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PDF TE28F160C3TD70 Data sheet ( Hoja de datos )

Número de pieza TE28F160C3TD70
Descripción Boot Block Flash Memory
Fabricantes Intel 
Logotipo Intel Logotipo



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Intel® Advanced+ Boot Block Flash
Memory (C3)
28F800C3, 28F160C3, 28F320C3 (x16)
Datasheet
Product Features
Flexible SmartVoltage Technology
— 2.7 V– 3.6 V read/program/erase
— 12 V for fast production programming
128-bit Protection Register
—64 bit unique device identifier
—64 bit user programmable OTP cells
1.65 V to 2.5 V or 2.7 V to 3.6 V I/O
Option
Extended Cycling Capability
—Minimum 100,000 block erase cycles
— Reduces overall system power
Software
High Performance
— 2.7 V– 3.6 V: 70 ns max access time
—Supported by Intel’s Advanced Flash
File Managers -- Intel® VFM, Intel®
Optimized Architecture for Code Plus
Data Storage
FDI, etc.
—Code and data storage in the same
— Eight 4 Kword blocks, top or bottom
memory device
parameter boot
—Robust Power Loss Recovery for Data
— Up to 127 x 32 Kword blocks
Loss Prevention
— Fast program suspend capability
—Common Flash Interface
www.DataSheet4U.com—Fast erase suspend capability
Flexible Block Locking
http://www.intel.com/go/flashsw
Standard Surface Mount Packaging
— Lock/unlock any block
—48-Ball µBGA*/VFBGA
— Full protection on power-up
—64-Ball Easy BGA packages
— Write Protect (WP#) pin for hardware
—48-TSOP package
block protection
ETOX™ VIII (0.13 µm) Flash
Low Power Consumption
Technology
— 9 mA typical read
—8, 16, 32 Mbit
— 7 uA typical standby with Automatic ETOX™ VII (0.18 µm) Flash Technology
Power Savings feature
—16, 32 Mbit
Extended Temperature Operation
— -40 °C to +85 °C
ETOX™ VI (0.25 µm) Flash Technology
—8, 16 and 32 Mbit
The Intel® Advanced+ Book Block Flash Memory (C3) device, manufactured on Intel’s latest
0.13 µm and 0.18 µm technologies, represents a feature-rich solution for low-power
applications. The C3 device incorporates low-voltage capability (3 V read, program, and erase)
with high-speed, low-power operation. Flexible block locking allows any block to be
independently locked or unlocked. Add to this the Intel® Flash Data Integrator (Intel® FDI)
software and you have a cost-effective, flexible, monolithic code plus data storage solution.
Intel® Advanced+ Boot Block Flash Memory (C3) products are available in 48-lead TSOP, 48-
ball CSP, and 64-ball Easy BGA packages. Additional information on this product family can be
obtained from the Intel® Flash website: http://www.intel.com/design/flash.
DataSheet4 U .com
Order Number: 290645, Revision: 023
May 2005
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TE28F160C3TD70 pdf
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Revision History
Intel® Advanced+ Boot Block Flash Memory (C3)
Date of
Revision
05/12/98
07/21/98
10/03/98
12/04/98
12/31/98
02/24/99
06/10/99
03/20/00
04/24/00
10/12/00
7/20/01
10/02/01
2/05/02
Version
Description
-001
Original version
-002
48-Lead TSOP package diagram change
µBGA package diagrams change
32-Mbit ordering information change (Section 6)
CFI Query Structure Output Table Change (Table C2)
CFI Primary-Vendor Specific Extended Query Table Change for Optional Features and
Command Support change (Table C8)
Protection Register Address Change
IPPD test conditions clarification (Section 4.3)
µBGA package top side mark information clarification (Section 6)
-003
Byte-Wide Protection Register Address change
VIH Specification change (Section 4.3)
VIL Maximum Specification change (Section 4.3)
ICCS test conditions clarification (Section 4.3)
Added Command Sequence Error Note (Table 7)
Datasheet renamed from 3 Volt Advanced Boot Block, 8-, 16-, 32-Mbit Flash Memory
Family.
-004
Added tBHWH/tBHEH and tQVBL (Section 4.6)
Programming the Protection Register clarification (Section 3.4.2)
-005
Removed all references to x8 configurations
www.DataSheet4U.com-006
Removed reference to 40-Lead TSOP from front page
Added Easy BGA package (Section 1.2)
Removed 1.8 V I/O references
-007
Locking Operations Flowchart changed (Appendix B)
Added tWHGL (Section 4.6)
CFI Primary Vendor-Specific Extended Query changed (Appendix C)
-008
-009
Max ICCD changed to 25 µA
Table 10, added note indicating VCCMax = 3.3 V for 32-Mbit device
Added specifications for 0.18 micron product offerings throughout document Added 64-
Mbit density
-010
Changed references of 32Mbit 80ns devices to 70ns devices to reflect the faster product
offering.
Changed VccMax=3.3V reference to indicate that the affected product is the 0.25µm
32Mbit device.
Minor text edits throughout document.
Added 1.8v I/O operation documentation where applicable
Added TSOP PCN ‘Pin-1’ indicator information
Changed references in 8 x 8 BGA pinout diagrams from ‘GND’ to ‘Vssq’
-011
Added ‘Vssq’ to Pin Descriptions Information
Removed 0.4 µm references in DC characteristics table
Corrected 64Mb package Ordering Information from 48-uBGA to 48-VFBGA
Corrected ‘bottom’ parameter block sizes to on 8Mb device to 8 x 4KWords
Minor text edits throughout document
-012
Added specifications for 0.13 micron product offerings throughout document
-013
Corrected Iccw / Ippw / Icces /Ippes values.
Added mechanicals for 16Mb and 64Mb
Minor text edits throughout document.
Datasheet
DataSheet4 U .com
Intel® Advanced+ Boot Block Flash Memory (C3)
Order Number: 290645, Revision: 023
May 2005
5
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TE28F160C3TD70 arduino
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Intel® Advanced+ Boot Block Flash Memory (C3)
Table 2.
Bottom Boot Memory Map
Size
(KW)
Blk
8-Mbit
Memory
Addressing
(Hex)
32 22 78000-7FFFF
Size
(KW)
Blk
32 38
16-Mbit
Memory
Addressing
(Hex)
F8000-FFFFF
Size
(KW)
Blk
32-Mbit
Memory
Addressing
(Hex)
32 70 1F8000-1FFFFF
Size
(KW)
Blk
64-Mbit Memory
Addressing (Hex)
32 134 3F8000-3FFFFF
32 21 70000-77FFF
32 37 F0000-F7FFF
32 69 1F0000-1F7FFF
32 133 3F0000-3F7FFF
32 20 68000-6FFFF
32 19 60000-67FFF
32 36 E8000-EFFFF
32 35 E0000-E7FFF
32 68 1E8000-1EFFFF
32 67 1E0000-1E7FFF
32 132 3E8000-3EFFFF
32 131 3E0000-3E7FFF
... ...
...
... ...
...
... ...
...
. ...
...
32 10 18000-1FFFF
32 10 18000-1FFFF
32 10 18000-1FFFF
32 10
18000-1FFFF
32 9 10000-17FFF
32 9 10000-17FFF
32 9 10000-17FFF
32 9
10000-17FFF
32 8 08000-0FFFF
32 8 08000-0FFFF
32 8 08000-0FFFF
32 8
08000-0FFFF
4 7 07000-07FFF
4 7 07000-07FFF
4 7 07000-07FFF
47
07000-07FFF
4 6 06000-06FFF
4 5 05000-05FFF
4 6 06000-06FFF
4 5 05000-05FFF
4 6 06000-06FFF
4 5 05000-05FFF
46
45
06000-06FFF
05000-05FFF
4 4 04000-04FFF
4 4 04000-04FFF
4 4 04000-04FFF
44
04000-04FFF
4 3 03000-03FFF
4 3 03000-03FFF
4 3 03000-03FFF
43
03000-03FFF
4 2 02000-02FFF
4 2 02000-02FFF
4 2 02000-02FFF
42
02000-02FFF
4 1 01000-01FFF
4 1 01000-01FFF
4 1 01000-01FFF
41
01000-01FFF
www.DataSheet4U.com4 0 00000-00FFF
4 0 00000-00FFF
4 0 00000-00FFF
40
00000-00FFF
Datasheet
DataSheet4 U .com
Intel® Advanced+ Boot Block Flash Memory (C3)
Order Number: 290645, Revision: 023
May 2005
11
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