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PDF UAA3540TS Data sheet ( Hoja de datos )
| Número de pieza | UAA3540TS | |
| Descripción | DECT receiver | |
| Fabricantes | Philips | |
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INTEGRATED CIRCUITS
DATA SHEET
UAA3540TS
DECT receiver
Product specification
File under Integrated Circuits, IC17
2000 Feb 15
1 page  
Philips Semiconductors
DECT receiver
Product specification
UAA3540TS
FUNCTIONAL DESCRIPTION
General
The UAA3540TS is a fully integrated RF plus IF strip and
demodulator for DECT applications. It provides all the
required channel filtering over the DECT band and
generates analog RSSI and a data output for the
baseband chip. Very few off-chip components are required
and should not require trimming in normal applications.
The chip is designed to operate from a power supply
voltage which can fall to 3.0 V, and features full
power-down capabilities.
The inputs are an RF antenna signal and a Local
Oscillator (LO) signal. The RF antenna signal is from a
band filter or antenna switch. The higher frequency
LO signal is from an external Voltage Controlled
Oscillator (VCO).
The outputs are an RSSI voltage, representing the
instantaneous signal strength, and DATA− and DATA+
which are two high-level demodulator output signals.
DATA− is switched by SLCCTR to generate a threshold
voltage for the internal slicer, and DATA+ is the
comparator digital output.
Filter
The integrated filter provides all the channel selectivity
required for the DECT receiver. An external resistor of
18 kΩ must be connected to RSET (pin 8).
Limiter and RSSI
The main purpose of the limiter circuit is to reduce the
dynamic range of the signals presented to the
demodulator; these have a dynamic range greater than
60 dB.
The limiter also provides the RSSI output voltage.
The RSSI output has very little filtering applied, and it is
assumed that external circuits will be used to provide the
time constant and peak holding required by the DECT
specification.
Demodulator
The demodulator produces an output voltage directly
proportional to the instantaneous frequency of the
received signal. The output stage of the demodulator
contains a data filter to remove high frequencies from the
signal, prior to data slicing.
The demodulator provides a continuous output timing
signal that is applied to an internal data slicer. The same
signal is also switched to generate the threshold voltage of
the slicer during the initial DECT bit sequence.
Power-down
The power-down control input (pin 2) allows the current
consumption of the chip to be reduced to a very low level
when it is connected to VCC. In this state, some voltages in
the chip become indeterminate requiring time for the
receiver to stabilize after power-up.
2000 Feb 15
5
5 Page 
Philips Semiconductors
DECT receiver
Product specification
UAA3540TS
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
2000 Feb 15
11
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet UAA3540TS.PDF ] | |
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