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PDF XCR5128 Data sheet ( Hoja de datos )

Número de pieza XCR5128
Descripción 128 Macrocell CPLD
Fabricantes Xilinx 
Logotipo Xilinx Logotipo



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APPLICATION NOTE
0
mR
t4U.co XCR5128: 128 Macrocell CPLDDS041 (v1.2) August 10, 2000
0 14* Product Specification
heeFeatures
taS• Industry's first TotalCMOS™ PLD - both CMOS design
aand process technologies
.D• Fast Zero Power (FZP™) design technique provides
ultra-low power and very high speed
w• IEEE 1149.1-compliant, JTAG Testing Capability
w- Four pin JTAG interface (TCK, TMS, TDI, TDO)
w m- IEEE 1149.1 TAP Controller
- JTAG commands include: Bypass, Sample/Preload,
oExtest, Usercode, Idcode, HighZ
• 5V, In-System Programmable (ISP) using the JTAG
.cinterface
- On-chip supervoltage generation
- ISP commands include: Enable, Erase, Program,
UVerify
t4- Supported by multiple ISP programming platforms
• High speed pin-to-pin delays of 7.5 ns
• Ultra-low static power of less than 100 µA
e• 100% routable with 100% utilization while all pins and
eall macrocells are fixed
• Deterministic timing model that is extremely simple to
huse
• Four clocks available
S• Programmable clock polarity at every macrocell
• Support for asynchronous clocking
ta• Innovative XPLA™ architecture combines high speed
with extreme flexibility
a• 1000 erase/program cycles guaranteed
• 20 years data retention guaranteed
.D• Logic expandable to 37 product terms
• PCI compliant
• Advanced 0.5µ E2CMOS process
w• Security bit prevents unauthorized access
• Design entry and verification using industry standard
wand Xilinx CAE tools
m• Reprogrammable using industry standard device
w oprogrammers
.c• Innovative Control Term structure provides either sum
Uterms or product terms in each logic block for:
t4- Programmable 3-state buffer
e- Asynchronous macrocell register preset/reset
e• Programmable global 3-state pin facilitates "bed of
hnails" testing without using logic resources
S• Available in PLCC, VQFP, and PQFP packages
www.Data• Available in both Commercial and Industrial grades
Description
The XCR5128 CPLD (Complex Programmable Logic
Device) is the third in a family of CoolRunner® CPLDs from
Xilinx. These devices combine high speed and zero power
in a 128 macrocell CPLD. With the FZP design technique,
the XCR5128 offers true pin-to-pin speeds of 7.5 ns, while
simultaneously delivering power that is less than 100 µA at
standby without the need for turbo bits' or other power
down schemes. By replacing conventional sense amplifier
methods for implementing product terms (a technique that
has been used in PLDs since the bipolar era) with a cas-
caded chain of pure CMOS gates, the dynamic power is
also substantially lower than any competing CPLD. These
devices are the first TotalCMOS PLDs, as they use both a
CMOS process technology and the patented full CMOS
FZP design technique. For 3V applications, Xilinx also
offers the high-speed XCR3128 CPLD that offers these
features in a full 3V implementation.
The Xilinx FZP CPLDs utilize the patented XPLA
(eXtended Programmable Logic Array) architecture. The
XPLA architecture combines the best features of both PLA
and PAL type structures to deliver high speed and flexible
logic allocation that results in superior ability to make
design changes with fixed pinouts. The XPLA structure in
each logic block provides a fast 7.5 ns PAL path with five
dedicated product terms per output. This PAL path is joined
by an additional PLA structure that deploys a pool of 32
product terms to a fully programmable OR array that can
allocate the PLA product terms to any output in the logic
block. This combination allows logic to be allocated effi-
ciently throughout the logic block and supports as many as
37 product terms on an output. The speed with which logic
is allocated from the PLA array to an output is only 2 ns,
regardless of the number of PLA product terms used, which
results in worst case tPD's of only 9.5 ns from any pin to any
other pin. In addition, logic that is common to multiple out-
puts can be placed on a single PLA product term and
shared across multiple outputs via the OR array, effectively
increasing design density.
The XCR5128 CPLDs are supported by industry standard
CAE tools (Cadence/OrCAD, Exemplar Logic, Mentor, Syn-
opsys, Synario, Viewlogic, and Synplicity), using text
(ABEL, VHDL, Verilog) and/or schematic entry. Design ver-
ification uses industry standard simulators for functional
and timing simulation. Development is supported on per-
sonal computer, Sparc, and HP platforms. Device fitting
DS041 (v1.2) August 10, 2000
www.xilinx.com
1
1-800-255-7778

1 page




XCR5128 pdf
XCR5128: 128 Macrocell CPLD
Macrocell Architecture
Figure 3 shows the architecture of the macrocell used in
the CoolRunner family. The macrocell consists of a flip-flop
that can be configured as either a D- or T- type. A D-type
flip-flop is generally more useful for implementing state
machines and data buffering. A T-type flip-flop is generally
more useful in implementing counters. All CoolRunner fam-
ily members provide both synchronous and asynchronous
clocking and provide the ability to clock off either the falling
or rising edges of these clocks. These devices are
designed such that the skew between the rising and falling
edges of a clock are minimized for clocking integrity. There
are four clocks available on the XCR5128 device. Clock 0
(CLK0) is designated as the "synchronous" clock and must
be driven by an external source. Clock 1 (CLK1), Clock 2
(CLK2), and Clock 3 (CLK3) can either be used as a syn-
chronous clock (driven by an external source) or as an
asynchronous clock (driven by a macrocell equation). The
timing for asynchronous clocks is different in that the tCO
time is extended by the amount of time that it takes for the
signal to propagate through the array and reach the clock
network, and the tSU time is reduced.
Two of the control terms (CT0 and CT1) are used to control
the Preset/Reset of the macrocells flip-flop. The Pre-
set/Reset feature for each macrocell can also be disabled.
Note that the Power-on Reset leaves all macrocells in the
"zero" state when power is properly applied. The other four
R
control terms (CT2-CT5) can be used to control the Output
Enable of the macrocells output buffers. The reason there
are as many control terms dedicated for the Output Enable
of the macrocell is to insure that all CoolRunner devices are
PCI compliant. The macrocells output buffers can also be
always enabled or disabled. All CoolRunner devices also
provide a Global 3-State (GTS) pin, which, when enabled
and pulled Low, will 3-state all the outputs of the device.
This pin is provided to support "In-Circuit Testing" or
"Bed-of-Nails Testing".
There are two feedback paths to the ZIA: one from the mac-
rocell, and one from the I/O pin. The ZIA feedback path
before the output buffer is the macrocell feedback path,
while the ZIA feedback path after the output buffer is the I/O
pin ZIA path. When the macrocell is used as an output, the
output buffer is enabled, and the macrocell feedback path
can be used to feedback the logic implemented in the mac-
rocell. When the I/O pin is used as an input, the output
buffer will be 3-stated and the input signal will be fed into
the ZIA via the I/O feedback path, and the logic imple-
mented in the buried macrocell can be fed back to the ZIA
via the macrocell feedback path. It should be noted that
unused inputs or I/Os should be properly terminated (see
the section on Terminations in this data sheet and the appli-
cation note: Terminating Unused I/O Pins in xilinx XPLA1
and XPLA2 CPLDs).
TO ZIA
PAL
PLA D/T
CLK0
CLK0
CLK1
CLK1
CLK2
CLK2
CLK3
CLK3
Figure 3: XCR5128 Macrocell Architecture
Q
INIT
(P or R)
CT0
CT1
GND
GTS
CT2
CT3
CT4
CT5
VCC
GND
GND
SP00457
5
www.xilinx.com
DS041 (v1.2) August 10, 2000
1-800-255-7778

5 Page





XCR5128 arduino
XCR5128: 128 Macrocell CPLD
Programming Specifications
R
Symbol
DC Parameters
VCCP
VCC supply program/verify
ICCP
ICC limit program/verify
VIH Input voltage (High)
VIL Input voltage (Low)
VSOL
Output voltage (Low)
VSOH
Output voltage (High)
TDO_IOL Output current (Low)
TDO_IOH Output current (High)
AC Parameters
fMAX
PWE
CLK maximum frequency
Pulse width erase
PWP
Pulse width program
PWV
Pulse width verify
INIT Initialization time
TMS_SU TMS setup time before TCK
TDI_SU TDI setup time before TCK
TMS_H TMS hold time after TCK
TDI_H TDI hold time after TCK
TDO_CO TDO valid after TCK
Parameter
Absolute Maximum Ratings1
Min.
4.5
2.0
2.4
12
-12
10
100
10
10
100
10
10
20
20
Max.
5.5
200
0.8
0.5
30
Unit
V
mA
V
V
V
V
mA
mA
MHz
ms
ms
µs
µs
ns
ns
ns
ns
ns
Symbol
Parameter
Min.
Max.
VCC Supply voltage2
-0.5 7.0
VI Input voltage
-1.2 VCC +0.5
VOUT Output voltage
-0.5 VCC +0.5
IIN Input current
-30 30
IOUT Output current
-100
100
TJ Maximum junction temperature
-40 150
Tstr Storage temperature
-65 150
Notes:
1. Stresses above those listed may cause malfunction or permanent damage to the device. This is a stress rating only.
Functional operation at these or any other condition above those indicated in the operational and programming
specification is not implied.
2. The chip supply voltage must rise monotonically.
Unit
V
V
V
mA
mA
5C
5C
Operating Range
Product Grade
Commercial
Industrial
Temperature
0 to +70°C
-40 to +85°C
Voltage
5.0V +5%
5.0V +10%
11
www.xilinx.com
DS041 (v1.2) August 10, 2000
1-800-255-7778

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