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PDF OPA2827 Data sheet ( Hoja de datos )
| Número de pieza | OPA2827 | |
| Descripción | (OPA2827 / OPA827) OPERATIONAL AMPLIFIER | |
| Fabricantes | Burr-Brown | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de OPA2827 (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
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OPA827
OPA2827
SBOS376A − NOVEMBER 2006
Low-Noise, High-Precision, JFET-Input,
OPERATIONAL AMPLIFIER
FEATURES
D OFFSET: 250µV (max)
D DRIFT: 1µV/°C
D LOW NOISE: 4.5nV//Hz at 1kHz
D BANDWIDTH: 18MHz
D SLEW RATE: 22V/µs
D BIAS CURRENT: 3pA
D QUIESCENT CURRENT: 4.5mA/Ch
D WIDE SUPPLY RANGE: +4V to +18V
D SINGLE PACKAGES: MSOP-8, SO-8
D DUAL PACKAGES: TSSOP-8, SO-8
APPLICATIONS
D PRECISION +10V INPUT FRONT-ENDS
D TRANSIMPEDANCE AMPLIFIERS
D INTEGRATORS
D ACTIVE FILTERS
D A/D CONVERTER DRIVERS
D DAC OUTPUT BUFFERS
D HIGH-PERFORMANCE AUDIO
D PROCESS CONTROL
D TEST EQUIPMENT
D MEDICAL EQUIPMENT
+15V
2.2µF
100nF
100pF
500Ω
500Ω
VIN
100pF OPA827
2.2µF
100nF
−15V
DESCRIPTION
The OPA827 series of JFET operational amplifiers
combines outstanding dc precision with excellent ac
performance. It offers 100µV of offset, very low drift
(1µV/°C) over temperature, low bias currents, and very low
flicker noise of 400nVPP (0.1Hz to 10Hz). It operates over
a very wide supply voltage range of ±4V to ±18V on a low
4.5mA supply current. A dual version is also available for
the OPA827 family.
Excellent ac characteristics, such as 18MHz gain
bandwidth (GBW) and 22V/µs slew rate, and precision dc
characteristics make the OPA827 series well-suited for a
wide range of applications such as 16- to 18-bit data
acquisition systems, transimpedance (I/V−conversion)
amplifiers, filters, precision ±10V front-ends, and
professional audio applications.
The single version (OPA827) is available in both MSOP-8
and standard SO-8 surface-mount packages. The dual
version (OPA2827) is available in the small TSSOP-8 and
in the standard SO-8 packages. All versions are specified
from −40°C to +125°C.
200Ω
ADS8505
VIN
33.2kΩ
REF
2.2µF
AGND1
CAP
2.2µF
AGND2
DGND
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCT PREVIEW information concerns products in the formative or design
phase of development. Characteristic data and other specifications are design
goals. Texas Instruments reserves the right to change or discontinue these
products without notice.
www.ti.com
Copyright 2006, Texas Instruments Incorporated
1 page  
www.ti.com
PACKAGE OPTION ADDENDUM
22-Nov-2006
PACKAGING INFORMATION
Orderable Device
OPA827AID
POPA827AID
Status (1)
PREVIEW
PREVIEW
Package
Type
SOIC
SOIC
Package
Drawing
D
D
Pins Package Eco Plan (2)
Qty
8 75
TBD
8 1500
TBD
Lead/Ball Finish MSL Peak Temp (3)
Call TI
Call TI
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet OPA2827.PDF ] | |
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