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PDF XPC855xxxx Datasheet ( Hoja de datos )

Número de pieza XPC855xxxx
Descripción (XPC860 Series) Family Hardware Specifications
Fabricantes Motorola 
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XPC855xxxx Hoja de datos, Descripción, Manual
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Advance Information
MPC860EC
Rev. 6.3 9/2003
MPC860 Family
Hardware Specications
This hardware specification contains detailed information on power considerations, DC/AC
electrical characteristics, and AC timing specifications for the MPC860 family.
This hardware specification covers the following topics:
Topic
Section 1, “Overview”
Section 2, “Features”
Section 3, “Maximum Tolerated Ratings”
Section 4, “Thermal Characteristics”
Section 5, “Power Dissipation”
Section 6, “DC Characteristics”
Section 7, “Thermal Calculation and Measurement”
Section 8, “Layout Practices”
Section 9, “Bus Signal Timing”
Section 10, “IEEE 1149.1 Electrical Specifications”
Section 11, “CPM Electrical Characteristics”
Section 12, “UTOPIA AC Electrical Specifications”
Section 13, “FEC Electrical Characteristics”
Section 14, “Mechanical Data and Ordering Information”
Section 15, “Document Revision History”
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XPC855xxxx pdf
Features
— AppleTalk
— Universal asynchronous receiver transmitter (UART)
— Synchronous UART
— Serial infrared (IrDA)
— Binary synchronous communication (BISYNC)
— Totally transparent (bit streams)
— Totally transparent (frame-based with optional cyclic redundancy check (CRC))
• Two SMCs (serial management channels)
— UART
— Transparent
— General circuit interface (GCI) controller
— Can be connected to the time-division multiplexed (TDM) channels
• One SPI (serial peripheral interface)
— Supports master and slave modes
— Supports multimaster operation on the same bus
• One I2C (inter-integrated circuit) port
— Supports master and slave modes
— Multiple-master environment support
• Time-slot assigner (TSA)
— Allows SCCs and SMCs to run in multiplexed and/or non-multiplexed operation
— Supports T1, CEPT, PCM highway, ISDN basic rate, ISDN primary rate, user defined
— 1- or 8-bit resolution
— Allows independent transmit and receive routing, frame synchronization, and clocking
— Allows dynamic changes
— Can be internally connected to six serial channels (four SCCs and two SMCs)
• Parallel interface port (PIP)
— Centronics interface support
— Supports fast connection between compatible ports on the MPC860 or the MC68360
• PCMCIA interface
— Master (socket) interface, release 2.1 compliant
— Supports two independent PCMCIA sockets
— Supports eight memory or I/O windows
• Low power support
— Full on—all units fully powered
— Doze—core functional units disabled except time base decrementer, PLL, memory controller,
RTC, and CPM in low-power standby
— Sleep—all units disabled except RTC and PIT, PLL active for fast wake up
— Deep sleep—all units disabled including PLL except RTC and PIT
— Power down mode—all units powered down except PLL, RTC, PIT, time base, and decrementer
• Debug interface
MOTOROLA
MPC860 Family Hardware Specications
5

5 Page

XPC855xxxx arduino
Thermal Calculation and Measurement
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Figure 1. Effect of Board TemperatuProewRerise on Thermal Behavior
80
If the board temperature is known, an estimate of the junction temperature in the environment can be made
using the following equation:
TJ = TB + (RθJB × PD)
where:
RθJB = junction-to-board thermal resistance (ºC/W)
TB = board temperature (ºC)
PD = power dissipation in package
If the board temperature is known and the heat loss from the package case to the air can be ignored,
acceptable predictions of junction temperature can be made. For this method to work, the board and board
mounting must be similar to the test board used to determine the junction-to-board thermal resistance,
namely a 2s2p (board with a power and a ground plane) and by attaching the thermal balls to the ground
plane.
7.4 Estimation Using Simulation
When the board temperature is not known, a thermal simulation of the application is needed. The simple
two-resistor model can be used with the thermal simulation of the application [2], or a more accurate and
complex model of the package can be used in the thermal simulation.
7.5 Experimental Determination
To determine the junction temperature of the device in the application after prototypes are available, the
thermal characterization parameter (ΨJT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT × PD)
where:
ΨJT = thermal characterization parameter
MOTOROLA
MPC860 Family Hardware Specications
11

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