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PDF UC3708 Data sheet ( Hoja de datos )

Número de pieza UC3708
Descripción Dual Non-Inverting Power Driver
Fabricantes Unitrode 
Logotipo Unitrode Logotipo



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No Preview Available ! UC3708 Hoja de datos, Descripción, Manual

Dual Non-Inverting Power Driver
UC1708
UC2708
UC3708
FEATURES
3.0A Peak Current Totem Pole
Output
5 to 35V Operation
25ns Rise and Fall Times
25ns Propagation Delays
Thermal Shutdown and Under-
Voltage Protection
High-Speed, Power MOSFET
Compatible
Efficient High Frequency Operation
Low Cross-Conduction Current Spike
Enable and Shutdown Functions
Wide Input Voltage Range
ESD Protection to 2kV
BLOCK DIAGRAM
DESCRIPTION
The UC1708 family of power drivers is made with a high-speed, high-
voltage, Schottky process to interface control functions and high-power
switching devices – particularly power MOSFETs. Operating over a 5 to
35 volt supply range, these devices contain two independent channels.
The A and B inputs are compatible with TTL and CMOS logic families,
but can withstand input voltages as high as VIN. Each output can source
or sink up to 3A as long as power dissipation limits are not exceeded.
Although each output can be activated independently with its own inputs,
they can be forced low in common through the action of either a digital
high signal at the Shutdown terminal or by forcing the Enable terminal
low. The Shutdown terminal will only force the outputs low, it will not ef-
fect the behavior of the rest of the device. The Enable terminal effectively
places the device in under-voltage lockout, reducing power consumption
by as much as 90%. During under-voltage and disable (Enable terminal
forced low) conditions, the outputs are held in a self-biasing, low-voltage,
state.
The UC3708 and UC2708 are available in plastic 8-pin MINIDIP and 16-
pin "bat-wing" DIP packages for commercial operation over a 0oC to
+70oC temperature range and industrial temperature range of -25oC to
+85oC respectively. For operation over a -55oC to +125oC temperature
range, the UC1708 is available in hermetically sealed 8-pin MINIDIP and
16 pin DIP packages. Surface mount devices are also available.
Note: Shutdown feature available only in JE , NE or DW packages.
3/97
1
UDG-92024-1

1 page




UC3708 pdf
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright © 1999, Texas Instruments Incorporated

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