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P01 Series
Fig. 10: On-state characteristics (maximum
values).
Fig. 11: SOT-223 Thermal resistance junction to
ambient versus copper surface under tab (Epoxy
printed circuit board FR4, copper thickness:
35 µm).
ITM(A)
1E+1
Ω
1E+0
1E-1
VTM(V)
1E-2
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
Rth(j-a) (°C/W)
130
120
110
100
90
80
70
60
50
40
30
20
10 S (cm2)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
PACKAGE MECHANICAL DATA
TO-92 (Plastic)
A
BC
F
D
E
DIMENSIONS
REF.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
a
A
1.35
0.053
B
4.70
0.185
C 2.54
0.100
D 4.40
0.173
E 12.70
0.500
F
3.70
0.146
a
0.50
0.019
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