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PDF RMBA19500A Data sheet ( Hoja de datos )
| Número de pieza | RMBA19500A | |
| Descripción | PCS1900 2 Watt GaAs MMIC Power Amplifier | |
| Fabricantes | Fairchild Semiconductor | |
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May 2004
RMBA19500A
PCS1900 2 Watt GaAs MMIC Power Amplifier
General Description
The RMBA19500A is a highly linear Power Amplifier. The
two stage circuit uses our pHEMT process. It has been
designed for use as a driver stage for PCS1900 base
stations, or as the output stage for Micro- and Pico-Cell
base stations. The amplifier has been optimized for high
linearity requirements for PCS operation.
Features
• 2 Watt linear output power at 36 dBc ACPR1 for CDMA
operation
• OIP3 ≥ 43 dBm at 27 and 30 dBm output
• Small Signal Gain of > 30 dB
• Small outline SMD package
Absolute Ratings
Symbol
Vd
Vg
PIN
TC
TSTG
Parameter
Drain Supply Voltage1
Gate Supply Voltage (max absolute)
RF Input Power (from 50Ω source)
Operating Case Temperature Range
Storage Temperature Range
Ratings
+10
-5
+5
-30 to +85
-40 to +100
Units
V
V
dBm
°C
°C
Electrical Characteristics2
Parameter
Frequency Range
Gain (Small Signal) Over 1930–1990 MHz
Gain Variation
Over Frequency Range
Over Temperature Range
Noise Figure
P1dB Output
Output Power @ CDMA3
PAE @ 33 dBm Pout
OIP34
Drain Voltage (Vdd)
Gate Voltage (VG1, 2 and VG3)5
Quiescent currents (Idq1, 2 and Idq3)5
Thermal Resistance (Channel to Case) RJC
Min
1930
30
33
43
-2
Typ
±1.0
±1.5
6
30
24
45
7.0
180, 445
11
Max
1990
-0.25
Units
MHz
dB
dB
dB
dB
dBm
dBm
%
dBm
V
V
mA
°C/W
Notes:
1. Only under quienscent conditions—no RF applied.
2. VDD = 7.0V, TC = 25°C. Part mounted on evaluation board with input and output matching to 50Ω.
3. 9 Channel Forward Link QPSK Source; 1.23 Mbps modulation rate. CDMA ACPR1 is measured using the ratio of the average power within the 1.23 MHz channel
at band center to the average power within a 30 KHz bandwidth at an 885 KHz offset. Minimum CDMA output power is met with ACPR1 > 36 dBc.
4. OIP3 specifications are achieved for power output levels of 27 and 30 dBm per tone with tone spacing of 1.25 MHz at band-center with adjusted supply and bias
conditions of Vdd = 6.5V and IdqTotal = 625mA (see Note 5).
5. VG1,2 and VG3 must be individually adjusted to achieve IDQ1,2 and IDQ3. A single VGG bias supply adjusted to achieve IDQTOTAL = 625mA can be used with
nearly equivalent performance. Values for IDQ1,2 and IDQ3 shown have been optimized for CDMA operation. IDQ1, 2 and IDQ3 (or IDQTOTAL) can be adjusted
to optimize the linearity of the amplifier for other modulation systems.
The device requires external input and output matching to 50Ω as shown in Figure 3 and the Parts List.
©2004 Fairchild Semiconductor Corporation
RMBA19500A Rev. C
1 page  
Parts List for Test Evaluation Board (RMBA19500A-TB, G654188/G654942)
Part
L1, L2, L4
L3
C1
C9
C3, C4, C5
C10
C2
C8, C11, C14, C15
C6, C7
R1, R5
R2, R7
R3
R4
R6
R8
R9
U1
HS
P1
J1, J2
Board
Value
5.6nH
10nH
10pF
2.2pF
1500pF
2.0pF
15.0pF
4.7µF
0.1µF
20Ω
1000Ω
910Ω
30Ω
1.1KΩ
390Ω
300Ω
RMBA19500-58
Heatsink
Terminals
SMA Connectors
FR4
Size (EIA)
.06" x .03"
.085" x .060"
.067" x .036"
.042" x .022"
.067" x .036"
.042" x .022"
.134" x .071"
.183" x .054"
.069" x .037"
.069" x .037"
.069" x .037"
.069" x .037"
.069" x .037"
.31" x .41"
Vendor(s)
Toko (LL1608-F5N6)
Coilcraft (0805HT-10NTKBC)
Murata (GRM39COG100J050AD)
Murata (GRM36COG2R2J050BD)
Murata (GRM39Y5V152Z50V)
Murata (GRM36COG2R20J050BD)
Murata (GRM36COG150J050)
TDK (C3216XR1A475KT)
Murata (GRM39Y5V104Z50)
IMS (RCI-0603-20R0J)
IMS (RCI-0603-1001J)
IMS (RCI-0603-9100J)
IMS (RCI-0603-30R0J)
IMS (RCI-0603-1101J)
IMS (RCI-0603-3900J)
IMS (RCI-0603-3000J)
Fairchild
Fairchild, G655548
3M (2340-5211TN)
E.F. Johnson (142-0701-841)
Fairchild Dwg# G654187/G654941
Thermal Considerations for Heat Sinking the RMBA19500
The PWB must be prepared with either an embedded
copper slug in the board where the package is to be
mounted or a heat sink should be attached to the backside
of the PWB where the package is to be mounted on the
front side. The slug or the heat sink should be made of a
highly electrically and thermally conductive material such
as copper or aluminum. The slug should be at least the
same thickness as the PWB. In the case of the heat sink, a
small pedestal should protrude through a hole in the PWB
where the package bottom is directly soldered. In either
configuration, the top surface of the slug or the pedestal
should be made coplanar with the package lead mounting
plane i.e., the top surface of the PWB. Use Sn96 solder
(96.5% Sn and 3.5% Ag) at 220°C for 20 seconds or less to
attach the heat sink to the backside of the PWB. Then,
using Sn63, the package bottom should be firmly soldered
to the slug or the pedestal while the pins are soldered to the
respective pads on the front side of the PWB without
causing any stress on the pins. Remove flux completely if
used for soldering.
©2004 Fairchild Semiconductor Corporation
RMBA19500A Rev. C
5 Page | ||
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| PDF Descargar | [ Datasheet RMBA19500A.PDF ] | |
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