µm copper pad diameter
Dot, ST logo
xxx = marking
yww = datecode
(y = year
ww = week)
All dimensions in µm
545 400
xxx
y ww
5/6
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet EMIF06-10006F1.PDF ] | |
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