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PDF KMPC870 Data sheet ( Hoja de datos )
| Número de pieza | KMPC870 | |
| Descripción | (KMPC870 / KMPC875) Hardware Specifications | |
| Fabricantes | ETC | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de KMPC870 (archivo pdf) en la parte inferior de esta página. Total 70 Páginas | ||
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Freescale Semiconductor
MPC875EC
Rev. 3.0, 07/2004
MPC875/MPC870
Hardware Specifications
This hardware specification contains detailed information on
power considerations, DC/AC electrical characteristics, and AC
timing specifications for the MPC875/MPC870. The CPU on the
MPC875/MPC870 is a 32-bit PowerPC™ core that incorporates
memory management units (MMUs) and instruction and data
caches and that implements the PowerPC instruction set. This
hardware specification covers the following topics:
1 Overview
The MPC875/MPC870 is a versatile single-chip integrated
microprocessor and peripheral combination that can be used in a
variety of controller applications and communications and
networking systems. The MPC875/MPC870 provides enhanced
ATM functionality over that of other ATM-enabled members of
the MPC860 family.
Contents
1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3. Maximum Tolerated Ratings . . . . . . . . . . . . . . . . . . . 7
4. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . 9
5. Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
6. DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 10
7. Thermal Calculation and Measurement . . . . . . . . . . 11
8. Power Supply and Power Sequencing . . . . . . . . . . . 13
9. Mandatory Reset Configurations . . . . . . . . . . . . . . . 14
10. Layout Practices . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
11. Bus Signal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 15
12. IEEE 1149.1 Electrical Specifications . . . . . . . . . . . 44
13. CPM Electrical Characteristics . . . . . . . . . . . . . . . . . 46
14. USB Electrical Characteristics . . . . . . . . . . . . . . . . . 67
15. FEC Electrical Characteristics . . . . . . . . . . . . . . . . . 67
16. Mechanical Data and Ordering Information . . . . . . . 71
17. Document Revision History . . . . . . . . . . . . . . . . . . . 82
© Freescale Semiconductor, Inc., 2004. All rights reserved.
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
1 page  
Features
– CRC16 generation and checking
– CRC5 checking
– NRZI encoding/decoding with bit stuffing
– 12- or 1.5-Mbps data rate
– Flexible data buffers with multiple buffers per frame
– Automatic retransmission upon transmit error
— The USB host controller has the following features:
– Supports control, bulk, interrupt, and isochronous data transfers
– CRC16 generation and checking
– NRZI encoding/decoding with bit stuffing
– Supports both 12- and 1.5-Mbps data rates (automatic generation of preamble token and data
rate configuration). Note that low-speed operation requires an external hub.
– Flexible data buffers with multiple buffers per frame
– Supports local loopback mode for diagnostics (12 Mbps only)
• Serial peripheral interface (SPI)
— Supports master and slave modes
— Supports multiple-master operation on the same bus
• Inter-integrated circuit (I2C) port
— Supports master and slave modes
— Supports a multiple-master environment
• The MPC875 has a time-slot assigner (TSA) that supports one TDM bus (TDMb).
— Allows SCC and SMC to run in multiplexed and/or non-multiplexed operation
— Supports T1, CEPT, PCM highway, ISDN basic rate, ISDN primary rate, user defined
— 1- or 8-bit resolution
— Allows independent transmit and receive routing, frame synchronization, and clocking
— Allows dynamic changes
— Can be internally connected to two serial channels (one SCC and one SMC)
• PCMCIA interface
— Master (socket) interface, release 2.1-compliant
— Supports one independent PCMCIA socket on the MPC875/MPC870
— 8 memory or I/O windows supported
• Debug interface
— Eight comparators: four operate on instruction address, two operate on data address, and two
operate on data
— Supports conditions: = ≠ < >
— Each watchpoint can generate a break point internally.
• Normal high and normal low power modes to conserve power
• 1.8-V core and 3.3-V I/O operation with 5-V TTL compatibility
• The MPC875/870 comes in a 256-pin ball grid array (PBGA) package.
Freescale Semiconductor
MPC875/MPC870 Hardware Specifications, Rev. 3.0
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
5
5 Page 
Thermal Calculation and Measurement
4 Input capacitance is periodically sampled.
5 A(0:31), TSIZ0/REG, TSIZ1, D(0:31), IRQ(2:4), IRQ6, RD/WR, BURST, IP_B(0:1), PA(0:4), PA(6:7), PA(10:11), PA15,
PB19, PB(23:31), PC(6:7), PC(10:13), PC15, PD8, PE(14:31), MII1_CRS, MII_MDIO, MII1_TXEN, MII1_COL.
6 BDIP/GPL_B(5), BR, BG, FRZ/IRQ6, CS(0:7), WE(0:3), BS_A(0:3), GPL_A0/GPL_B0, OE/GPL_A1/GPL_B1,
GPL_A(2:3)/GPL_B(2:3)/CS(2:3), UPWAITA/GPL_A4, UPWAITB/GPL_B4, GPL_A5, ALE_A, CE1_A, CE2_A,
OP(0:3) BADDR(28:30
7 Thermal Calculation and Measurement
For the following discussions, PD = (VDDL × IDDL) + PI/O, where PI/O is the power dissipation of the I/O
drivers.
NOTE
The VDDSYN power dissipation is negligible.
7.1 Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, TJ, in °C can be obtained from the following equation:
TJ = TA + (RθJA × PD)
where:
TA = ambient temperature ºC
RθJA = package junction-to-ambient thermal resistance (ºC/W)
PD = power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy
estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated
that errors of a factor of two (in the quantity TJ–TA) are possible.
7.2 Estimation with Junction-to-Case Thermal Resistance
Historically, thermal resistance has frequently been expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA = junction-to-ambient thermal resistance (ºC/W)
RθJC = junction-to-case thermal resistance (ºC/W)
RθCA = case-to-ambient thermal resistance (ºC/W)
RθJC is device-related and cannot be influenced by the user. The user adjusts the thermal environment to
affect the case-to-ambient thermal resistance, RθCA. For instance, the user can change the airflow around
the device, add a heat sink, change the mounting arrangement on the printed circuit board, or change the
thermal dissipation on the printed circuit board surrounding the device. This thermal model is most useful
for ceramic packages with heat sinks where some 90% of the heat flows through the case and the heat sink
to the ambient environment. For most packages, a better model is required.
Freescale Semiconductor
MPC875/MPC870 Hardware Specifications, Rev. 3.0
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
11
11 Page | ||
| Páginas | Total 70 Páginas | |
| PDF Descargar | [ Datasheet KMPC870.PDF ] | |
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