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PDF 27LV64 Data sheet ( Hoja de datos )
| Número de pieza | 27LV64 | |
| Descripción | 64K (8K x 8) Low-Voltage CMOS EPROM | |
| Fabricantes | Microchip Technology | |
| Logotipo |  |
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27LV64
64K (8K x 8) Low-Voltage CMOS EPROM
FEATURES
• Wide voltage range 3.0V to 5.5V
• High speed performance
- 200 ns access time available at 3.0V
• CMOS Technology for low power consumption
- 8 mA active current at 3.0V
- 20 mA active current at 5.5V
- 100 µA standby current
• Factory programming available
• Auto-insertion-compatible plastic packages
• Auto ID aids automated programming
• Separate chip enable and output enable controls
• High speed “express” programming algorithm
• Organized 8K x 8: JEDEC standard pinouts
- 28-pin Dual-in-line package
- 32-pin PLCC Package
- 28-pin SOIC package
- Tape and reel
• Available for the following temperature ranges:
- Commercial: 0˚C to +70˚C
- Industrial:
-40˚C to +85˚C
DESCRIPTION
The Microchip Technology Inc. 27LV64 is a low-voltage
(3.0 volt) CMOS EPROM designed for battery powered
applications. The device is organized as 8K x 8 (8K-
Byte) non-volatile memory product. The 27LV64 con-
sumes only 8mA maximum of active current during a
3.0 volt read operation therefore improving battery per-
formance. This device is designed for very low voltage
applications where conventional 5.0 volt only EPROMs
can not be used. Accessing individual bytes from an
address transition or from power-up (chip enable pin
going low) is accomplished in less than 200 ns at
3.0V.This device allows system designers the ability to
use low voltage non-volatile memory with today’s low
voltage microprocessors and peripherals in battery
powered applications.
A complete family of packages is offered to provide the
most flexibility in applications. For surface mount appli-
cations, PLCC or SOIC packaging is available. Tape
and reel packaging is also available for PLCC or SOIC
packages.
PACKAGE TYPES
DIP/SOIC
VPP • 1
A12 2
A7 3
A6 4
A5 5
A4 6
A3 7
A2 8
A1 9
A0 10
O0 11
O1 12
O2 13
VSS 14
28 VCC
27 PGM
26 NC
25 A8
24 A9
23 A11
22 OE
21 A10
20 CE
19 O7
18 O6
17 O5
16 O4
15 O3
PLCC
A6 5
A5 6
A4 7
A3 8
A2 9
A1 10
A0 11
NC 12
O0 13
29 A8
28 A9
27 A11
26 NC
25 OE
24 A10
23 CE
22 O7
21 O6
© 1996 Microchip Technology Inc.
This document was created with FrameMaker 4 0 4
DS11024E-page 1
1 page  
27LV64
FIGURE 1-2: PROGRAMMING WAVEFORMS (1)
VIH
Address
VIL
VIH
Data
VIL
13.0 V (3)
VPP
5.0 V
Program
Address Stable
tAS
Data In Stable
tDS tDH
tVPS
High Z
Verify
t AH
Data Out Valid
t DF
(2)
6.5 V (3)
VCC
5.0 V
tVCS
VIH
CE
VIL
VIH
PGM
VIL
VIH
OE
VIL
tCES
tPW
tOPW
t OES
t OE
(2)
Notes: (1) The input timing reference is 0.8V for VIL and 2.0V for VIH.
(2) tDF and tOE are characteristics of the device but must be accommodated by the programmer.
(3) Vcc = 6.5V ±0.25V, V PP = VH = 13.0V ±0.25V for Express algorithm.
TABLE 1-6: MODES
Operation Mode
Read
Program
Program Verify
Program Inhibit
Standby
Output Disable
Identity
X = Don’t Care
CE
VIL
VIL
VIL
VIH
VIH
VIL
VIL
OE
VIL
VIH
VIL
X
X
VIH
VIL
PGM
VIH
VIL
VIH
X
X
VIH
VIH
VPP
VCC
VH
VH
VH
VCC
VCC
VCC
A9
X
X
X
X
X
X
VH
O0 - O7
DOUT
DIN
DOUT
High Z
High Z
High Z
Identity Code
1.2 Read Mode
(See Timing Diagrams and AC Characteristics)
Read Mode is accessed when
a) the CE pin is low to power up (enable) the chip
b) the OE pin is low to gate the data to the output
pins
For Read operations, if the addresses are stable, the
address access time (tACC) is equal to the delay from
CE to output (tCE). Data is transferred to the output
after a delay from the falling edge of OE (tOE).
© 1996 Microchip Technology Inc.
DS11024E-page 5
5 Page 
27LV64
27LV64 Product Identification System
To order or to obtain information, e.g., on pricing or delivery, please use the listed part numbers, and refer to the factory or the listed
sales offices.
27LV64 – 25 I /P
Package:
L = Plastic Leaded Chip Carrier
P = Plastic DIP (600 Mil)
SO = Plastic SOIC (300 Mil)
Temperature
Range:
Blank = 0˚C to +70˚C
I = –40˚C to +85˚C
Access
Time:
20 = 200 ns
25 = 250 ns
30 = 300 ns
Device:
27LV64 64K (8K x 8) Low-Voltage CMOS EPROM
© 1996 Microchip Technology Inc.
DS11024E-page 11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet 27LV64.PDF ] | |
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