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PDF C0603xxxx Data sheet ( Hoja de datos )
| Número de pieza | C0603xxxx | |
| Descripción | (C0603xxxx) CERAMIC CHIP/STANDARD | |
| Fabricantes | Kemet Corporation | |
| Logotipo |  |
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CERAMIC CHIP CAPACITORS
U.com FEATURES• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics
t4• 10, 16, 25, 50, 100 and 200 Volts
e• Standard End Metalization: Tin-plate over nickel
ebarrier
h• Available Capacitance Tolerances: ±0.10 pF; ±0.25
SpF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and
ta+80%-20%
• Tape and reel packaging per EIA481-1. (See page
63 for specific tape and reel information.) Bulk
Cassette packaging (0402, 0603, 0805 only) per
IEC60286-6 and EIAJ 7201.
• RoHS Compliant
ww.Da CAPACITOR OUTLINE DRAWINGSW
w mT
.coS
L
TIN PLATE
B
NICKEL PLATE
ELECTRODES CONDUCTIVE
METALLIZATION
DIMENSIONS—MILLIMETERS ANDt4(INUCHES)EIA
eSIZE CODE
0402*
e0603*
0805*
h1206*
1210*
S1812
METRIC
SIZE CODE
(Ref only)
1005
1608
2012
3216
3225
4532
L#
LENGTH
1.0 (.04) ± .05(.002)
1.6 (.063) ± 0.15 (.006)
2.0 (.079) ± 0.2 (.008)
3.2 (.126) ± 0.2 (.008)
3.2 (.126) ± 0.2 (.008)
4.5 (.177) ± 0.3 (.012)
W#
WIDTH
0.5 (.02) ± .05 (.002)
0.8 (.032) ± 0.15 (.006)
1.25 (.049) ± 0.2 (.008)
1.6 (.063) ± 0.2 (.008)
2.5 (.098) ± 0.2 (.008)
3.2 (.126) ± 0.3 (.012)
See page 63
for thickness
dimensions.
B
BANDWIDTH
0.20 (0.008)-0.40 (0.016)
0.35 (.014) ±0.15 (.006)
0.5 (.02) ±.25 (.010)
0.5 (.02) ±.25 (.010)
0.5 (.02) ±.25 (.010)
0.6 (.024) ±.35 (.014)
1825*
ta2220
2225
4564
5650
5664
4.5 (.177) ± 0.3 (.012)
5.6 (.220) ± 0.4 (.016)
5.6 (.220) ± 0.4 (.016)
6.4 (.252) ± 0.4 (.016)
5.0 (.197) ± 0.4 (.016)
6.3 (.248) ± 0.4 (.016)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
a* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette, see page 82.)
† For extended value 1210 case size – solder reflow only.
S
MIN. SEPARATION
0.3 (.012)
0.7 (.028)
0.75 (.030)
N/A
N/A
N/A
N/A
N/A
N/A
MOUNTING
TECHNIQUE
Solder Reflow
Solder Wave †
or
Solder Reflow
Solder
Reflow
CAwPAC.IDTOR ORDERING INFORMATIONC 0805 C 103 K 5 R A C*
(Standard Chips - For
Military see page 72)
CERAMIC
wSIZE CODE
SPECIFICATION
w mC - Standard
.coCAPACITANCE CODE
Expressed in Picofarads (pF)
UFirst two digits represent significant figures.
t4Third digit specifies number of zeros. (Use 9
efor 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)
he(Example: 2.2pF = 229 or 0.50 pF = 508)
SCAPACITANCE TOLERANCE
taB – ±0.10pF J – ±5%
aC – ±0.25pF K – ±10%
D – ±0.5pF M – ±20%
.DF – ±1%
P – (GMV) – special order only
wG – ±2%
Z – +80%, -20%
ww* Part Number Example: C0805C103K5RAC
END METALLIZATION
C-Standard
(Tin-plated nickel barrier)
FAILURE RATE LEVEL
A- Not Applicable
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G – C0G (NP0) (±30 PPM/°C)
R – X7R (±15%) (-55°C + 125°C)
P– X5R (±15%) (-55°C + 85°C)
U – Z5U (+22%, -56%) (+10°C + 85°C)
V – Y5V (+22%, -82%) (-30°C + 85°C)
VOLTAGE
1 - 100V 3 - 25V
2 - 200V 4 - 16V
5 - 50V
8 - 10V
(14 digits - no spaces)
9 - 6.3V
58 KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
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