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PDF TDA2654 Data sheet ( Hoja de datos )
| Número de pieza | TDA2654 | |
| Descripción | Vertical Deflection Circuit | |
| Fabricantes | NXP Semiconductors | |
| Logotipo |  |
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INTEGRATED CIRCUITS
DATA SHEET
TDA2654
Vertical deflection circuit
Product specification
File under Integrated Circuits, IC02
November 1982
1 page  
www.DataSheet4U.com
Philips Semiconductors
Vertical deflection circuit
Product specification
TDA2654
Fig.2 Total power dissipation. The graph takes into account an Rth tab-h = 1 °C/W which is to be expected when
the tab is connected to a heatsink with one 3 mm bolt, without using heatsink compound. Rth j-tab = 12 °C/W.
November 1982
5
5 Page 
www.DataSheet4U.com
Philips Semiconductors
Vertical deflection circuit
PACKAGE OUTLINE
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
D
Product specification
TDA2654
SOT110-1
D1
q
P P1
pin 1 index
q2
q1
A3
A
A4
A2
E
1
Ze
b2
b
b1
9
wM
L
c
Q
0 5 10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A2
max.
A3
A4
b
b1 b2
c D(1) D1 E(1) e
L
P P1 Q
q q1
mm
18.5
17.8
3.7
8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48 2.54 3.9 2.75 3.4 1.75 15.1 4.4
8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20
3.4 2.50 3.2 1.55 14.9 4.2
q2
w
Z (1)
max.
5.9
5.7
0.25
1.0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT110-1
IEC
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-02-25
November 1982
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet TDA2654.PDF ] | |
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