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PDF UPC1555 Data sheet ( Hoja de datos )

Número de pieza UPC1555
Descripción Timer Circuit
Fabricantes NEC 
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No Preview Available ! UPC1555 Hoja de datos, Descripción, Manual

DATA SHEET
MOS INTEGRATED CIRCUIT
Bipolar Analog Integrated Circuit
µPC1555
TIMER CIRCUIT
The µPC1555 is a powerful integrated circuit. Adding a few external parts to it can turn it into various types of
timing signal generators, such as monostable and astable multivibrators. It has trigger, threshold, and control pins.
Inputting a signal to the reset pin can stop the circuit operation easily. In addition, the output can sink current as high
as 200 mA (maximum). So, it can be used to drive relays and lamps.
TYPICAL CHARACTERISTICS
• Supply voltage
: 4.5 to 16 V
• Circuit current (VCC = 5 V) : 3 mA
• Output current capacity : 200 mA
• Temperature stability
: 0.005%/°C
• Rising and falling time : 100 ns
FEATURES
• Monostable and astable oscillation
• Interfacing directly with TTL-level signals
• Variable duty cycle
ORDERING INFORMATION
Part number
Package
µPC1555C 8-pin plastic DIP (300 mil)
µPC1555G2 8-pin plastic SOP (225 mil)
PIN CONFIGURATION (TOP VIEW)
GND 1
8 VCC
Trigger 2 COMP
Flip-flop
Output 3
Output
stage
R 7 Discharge
R
COMP 6 Threshold
R
Reset 4
VREF
5 Control voltage
EQUIVALENT CIRCUIT
8
VCC
R2
1 k
Q6 Q5
Q11
R3
5 k
6
Q1 Q4
Threshold 2 Q2 Q3
5(3VCC)
Control
1
R1
10 k
GND
R4
5 k
Q15 Q16
2
Trigger
Q8 Q9
Q7 Q10
Reset 4
7
Discharge
Q14
Q25
Q12 Q13 R5
5 k
R11
Q22
6.2
k
R6
7.5k
Q21
Q27
R12
3.9
k
Q28
Q17
R7
4.7 k
3
Q24 Output
Q19
Q18
Q20 R10
Q23 120
R8
100
Q26
R9
3.3k
Document No. G10649EJ6V0DS00 (6th edition)
(Previous No. IC-1979)
Date Published November 1995 P
Printed in Japan
©
1986

1 page




UPC1555 pdf
Propagation delay characteristic
1.2
TA = 25°C
1.0
0.8
VCC = 5 V
0.6
0.4
VCC = 10 V,15 V
0.2
0
0.1 0.2 0.3
Minimum trigger pulse voltage (×VCC)
PT-TA characteristic
700
600 C
500
G
400
300
200
100
10
20 40 60 80 100
Ambient temperature TA (°C)
vtW-ttr min. characteristic
7
VCC = 15 V
tW(tr) = 5 sµ
6
5
4
3
2
1
0
12345
Minimum trigger pulse voltage Vtr min. (V)
µPC1555
Discharge pin ISINK-VSAT characteristic
1000
VCC = 5 V
100 TA = 70°C
10 25°C
–20°C
1.0
0.01 0.1 1 10 100
Discharge pin (pin 7) sink current ISINK (mA)
vtW-tW (tr) characteristic
5
VCC = 15 V
Vtr min = 2.5 V
4
3
2
1
0
2 4 6 8 10
Trigger pulse width tW (tr) (µs)
5

5 Page





UPC1555 arduino
µPC1555
RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the µPC1555.
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under
different conditions.
Surface-Mount Devices
For details of the recommended soldering conditions, refer to our document SMD Surface Mount Technology
Manual (IEI-1207).
µPC1555G2
Soldering process
Infrared reflow
VPS
Wave soldering
Partial heating method
Soldering conditions
Peak package’s surface temperature: 230°C
Reflow time: 30 seconds or less (at 210°C or more)
Maximum allowable number of reflow processes: 1
Exposure limit: NoneNote
Peak package’s surface temperature: 215°C
Reflow time: 40 seconds or less (at 200°C or more)
Maximum allowable number of reflow processes: 1
Exposure limit: NoneNote
Temperature in the soldering vessel: 260°C or less
Soldering time: 10 seconds or less
Maximum allowable number of reflow processes: 1
Exposure limit: NoneNote
Pin temperature: 300°C or less
Flow time: 10 seconds or less
Exposure limit: NoneNote
Symbol
IR30-00
VP15-00
WS60-00
Note Exposure limit before soldering after dry-pack package is opened.
Storage conditions: Temperature of 25°C or less and maximum relative humidity of 65% or less
Caution Do not apply more than a single process at once, except for “Partial heating method.”
Through-Hole Mount Devices
µPC1555C
Soldering process
Wave soldering
Soldering conditions
Temperature in the soldering vessel: 260°C or less
Soldering time: 10 seconds or less
REFERENCE
Document name
NEC Semiconductor Device Reliability/Quality Control System
Quality Grade on NEC Semiconductor Devices
Semiconductor Device Mounting Technology Manual
Semiconductor Device Package Manual
Guide to Quality Assurance for Semiconductor Devices
Semiconductor Selection Guide
Document No.
IEI-1212
IEI-1209
IEI-1207
IEI-1213
MEI-1202
MF-1134
11

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