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PDF UAA2077TS Data sheet ( Hoja de datos )

Número de pieza UAA2077TS
Descripción 2 GHz image rejecting front-end
Fabricantes NXP Semiconductors 
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No Preview Available ! UAA2077TS Hoja de datos, Descripción, Manual

INTEGRATED CIRCUITS
DATA SHEET
UAA2077TS
2 GHz image rejecting front-end
Preliminary specification
Supersedes data of 2000 Mar 09
File under Integrated Circuits, IC17
2000 Apr 17

1 page




UAA2077TS pdf
Philips Semiconductors
2 GHz image rejecting front-end
Preliminary specification
UAA2077TS
Local oscillator section
The LO input directly drives the two internal all-pass
networks to provide the quadrature signals for the mixers
(see Fig.4).
The SX mode (see Table 1) is used to activate the
LO section, thus minimizing pulling of the external Voltage
Controlled Oscillator (VCO) when enabling the receive
section. The SX mode is active when the logic level on pin
SXON is HIGH.
Table 1 Operating modes
LOGIC LEVEL
PIN RXON PIN SXON
MODE
LOW
LOW Power-down mode
HIGH
LOW
RX mode; receive section
active
LOW
HIGH SX mode; LO section active
HIGH
HIGH SRX mode; both sections
active
handbook, halfpage
to receive section
VCCLO
LOGND
GND
13
14
135°
45°
QUADRATURE
UAA2077TS
9
PHASE
SHIFTER
7
SXON
11 12
LOINB LOINA
FCA014
Fig.4 LO section.
2000 Apr 17
5

5 Page





UAA2077TS arduino
Philips Semiconductors
2 GHz image rejecting front-end
Preliminary specification
UAA2077TS
Suitability of surface mount IC packages for wave and reflow soldering methods
PACKAGE
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC(3), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
SOLDERING METHOD
WAVE
REFLOW(1)
not suitable
suitable
not suitable(2)
suitable
suitable
suitable
not recommended(3)(4) suitable
not recommended(5) suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2000 Apr 17
11

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