PDF NAND128-A Data sheet ( Hoja de datos )

Número de pieza	NAND128-A
Descripción	128 Mbit / 256 Mbit / 512 Mbit / 1 Gbit (x8/x16) 528 Byte/264 Word Page / 1.8V/3V / NAND Flash Memories
Fabricantes	STMicroelectronics
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NAND128-A, NAND256-A NAND512-A, NAND01G-A 128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16) 528 Byte/264 Word Page, 1.8V/3V, NAND Flash Memories FEATURES SUMMARY ■ HIGH DENSITY NAND FLASH MEMORIES – Up to 1 Gbit memory array – Up to 32 Mbit spare area – Cost effective solutions for mass storage applications ■ NAND INTERFACE – x8 or x16 bus width – Multiplexed Address/ Data – Pinout compatibility for all densities ■ SUPPLY VOLTAGE – 1.8V device: VDD = 1.7 to 1.95V – 3.0V device: VDD = 2.7 to 3.6V ■ PAGE SIZE – x8 device: (512 + 16 spare) Bytes – x16 device: (256 + 8 spare) Words ■ BLOCK SIZE – x8 device: (16K + 512 spare) Bytes – x16 device: (8K + 256 spare) Words ■ PAGE READ / PROGRAM – Random access: 12µs (max) – Sequential access: 50ns (min) – Page program time: 200µs (typ) ■ COPY BACK PROGRAM MODE – Fast page copy without external buffering ■ FAST BLOCK ERASE – Block erase time: 2ms (Typ) ■ STATUS REGISTER ■ ELECTRONIC SIGNATURE ■ CHIP ENABLE ‘DON’T CARE’ OPTION – Simple interface with microcontroller ■ SERIAL NUMBER OPTION ■ HARDWARE DATA PROTECTION – Program/Erase locked during Power transitions Figure 1. Packages TSOP48 12 x 20mm WSOP48 12 x 17 x 0.65mm FBGA VFBGA55 8 x 10 x 1mm TFBGA55 8 x 10 x 1.2mm VFBGA63 8.5 x 15 x 1mm TFBGA63 8.5 x 15 x 1.2mm ■ DATA INTEGRITY – 100,000 Program/Erase cycles – 10 years Data Retention ■ RoHS COMPLIANCE – Lead-Free Components are Compliant with the RoHS Directive ■ DEVELOPMENT TOOLS – Error Correction Code software and hardware models – Bad Blocks Management and Wear Leveling algorithms – File System OS Native reference software – Hardware simulation models December 2004 1/55 1 page NAND128-A, NAND256-A, NAND512-A, NAND01G-A Behavioral simulation models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 IBIS simulations models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 PROGRAM AND ERASE TIMES AND ENDURANCE CYCLES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Table 14. Program, Erase Times and Program Erase Endurance Cycles . . . . . . . . . . . . . . . . . . . 31 MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Table 15. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 DC and AC PARAMETERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Table 16. Operating and AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Table 17. Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Table 18. DC Characteristics, 1.8V Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Table 19. DC Characteristics, 3V Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Table 20. AC Characteristics for Command, Address, Data Input . . . . . . . . . . . . . . . . . . . . . . . . . 35 Table 21. AC Characteristics for Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Figure 23.Command Latch AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Figure 24.Address Latch AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Figure 25.Data Input Latch AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Figure 26.Sequential Data Output after Read AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Figure 27.Read Status Register AC Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Figure 28.Read Electronic Signature AC Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Figure 29.Page Read A/ Read B Operation AC Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Figure 30.Read C Operation, One Page AC Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Figure 31.Page Program AC Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Figure 32.Block Erase AC Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Figure 33.Reset AC Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Ready/Busy Signal Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Figure 34.Ready/Busy AC Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Figure 35.Ready/Busy Load Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Figure 36.Resistor Value Versus Waveform Timings For Ready/Busy Signal . . . . . . . . . . . . . . . . 44 PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Figure 37.TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20mm, Package Outline . . . . . . . . . 45 Table 22. TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20mm, Package Mechanical Data . 45 Figure 38.WSOP48 – 48 lead Plastic Very Very Thin Small Outline, 12 x 17mm, Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Table 23. WSOP48 lead Plastic Very Very Thin Small Outline, 12 x 17mm, Mechanical Data. . . . 46 Figure 39.VFBGA55 8 x 10mm - 6x8 active ball array, 0.80mm pitch, Package Outline . . . . . . . . 47 Table 24. VFBGA55 8 x 10mm - 6x8 ball array, 0.80mm pitch, Package Mechanical Data . . . . . . 47 Figure 40.TFBGA55 8 x 10mm - 6x8 active ball array - 0.80mm pitch, Package Outline . . . . . . . . 48 Table 25. TFBGA55 8 x 10mm - 6x8 active ball array - 0.80mm pitch, Package Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Figure 41.VFBGA63 8.5 x 15mm - 6x8 active ball array, 0.80mm pitch, Package Outline . . . . . . . 49 Table 26. VFBGA63 8.5 x 15mm - 6x8 active ball array, 0.80mm pitch, Package Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 5/55 5 Page NAND128-A, NAND256-A, NAND512-A, NAND01G-A Figure 6. FBGA55 Connections, x8 devices (Top view through package) 12 3 45678 A DU B DU DU C WP AL VSS E W RB D NC R CL NC NC NC E NC NC NC NC NC NC F NC NC NC NC NC NC G NC NC NC NC NC NC H NC I/O0 NC NC NC VDD J NC I/O1 NC VDD I/O5 I/O7 K VSS I/O2 I/O3 I/O4 I/O6 VSS L DU DU M DU DU AI09366b 11/55 11 Page

Páginas	Total 55 Páginas
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Hoja de datos destacado

Número de pieza	Descripción	Fabricantes
NAND128-A	128 Mbit / 256 Mbit / 512 Mbit / 1 Gbit (x8/x16) 528 Byte/264 Word Page / 1.8V/3V / NAND Flash Memories	STMicroelectronics
NAND128-A	SLC NAND flash memories	Numonyx

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