PDF KMM5364005BSW Data sheet ( Hoja de datos )

Número de pieza	KMM5364005BSW
Descripción	4MB X 36 DRAM Simm Using 4MB X 16 & Quad Cas 4MB X 4
Fabricantes	Samsung Semiconductor
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No Preview Available ! DRAM MODULE KMM5364005BSW/BSWG KMM5364005BSW/BSWG EDO Mode 4M x 36 DRAM SIMM Using 4Mx16 & Quad CAS 4Mx4, 4K Refresh, 5V GENERAL DESCRIPTION The Samsung KMM5364005B is a 4Mx36bits Dynamic RAM high density memory module. The Samsung KMM5364005B consists of two CMOS 4Mx16bits and one CMOS Quad CAS 4Mx4bits DRAMs in TSOP packages mounted on a 72-pin glass-epoxy substrate. A 0.1 or 0.22uF decoupling capacitor is mounted on the printed circuit board for each DRAM. The KMM5364005B is a Single In-line Memory Module with edge connections and is intended for mounting into 72 pin edge connector sockets. PERFORMANCE RANGE Speed -5 tRAC 50ns tCAC 13ns tRC 84ns tHPC 20ns -6 60ns 15ns 104ns 25ns FEATURES • Part Identification - KMM5364005BSW(4K cycles/64ms Ref, TSOP, Solder) - KMM5364005BSWG(4K cycles/64ms Ref, TSOP, Gold) • Extended Data Out Mode Operation • CAS-before-RAS & Hidden Refresh capability • RAS-only refresh capability • TTL compatible inputs and outputs • Single +5V±10% power supply • JEDEC standard PDpin & pinout • PCB : Height(1000mil), single sided component PIN CONFIGURATIONS Pin Symbol Pin Symbol 1 VSS 37 DQ17 2 DQ0 38 DQ35 3 DQ18 39 Vss 4 DQ1 40 CAS0 5 DQ19 41 CAS2 6 DQ2 42 CAS3 7 DQ20 43 CAS1 8 DQ3 44 RAS0 9 DQ21 45 NC 10 Vcc 46 NC 11 NC 47 W 12 A0 48 NC 13 A1 49 DQ9 14 A2 50 DQ27 15 A3 51 DQ10 16 A4 52 DQ28 17 A5 53 DQ11 18 A6 54 DQ29 19 A10 55 DQ12 20 DQ4 56 DQ30 21 DQ22 57 DQ13 22 DQ5 58 DQ31 23 DQ23 59 Vcc 24 DQ6 60 DQ32 25 DQ24 61 DQ14 26 DQ7 62 DQ33 27 DQ25 63 DQ15 28 A7 64 DQ34 29 A11 65 DQ16 30 Vcc 66 NC 31 A8 67 PD1 32 A9 68 PD2 33 NC 69 PD3 34 RAS2 70 PD4 35 DQ26 71 NC 36 DQ8 72 Vss PIN NAMES Pin Name A0 - A11 DQ0 - 35 W RAS0, RAS2 CAS0 - CAS3 PD1 -PD4 Vcc Vss NC Function Address Inputs Data In/Out Read/Write Enable Row Address Strobe Column Address Strobe Presence Detect Power(+5V) Ground No Connection PRESENCE DETECT PINS (Optional) Pin PD1 PD2 PD3 PD4 50NS Vss NC Vss Vss 60NS Vss NC NC NC SAMSUNG ELECTRONICS CO., LTD. reserves the right to change products and specifications without notice. 1 page DRAM MODULE KMM5364005BSW/BSWG AC CHARACTERISTICS (0°C≤TA≤70°C, Vcc = 5.0V±10%. See notes 1,2.) Test condition : Vih/Vil=2.6/0.8V, Voh/Vol=2.0/0.8V, output loading CL=100pF Parameter Hyper page mode cycle time CAS precharge time (Hyper page cycle) RAS pulse width (Hyper page cycle) RAS hold time from CAS precharge W to RAS precharge time(C-B-R refresh) W to RAS hold time(C-B-R refresh) Output data hold time Output buffer turn off delay from RAS Output buffer turn off delay from W W to data delay W pulse width Symbol tHPC tCP tRASP tRHCP tWRP tWRH tDOH tREZ tWEZ tWED tWPE -5 Min Max 20 8 50 200K 30 10 10 5 3 13 3 13 15 5 -6 Min Max 25 10 60 200K 35 10 10 5 3 15 3 15 15 5 Unit ns ns ns ns ns ns ns ns ns ns ns Note 11 6,12 6 NOTES 1. An initial pause of 200us is required after power-up followed by any 8 RAS-only or CAS-before-RAS refresh cycles before proper device operation is achieved. 2. Input voltage levels are Vih/Vil. VIH(min) and VIL(max) are ref- erence levels for measuring timing of input signals. Transi- tion times are measured between VIH(min) and VIL(max) and are assumed to be 5ns for all inputs. 3. Measured with a load equivalent to 2 TTL loads and 100pF. 8. Either tRCH or tRRH must be satisfied for a read cycle. 9. These parameters are referenced to the CAS leading edge in early write cycles. 10. Operation within the tRAD(max) limit insures that tRAC(max) can be met. tRAD(max) is specified as reference point only. If tRAD is greater than the specified tRAD(max) limit access time is controlled by tAA. 4. Operation within the tRCD(max) limit insures that tRAC(max) can be met. tRCD(max) is specified as a reference point only. If tRCD is greater than the specified tRCD(max) limit, then access time is controlled exclusively by tCAC. 5. Assumes that tRCD≥tRCD(max). 11. tASC≥6ns, Assume tT=2.0ns. 12. If RAS goes high before CAS high going, the open circuit condition of the output is achieved by CAS high going. If CAS goes high before RAS high going , the open circuit condition of the output is achieved by RAS going. 6. This parameter defines the time at which the output achieves the open circuit and is not referenced for VOH or VOL 7. tWCS is non-restrictive operating parameter. It is included in the data sheet as electrical characteristics only. If tWCS≥tWCS(min), the cycle is an early write cycle and the data out pin will remain high impedance for the duration of the cycle. 5 Page DRAM MODULE READ CYCLE KMM5364005BSW/BSWG VIH - RAS VIL - VIH - CAS VIL - VIH - A VIL - VIH - W VIL - VIH - OE VIL - VOH - DQ VOL - tRAS tRC tCRP tRCD tCSH tRSH tCAS tASR tRAD tRAH tASC ROW ADDRESS tCAH COLUMN ADDRESS tRAL tRCS OPEN tRAC tAA tOEA tOLZ tCAC tCLZ tRP tCRP tRRH tRCH tCEZ tOEZ tWEZ tREZ DATA-OUT Don′t care Undefined 11 Page

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