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PDF QFBR-5204 Data sheet ( Hoja de datos )
| Número de pieza | QFBR-5204 | |
| Descripción | (QFBR-5204 / QFBR-5205) ATM Multimode Fiber Transceivers | |
| Fabricantes | Agilent Technologies | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de QFBR-5204 (archivo pdf) en la parte inferior de esta página. Total 23 Páginas | ||
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ATM Multimode Fiber
Transceivers for SONET
OC-3/SDH STM-1 in Low
Cost 1x9 Package Style
Data Sheet
HFBR-5204/-5204P/-5204T
1300 nm 500 m
HFBR-5205/-5205A/
-5205AT/-5205P/-5205T/
-5205PE
1300 nm 2 km
Features
• Full Compliance with ATM
Forum UNI SONET OC-3
Multimode Fiber Physical
Layer Specification
These transceivers are all
supplied in the new industry
standard 1x9 SIP package style
with either a duplex SC or a
duplex ST* connector interface.
• Multisourced 1 x 9 Package
Style with Choice of Duplex
SC or Duplex ST* Receptacle
• Wave Solder and Aqueous
Wash Process Compatibility
• Manufactured in an ISO 9002
Certified Facility
Applications
• Multimode Fiber ATM
Backbone Links
• Multimode Fiber ATM Wiring
Closet to Desktop Links
ATM 2000 m Backbone Links
The HFBR-5205/-5205T are
1300 nm products with optical
performance compliant with the
SONET STS-3c (OC-3) Physical
Layer Interface Specification. This
physical layer is defined in the
ATM Forum User-Network Inter-
face (UNI) Specification Version
3.0. This document references the
ANSI T1E1.2 specification for the
details of the interface for 2000
meter multimode fiber backbone
links.
• ATM 155 Mbps/194 MBd
Encoded Links (available
upon special request)
Description
The HFBR-5200 family of trans-
ceivers from Agilent Technologies
provide the system designer with
products to implement a range of
solutions for multimode fiber
SONET OC-3 (SDH STM-1) physical
layers for ATM and other services.
Selected versions of these
transceivers may be used to
implement the ATM Forum UNI
Physical Layer Interface at the
155 Mbps/194 MBd rate.
The ATM 100 Mbps/125 MBd
Physical Layer interface is best
implemented with the HFBR-5100
family of FDDI Transceivers
which are specified for use in this
4B/5B encoded physical layer per
the FDDI PMD standard.
ATM 500 m Backbone and
Desktop Links
The HFBR-5204/-5204T are 1300
nm products which are similar to
the HFBR-5205/5205T except
that they are intended to provide
a lower cost SONET OC-3 link to
distances up to 500 meters in
62.5/125 µm multimode fiber
optic cables.
Transmitter Sections
The transmitter sections of the
HFBR-5204 and HFBR-5205
series utilize 1300 nm InGaAsP
LEDs. These LEDs are packaged
in the optical subassembly portion
of the transmitter section. They
are driven by a custom silicon IC
which converts differential PECL
logic signals, ECL referenced
(shifted) to a +5 Volt supply, into
an analog LED drive current.
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1 page  
5
(215.0.40)MAX.
39.6
(1.56)
MAX.
12.70
(0.50)
(219.1.66)UNCOMPRESSED
4.7
(0.185)
AREA
RESERVED
FOR
PROCESS
PLUG
12.7
(0.50)
0.25
+0.1
-0.05
( )0.010
+0.004
-0.002
SLOT
DEPTH
0.51
(0.02)
(09.3.886)MAX.
10.2 MAX.
(0.40)
SLOT WIDTH 2.0 ± 0.1
(0.079 ± 0.004)
(20..0098)UNCOMPRESSED
3.3 ± 0.38
(0.130 ± 0.015)
( )9X ∅
0.46
+0.25
-0.05
0.018
+0.010
-0.002
23.8 20.32
(0.937) (0.800)
8X(02..15040)
20.32
(0.80)
1.3
(0.05)
15.8 ± 0.15
(0.622 ± 0.006)
( )2X ∅
1.27
+0.25
-0.05
0.050
+0.010
-0.002
20.32
(0.800)
2X
∅
1.3
(0.051)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
ALL DIMENSIONS ARE ± 0.025 mm UNLESS OTHERWISE SPECIFIED.
Figure 2b. Package Outline Drawing with Mezzanine Height and Extended Shield.
5 Page 
11
Board Layout – Art Work
The Applications Engineering
group is developing Gerber file
art work for a multilayer printed
circuit board layout incorporating
the recommendations above.
Contact your local Agilent sales
representative for details.
Board Layout – Mechanical
For applications interested in
providing a choice of either a
duplex SC or a duplex ST con-
nector interface, while utilizing
the same pinout on the printed
circuit board, the ST port needs
to protrude from the chassis
panel a minimum of 9.53 nm for
sufficient clearance to install the
ST connector.
Please refer to Figure 8a for a
mechanical layout detailing the
recommended location of the
0.51
12.0
9.53
(NOTE 1)
12.09
42.0
24.8
duplex SC and duplex ST
transceiver packages in relation
to the chassis panel.
For both shielded design options,
Figures 8b and 8c identify front
panel aperture dimensions.
Regulatory Compliance
These transceiver products are
intended to enable commercial
system designers to develop
equipment that complies with the
various international regulations
governing certification of Infor-
mation Technology Equipment.
See the Regulatory Compliance
Table for details. Additional
information is available from your
Agilent sales representative.
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD damage is
important.
0.75
11.1
6.79
39.12
25.4
The first case is during handling
of the transceiver prior to
mounting it on the circuit board.
It is important to use normal ESD
handling precautions for ESD
sensitive devices. These precau-
tions include using grounded
wrist straps, work benches, and
floor mats in ESD controlled
areas.
NOTE 1: MINIMUM DISTANCE FROM FRONT
OF CONNECTOR TO THE PANEL FACE.
The second case to consider is
25.4 static discharges to the exterior of
the equipment chassis containing
the transceiver parts. To the
extent that the duplex SC
connector is exposed to the
outside of the equipment chassis
it may be subject to whatever ESD
system level test criteria that the
equipment is intended to meet.
Figure 8a. Recommended Common Mechanical Layout for ST and ST 1x9
Connectored Transceivers.
11 Page | ||
| Páginas | Total 23 Páginas | |
| PDF Descargar | [ Datasheet QFBR-5204.PDF ] | |
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