|
|
PDF OPA549 Data sheet ( Hoja de datos )
| Número de pieza | OPA549 | |
| Descripción | High-Voltage / High-Current OPERATIONAL AMPLIFIER | |
| Fabricantes | Burr-Brown | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de OPA549 (archivo pdf) en la parte inferior de esta página. Total 14 Páginas | ||
|
No Preview Available !
®
OPA549
OPA549
For most current data sheet and other product
information, visit www.burr-brown.com
High-Voltage, High-Current
OPERATIONAL AMPLIFIER
FEATURES
q HIGH OUTPUT CURRENT:
8A Continuous
10A Peak
q WIDE POWER SUPPLY RANGE:
Single Supply: +8V to +60V
Dual Supply: ±4V to ±30V
q WIDE OUTPUT VOLTAGE SWING
q FULLY PROTECTED:
Thermal Shutdown
Adjustable Current Limit
q OUTPUT DISABLE CONTROL
q THERMAL SHUTDOWN INDICATOR
q HIGH SLEW RATE: 9V/µs
q CONTROL REFERENCE PIN
q 11-LEAD POWER ZIP PACKAGE
APPLICATIONS
q VALVE, ACTUATOR DRIVER
q SYNCHRO, SERVO DRIVER
q POWER SUPPLIES
q TEST EQUIPMENT
q TRANSDUCER EXCITATION
q AUDIO POWER AMPLIFIER
V+
DESCRIPTION
The OPA549 is a low-cost, high-voltage/high-current
operational amplifier ideal for driving a wide variety
of loads. This laser-trimmed monolithic integrated
circuit provides excellent low-level signal accuracy,
and high output voltage and current.
The OPA549 operates from either single or dual sup-
plies for design flexibility. The input common-mode
range extends below the negative supply.
The OPA549 is internally protected against over-
temperature conditions and current overloads. In addi-
tion, the OPA549 provides an accurate, user-selected
current limit. Unlike other designs which use a “power”
resistor in series with the output current path, the
OPA549 senses the load indirectly. This allows the
current limit to be adjusted from 0A to 10A with a
resistor/potentiometer, or controlled digitally with a
voltage-out or current-out DAC.
The Enable/Status (E/S) pin provides two functions. It
can be monitored to determine if the device is in
thermal shutdown, and it can be forced low to disable
the output stage and effectively disconnect the load.
The OPA549 is available in an 11-lead power ZIP
package. Its copper tab allows easy mounting to a heat
sink for excellent thermal performance. Operation is
specified over the extended industrial temperature
range, –40°C to +85°C.
OPA549
Ref
ILIM
RCL
VO
RCL sets the current limit
value from 0A to 10A.
(Very Low Power Dissipation)
ES Pin
E/S
Forced Low: Output disabled
Indicates Low: Thermal shutdown
V–
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111
Twx: 910-952-1111 • Internet: http://www.burr-brown.com/ • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
©1999 Burr-Brown Corporation
PDS-11450A
OPA549Printed in U.S.A. November, 1999
®
1 page  
TYPICAL PERFORMANCE CURVES (Cont.)
At TCASE = +25°C, VS = ±30V and E/S pin open, unless otherwise noted.
COMMON-MODE REJECTION RATIO vs FREQUENCY
100
90
80
70
60
50
40
10
100 1k 10k
Frequency (Hz)
100k
120
100
80
60
40
20
0
10
POWER SUPPLY REJECTION RATIO
vs FREQUENCY
+PSRR
–PSRR
100 1k 10k 100k 1M
Frequency (Hz)
300
250
200
150
100
50
0
1
VOLTAGE NOISE DENSITY vs FREQUENCY
10 100 1k 10k 100k
Frequency (Hz)
OPEN-LOOP GAIN, COMMON-MODE REJECTION RATIO
AND POWER SUPPLY REJECTION RATIO
vs TEMPERATURE
120
110
100
90
80
–75
AOL
PSRR
CMRR
–50 0
50 100
Temperature (°C)
125
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
–75
GAIN-BANDWIDTH PRODUCT AND
SLEW RATE vs TEMPERATURE
GBW
SR+
SR–
–50 –25 0 25 50 75 100
Temperature (°C)
16
15
14
13
12
11
10
9
8
7
6
125
TOTAL HARMONIC DISTORTION + NOISE
vs FREQUENCY
1
G = +3
RL = 4Ω
75W
0.1 10W
0.01
0.1W
1W
0.001
20
100 1k
Frequency (Hz)
10k 20k
®
5 OPA549
5 Page 
in a complete design (including heat sink) increase the
ambient temperature until the thermal protection is trig-
gered. Use worst-case load and signal conditions. For good
reliability, thermal protection should trigger more than 35°C
above the maximum expected ambient condition of your
application. This produces a junction temperature of 125°C
at the maximum expected ambient condition.
The internal protection circuitry of the OPA549 was de-
signed to protect against overload conditions. It was not
intended to replace proper heat sinking. Continuously run-
ning the OPA549 into thermal shutdown will degrade reli-
ability.
AMPLIFIER MOUNTING AND HEAT SINKING
Most applications require a heat sink to assure that the
maximum operating junction temperature (125°C) is not
exceeded. In addition, the junction temperature should be
kept as low as possible for increased reliability. Junction
temperature can be determined according to the Equations:
TJ = TA + PD θJA
(4)
where
θJA = θJC + θCH + θHA
(5)
TJ = Junction Temperature (°C)
TA = Ambient Temperature (°C)
PD = Power Dissipated (W)
θJC = Junction-to-Case Thermal Resistance (°C/W)
θCH = Case-to-Heat Sink Thermal Resistance (°C/W)
θHA = Heat Sink-to-Ambient Thermal Resistance (°C/W)
θJA = Junction-to-Air Thermal Resistance (°C/W)
Figure 7 shows maximum power dissipation versus ambient
temperature with and without the use of a heat sink. Using
a heat sink significantly increases the maximum power
dissipation at a given ambient temperature as shown.
The challenge in selecting the heat sink required lies in
determining the power dissipated by the OPA549. For dc
output, power dissipation is simply the load current times the
voltage developed across the conducting output transistor,
PD = IL (VS – VO). Other loads are not as simple. Consult
Application Bulletin AB-039 for further insight on calculat-
ing power dissipation. Once power dissipation for an appli-
cation is known, the proper heat sink can be selected.
Heat Sink Selection Example—An 11-lead power ZIP
package is dissipating 10 Watts. The maximum expected
ambient temperature is 40°C. Find the proper heat sink to
keep the junction temperature below 125°C (150°C minus
25°C safety margin).
Combining Equations (4) and (5) gives:
TJ = TA + PD ( θJC + θCH + θHA )
(6)
TJ, TA, and PD are given. θJC is provided in the Specifica-
tions Table, 1.4°C/W (dc). θCH can be obtained from the heat
sink manufacturer. Its value depends on heat sink size, area,
and material used. Semiconductor package type, mounting
screw torque, insulating material used (if any), and thermal
joint compound used (if any) also affect θCH. A typical θCH
for a mounted 11-lead power ZIP package is 0.5°C/W. Now
we can solve for θHA:
θHA = [(TJ – TA)/ PD] – θJC – θCH
θHA = [(125°C – 40°C)/10W] – 1.4°C/W – 0.5°C/W
θHA = 6.6°C/W
To maintain junction temperature below 125°C, the heat
sink selected must have a θHA less than 6.6°C/W. In other
words, the heat sink temperature rise above ambient must be
less than 66°C (6.6°C/W • 10W). For example, at 10W
Thermalloy model number 6396B has a heat sink tempera-
ture rise of 56°C (θHA = 56°C/10W = 5.6°C/W), which is
below the required 66°C required in this example. Thermalloy
model number 6399B has a sink temperature rise of 33°C
(θHA = 33°C/10W = 3.3°C/W), which is also below the
required 66°C required in this example. Figure 7 shows
power dissipation versus ambient temperature for a 11-lead
power ZIP package with the Thermalloy 6396B and 6399B
heat sinks.
30
PD = (TJ (max) – TA)/ θJA
(TJ (max) – 150°C)
20 with Thermalloy 6399B
Heat Sink, θJA = 5.2°C/W
with Thermalloy 6396B
10 Heat Sink, θJA = 7.5°C/W
with No Heat Sink,
θJA = 30°C/W
0
0 25 50 75 100 125
Ambient Temperature (°C)
Thermalloy 6396B
assume
OPA549
Thermalloy 6396B
assume
OPA549
θ HA = 5.6°C/W
θ CH = 0.5°C/W
θ JC = 1.4°C/W
θ JA = 7.5°C/W
θ HA = 3.3°C/W
θ CH = 0.5°C/W
θ JC = 1.4°C/W
θ JA = 5.2°C/W
FIGURE 7. Maximum Power Dissipation vs Ambient
Temperature.
Another variable to consider is natural convection versus
forced convection air flow. Forced-air cooling by a small fan
can lower θCA (θCH + θHA ) dramatically. Some heat sink
manufacturers provide thermal data for both of these cases.
Heat sink performance is generally specified under idealized
conditions that may be difficult to achieve in an actual
application. For additional information on determining heat
sink requirements, consult Application Bulletin AB-038.
®
11 OPA549
11 Page | ||
| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet OPA549.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| OPA541 | Amplifier (Rev. B) |  Texas Instruments |
| OPA541 | High Power Monolithic OPERATIONAL AMPLIFIER | Burr-Brown |
| OPA544 | High-Voltage High-Current Operational Amplifier | Texas Instruments |
| OPA544 | High-Voltage / High-Current OPERATIONAL AMPLIFIER | Burr-Brown |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |