PDF KMM53632004BK Data sheet ( Hoja de datos )

Número de pieza	KMM53632004BK
Descripción	32MB X 36 DRAM Simm Using 16MB X 4 & 16MB X 1
Fabricantes	Samsung Semiconductor
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No Preview Available ! DRAM MODULE KMM53632004BK/BKG KMM53632004BK/BKG EDO Mode 32M x 36 DRAM SIMM Using 16Mx4 & 16Mx1 4K Refresh, 5V GENERAL DESCRIPTION The Samsung KMM53632004B is a 32Mx36bits Dynamic RAM high density memory module. The Samsung KMM53632004B consists of sixteen CMOS 16Mx4bits and eight CMOS 16Mx1bit DRAMs in SOJ packages mounted on a 72-pin glass-epoxy substrate. A 0.1 or 0.22uF decoupling capacitor is mounted on the printed circuit board for each DRAM. The KMM53632004B is a Single In-line Memory Mod- ule with edge connections and is intended for mounting into 72 pin edge connector sockets. PERFORMANCE RANGE Speed -5 tRAC 50ns tCAC 13ns tRC 84ns tHPC 20ns -6 60ns 15ns 104ns 25ns FEATURES • Part Identification - KMM53632004BK(4K cycles/64ms Ref, SOJ, Solder) - KMM53632004BKG(4K cycles/64ms Ref, SOJ, Gold) • Extended Out Data Mode Operation • CAS-before-RAS & Hidden Refresh capability • RAS-only refresh capability • TTL compatible inputs and outputs • Single +5V±10% power supply • JEDEC standard PDpin & pinout • PCB : Height(1420mil), double sided component PIN CONFIGURATIONS Pin Symbol Pin Symbol 1 VSS 37 DQ17 2 DQ0 38 DQ35 3 DQ18 39 Vss 4 DQ1 40 CAS0 5 DQ19 41 CAS2 6 DQ2 42 CAS3 7 DQ20 43 CAS1 8 DQ3 44 RAS0 9 DQ21 45 RAS1 10 Vcc 46 NC 11 NC 47 W 12 A0 48 NC 13 A1 49 DQ9 14 A2 50 DQ27 15 A3 51 DQ10 16 A4 52 DQ28 17 A5 53 DQ11 18 A6 54 DQ29 19 A10 55 DQ12 20 DQ4 56 DQ30 21 DQ22 57 DQ13 22 DQ5 58 DQ31 23 DQ23 59 Vcc 24 DQ6 60 DQ32 25 DQ24 61 DQ14 26 DQ7 62 DQ33 27 DQ25 63 DQ15 28 A7 64 DQ34 29 A11 65 DQ16 30 Vcc 66 NC 31 A8 67 PD1 32 A9 68 PD2 33 RAS3 69 PD3 34 RAS2 70 PD4 35 DQ26 71 NC 36 DQ8 72 Vss PIN NAMES Pin Name A0 - A11 DQ0 - 35 W RAS0 - RAS3 CAS0 - CAS3 PD1 -PD4 Vcc Vss NC Function Address Inputs Data In/Out Read/Write Enable Row Address Strobe Column Address Strobe Presence Detect Power(+5V) Ground No Connection PRESENCE DETECT PINS (Optional) Pin PD1 PD2 PD3 PD4 50NS NC Vss Vss Vss 60NS NC Vss NC NC SAMSUNG ELECTRONICS CO., LTD. reserves the right to change products and specifications without notice. 1 page DRAM MODULE KMM53632004BK/BKG AC CHARACTERISTICS (0°C≤TA≤70°C, Vcc=5.0V±10%. See notes 1,2.) Test condition : Vih/Vil=2.4/0.8V, Voh/Vol=2.0/0.8V, output loading CL=100pF Parameter Hyper page mode cycle time CAS precharge time (Hyper page cycle) RAS pulse width (Hyper page cycle) RAS hold time from CAS precharge W to RAS precharge time(C-B-R refresh) W to RAS hold time(C-B-R refresh) Output data hold time Output buffer turn off delay from RAS Output buffer turn off delay from W W to data delay W pulse width Symbol tHPC tCP tRASP tRHCP tWRP tWRH tDOH tREZ tWEZ tWED tWPE -5 Min Max 20 8 50 200K 30 10 10 5 3 13 3 13 15 5 -6 Min Max 25 10 60 200K 35 10 10 5 3 15 3 15 15 5 Unit ns ns ns ns ns ns ns ns ns ns ns Note 11 6,12 6 NOTES 1. An initial pause of 200us is required after power-up followed by any 8 RAS-only or CAS-before-RAS refresh cycles before proper device operation is achieved. 2. Input voltage levels are Vih/Vil. VIH(min) and VIL(max) are ref- erence levels for measuring timing of input signals. Transi- tion times are measured between VIH(min) and VIL(max) and are assumed to be 5ns for all inputs. 3. Measured with a load equivalent to 2 TTL loads and 100pF. 8. Either tRCH or tRRH must be satisfied for a read cycle. 9. These parameters are referenced to the CAS leading edge in early write cycles. 10. Operation within the tRAD(max) limit insures that tRAC(max) can be met. tRAD(max) is specified as reference point only. If tRAD is greater than the specified tRAD(max) limit access time is controlled by tAA. 4. Operation within the tRCD(max) limit insures that tRAC(max) can be met. tRCD(max) is specified as a reference point only. If tRCD is greater than the specified tRCD(max) limit, then access time is controlled exclusively by tCAC. 5. Assumes that tRCD≥tRCD(max). 11. tASC≥6ns, Assume tT=2.0ns. 12. If RAS goes high before CAS high going, the open circuit condition of the output is achieved by CAS high going. If CAS goes high before RAS high going , the open circuit condition of the output is achieved by RAS going. 6. This parameter defines the time at which the output achieves the open circuit and is not referenced for VOH or VOL. 7. tWCS is non-restrictive operating parameter. It is included in the data sheet as electrical characteristics only. If tWCS≥tWCS(min), the cycle is an early write cycle and the data out pin will remain high impedance for the duration of the cycle. 5 Page DRAM MODULE HYPER PAGE WRITE CYCLE ( EARLY WRITE ) NOTE : DOUT = OPEN KMM53632004BK/BKG VIH - RAS VIL - tRASP ¡ó tRHCP VIH - CAS VIL - VIH - A VIL - tCRP tASR tRCD tRAD tRAH tCSH tASC tHPC tCAS tCAH ROW ADDR. COLUMN ADDRESS tHPC tCP tCP tCAS ¡ó tRSH tCAS tASC tCAH COLUMN ADDRESS tASC tCAH ¡ó COLUMN ¡ó ADDRESS VIH - W VIL - VIH - OE VIL - VIH - DQ VIL - tWCS tWCH tWP tCWL tDS tDH VALID DATA-IN tWCS tWCH tWP ¡ó tWCS tWCH tWP tCWL ¡ó ¡ó tCWL tRWL tDS tDH VALID DATA-IN tDS tDH ¡ó VALID ¡ó DATA-IN tRP Don′t care Undefined 11 Page

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