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PDF PC8171xNSZ Data sheet ( Hoja de datos )
| Número de pieza | PC8171xNSZ | |
| Descripción | Dip 4Pin High CMR / Low Input Current Photocoupler | |
| Fabricantes | Sharp | |
| Logotipo |  |
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PC8171xNSZ
Series
PC8171xNSZ Series
DIP 4pin High CMR,
Low Input Current
Photocoupler
■ Description
PC8171xNSZ Series contains an IRED optically
coupled to a phototransistor.
It is packaged in a 4pin DIP, available in SMT gullw-
ing lead-form option.
Input-output isolation voltage(rms) is 5.0kV.
Collector-emitter voltage is 80V(*), CTR is 100% to
600% at input current of 0.5mA and CMR is MIN.
10kV/µs.
■ Features
1. 4pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
ing)
3. Low input current type (IF=0.5mA)
4. High collector-emitter voltage(VCEO : 80V(*))
5. High noise immunity due to high common rejection
voltage (CMR : MIN. 10kV/µs)
6. High isolation voltage between input and output
(Viso(rms) : 5.0 kV)
(*)Up to Date code"P7"(July 2002)VCEO : 70V.
■ Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC8171)
2. Package resin : UL flammability grade (94V-0)
■ Applications
1. Programmable controllers
2. Facsimiles
3. Telephones
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A03301EN
1 Date Sep. 30. 2003
© SHARP Corporation
1 page  
PC8171xNSZ Series
■ Model Line-up
Lead Form Through-Hole SMT Gullwing
Package
Sleeve
Taping
100pcs/sleeve 2000pcs/reel
Model No.
PC81710NSZ PC81710NIP
PC81711NSZ PC81711NIP
PC81712NSZ PC81712NIP
PC81713NSZ PC81713NIP
PC81715NSZ PC81715NIP
PC81716NSZ PC81716NIP
PC81718NSZ PC81718NIP
Rank mark
with or without
A
B
C
A or B
B or C
A, B or C
IC [mA]
(IF=0.5mA, VCE=5V, Ta=25˚C)
0.5 to 3.0
0.6 to 1.5
0.8 to 2.0
1.0 to 2.5
0.6 to 2.0
0.8 to 2.5
0.6 to 2.5
Please contact a local SHARP sales representative to inquire about production status and Lead-Free options.
Sheet No.: D2-A03301EN
5
5 Page 
PC8171xNSZ Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances:CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
Sheet No.: D2-A03301EN
11
11 Page | ||
| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet PC8171xNSZ.PDF ] | |
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