PDF BGW200 Data sheet ( Hoja de datos )

Número de pieza	BGW200
Descripción	Low Power WLAN SiP
Fabricantes	Philips
Logotipo
Hay una vista previa y un enlace de descarga de BGW200 (archivo pdf) en la parte inferior de esta página. Total 4 Páginas
No Preview Available ! BGW200 Low-power WLAN SiP Complete, single-package 802.11b solution for mobile handheld devices Optimized for low-power mobile applications, this complete, single-package 802.11b solution combines a baseband/MAC, RF transceiver, and power ampliﬁer into an ultra-small (150 mm2) package. It delivers the industry’s lowest power consumption in standby mode and supports coexistence with Bluetooth® solutions. Semiconductors The BGW200 is a complete, low-power 802.11b Wireless LAN (WLAN) System-in-a-Package (SiP) solution optimized for battery-powered hand- held devices. It enables consumers to connect to the growing number of WLAN networks in ofﬁces, homes, and public places. It also allows service providers to increase their network reach and customer base, enabling complementary data and voice services across cellular/PCS and WLAN networks. Coexistence support for Bluetooth 1.1 and 1.2 enables seamless integration with Philips Bluetooth solutions. Key features • Advanced, single-package WLAN SiP optimized for mobile handheld devices – No RF-critical design required – Low total cost of ownership • Lowest power consumption in standby mode: < 2 mW (typ) • Ultra-small form factor – Low-proﬁle 68-pin HVQFN-like SiP package (10 x 15 x 1.3 mm) – Only three external components for entire solution • “No Host Load” design delivers easy integration and longer battery life – Host processor sleeps while BGW200 processes beacons – BGW200 wakes the host processor only upon data packet arrival • Co-exists with Bluetooth 1.1 and 1.2 • Complete software drivers, utility, and diagnostic tools Applications • Smartphones, cellular phones,VoIP wireless phones • PDAs, handheld computing devices,WLAN adapter cards (Secure Digital) • Portable audio/video devices, MP3 players • Other handhelds and electronic devices for wireless digital, audio, multi- media, and telephony The SiP format, with its complete system functionality, delivers quicker design cycles, lower risk, simpliﬁed manufacturing, and a reduced bill of materials.The single-package format also simpliﬁes assembly and testing, and reduces yield losses.The SiP delivers a complete, fully tested imple- mentation of 802.11b functionality, so development teams can focus their energy on innovative product design instead of solving complex issues related to RF layout. Ultra-small footprint, ultra-low power consumption The BGW200 uses a single, 68-pin HVQFN-like package that measures only 10 x 15 x 1.3 mm.The entire 802.11b solution requires only three external components and uses less than 180 mm2 of circuit board area. The BGW200 incorporates several features that decreases power con- sumption.There is an integrated ARM7 processor, 1.25 Mbytes of SRAM, 256 Kbytes of ROM, optimized host interfaces (SDIO/SPI), and integrated power management hardware/software algorithms.The result is the lowest standby power consumption in the industry (less than 2 mW). Superior “No Host Load” Architecture The BGW200 is designed to place no load on the host processor, so mobile devices can integrate WLAN functionality without compromis- ing application performance or battery life.The BGW200 only interfaces 1 page

Páginas	Total 4 Páginas
PDF Descargar	[ Datasheet BGW200.PDF ]

Hoja de datos destacado

Número de pieza	Descripción	Fabricantes
BGW200	Low Power WLAN SiP	Philips

Número de pieza	Descripción	Fabricantes
SLA6805M	High Voltage 3 phase Motor Driver IC.	Sanken
SDC1742	12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters.	Analog Devices

DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares,
permitiéndote verlos en linea o descargarlos en PDF.

DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar