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PDF SCG015 Data sheet ( Hoja de datos )
| Número de pieza | SCG015 | |
| Descripción | High Linearity InGaP HBT Amplifier | |
| Fabricantes | WJ Communication | |
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SCG015
¼ Watt, High Linearity InGaP HBT Amplifier
The Communications Edge TM
Product Information
Product Features
• 1800 – 2500 MHz
• +24 dBm P1dB
• +40 dBm OIP3
• 15 dB Gain
• 5 dB Noise Figure
• Single Positive Supply (+8V)
• Available in a lead-free / green
SOT-89 Package Style
Applications
• Mobile Infrastructure
• W-LAN / ISM
• RFID
• Defense / Homeland Security
• Fixed Wireless
Product Description
The SCG015 is a high dynamic range driver amplifier in a
low-cost surface mount package. The InGaP/GaAs HBT is
able to achieve performance over a broad range with +41
dBm OIP3 and +24 dBm of compressed 1dB power and is
housed in a lead-free/green/RoHS-compliant SOT-89 SMT
package. All devices are 100% RF and DC tested.
The product is targeted for use as a gain block/driver
amplifier for various current and next generation wireless
technologies such as CDMA, CDMA2000, and W-CDMA,
where high linearity and medium power is required. In
addition, the SCG015 will work for numerous other
applications within the 1800 to 2500 MHz frequency range.
Functional Diagram
GND
4
1
RF IN
2
GND
3
RF OUT
Pin No.
1
3
2, 4
Function
Input
Output/Bias
Ground
Specifications (1)
Typical Performance (1)
Parameter
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
Noise Figure
Device Voltage
Device Current
Units
MHz
MHz
dB
dB
dB
dBm
dBm
dB
V
mA
Min
1800
13.5
16
+23
+37.5
85
Typ
2140
15
20
10
+24
+40
5
5
100
Max
2500
135
1. Test conditions unless otherwise noted: 25°C, Vsupply = +8 V, in tuned application circuit with
Rbias = 30 Ω.
2. 3OIP measured with two tones at an output power of +9 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Parameter
Frequency
S21
S11
S22
Output P1dB
Output IP3 (2)
Noise Figure
Units
MHz
dB
dB
dB
dBm
dBm
dB
Typical
1900
2140
16.5 15
-16 -20
-11 -10
+24 +24
+40 +40
55
2450
14.5
-12
-9
+23
+40
5
Absolute Maximum Rating
Ordering Information
Parameter
Operating Case Temperature
Storage Temperature
Device Current
RF Input Power (continuous)
Junction Temperature
Rating
-40 to +85 °C
-55 to +150 °C
180 mA
+15 dBm
+250 °C
Part No.
Description
SCG015B*
0.2 Watt, High Linearity InGaP HBT Amplifier
(lead-tin SOT-89 Pkg)
SCG015B-G
0.2 Watt, High Linearity InGaP HBT Amplifier
(lead-free/green/RoHS-compliant SOT-89 Pkg)
SCG015B-PCB1960 1960 MHz Fully Assembled Eval. Board
SCG015B-PCB2140 2140 MHz Fully Assembled Eval. Board
Operation of this device above any of these parameters may cause permanent damage.
* This package is being phased out in favor of the green package type which is backwards compatible for
existing designs. Refer to Product Change Notification WJPCN06MAY05TC1 on the WJ website.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com
Page 1 of 6 June 2005 Rev. 1
1 page  
SCG015
¼ Watt, High Linearity InGaP HBT Amplifier
The Communications Edge TM
Product Information
SCG015B (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Product Marking
The component will be marked with an “S015”
designator with an alphanumeric lot code on the
top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application Notes”
section.
ESD / MSL Information
Land Pattern
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes at between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235 °C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the PC board in the region
where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
Thermal Specifications
Parameter
Rating
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tjc (2)
-40 to +85 °C
128 °C / W
149 °C
Notes:
1. The thermal resistance is referenced from the
junction-to-case at a case temperature of 85° C.
2. This corresponds to the typical biasing condition of
+5V, 100 mA at an 85° C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 247° C.
Tjc = Tcase + Rth * Vde * Icc
MTTF vs. GND Tab Temperature
100000
10000
1000
100
60
70 80 90 100 110 120
Tab Temperature (°C)
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com
Page 5 of 6 June 2005 Rev. 1
5 Page | ||
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| PDF Descargar | [ Datasheet SCG015.PDF ] | |
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