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PDF EMIF03-SIM02F2 Data sheet ( Hoja de datos )
| Número de pieza | EMIF03-SIM02F2 | |
| Descripción | 3 LINE EMI FILTER INCLUDING ESD PROTECTION | |
| Fabricantes | ST Microelectronics | |
| Logotipo |  |
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®
IPAD™
EMIF03-SIM02F2
3 LINE EMI FILTER
INCLUDING ESD PROTECTION
MAIN PRODUCT APPLICATIONS:
EMI filtering and ESD protection for:
■ SIM Interface (Subscriber Identify Module)
■ UIM Interface (Universal Identify Module)
DESCRIPTION
The EMIF03-SIM02F2 is a highly integrated
device designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic interfer-
ence. The EMIF03 flip chip packaging means the
package size is equal to the die size.
This filter includes an ESD protection circuitry
which prevents the device from destruction when
subjected to ESD surges up 15kV.
Flip-Chip
(8 Bumps)
BENEFITS
Table 1: Order Code
■ EMI symmetrical (I/O) low-pass filter
■ High efficiency in EMI filtering
■ Lead free package
Part Number
EMIF03-SIM02F2
Marking
GJ
■ Very low PCB space consuming:
1.42mm x 1.42mm
Figure 1: Pin Configuration (Ball side)
■ Very thin package: 0.65 mm
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■ High efficiency in ESD suppression
■ High reliability offered by monolithic integration
321
■ High reducing of parasitic elements through
integration & wafer level packaging.
RST RST
in ext
A
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2
Level 4 on external & Vcc pins:
15kV(air discharge)
8kV (contact discharge)
Level 1 on internal pins: 2kV (air discharge)
2kV (contact discharge)
CLK
in
Gnd
CLK
ext
Data
in
VCC
Data
ext
B
C
MIL STD 883E - Method 3015-6 Class 3
Figure 2: Configuration
VCC
RST in
CLK in
Data in
100 Ω
R1
47 Ω
R2
100 Ω
R3
RST ext
CLK ext
Data ext
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DataShTeMe:tI4PUAD.cios ma trademark of STMicroelectronics.
September 2005
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GND
REV. 5
Cline = 20pF max.
1/7
1 page  
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EMIF03-SIM02F2
Figure 12: Ordering Information Scheme
EMIF yy - xxx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip-Chip
x = 1: 500µm, Bump = 315µm
= 2: Leadfree Pitch = 500µm, Bump = 315µm
= 3: Leadfree Pitch = 400µm, Bump = 250µm
Figure 13: FLIP-CHIP Package Mechanical Data
500µm ± 50
315µm ± 50
et4U.com
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650µm ± 65
DataShee
1.42mm ± 50µm
Figure 14: Foot print recommendations
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 315µm copper pad diameter
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Figure 15: Marking
Dot, ST logo
xx = marking
z = packaging
location
yww = datecode
(y = year
ww = week)
All dimensions in µm
365 240
E
xxz
y ww
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| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet EMIF03-SIM02F2.PDF ] | |
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