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PDF 93LC56-SL Data sheet ( Hoja de datos )

Número de pieza 93LC56-SL
Descripción 1K/2K/4K 2.0V Microwire Serial EEPROM
Fabricantes Microchip Technology 
Logotipo Microchip Technology Logotipo



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M
93LC46/56/66
1K/2K/4K 2.0V Microwire® Serial EEPROM
FEATURES
• Single supply with programming operation down
to 2.0V (Commercial only)
• Low power CMOS technology
- 1 mA active current typical
- 5 µA standby current (typical) at 3.0V
• ORG pin selectable memory configuration
- 128 x 8 or 64 x 16-bit organization (93LC46)
- 256 x 8 or 128 x 16-bit organization(93LC56)
- 512 x 8 or 256 x 16-bit organization(93LC66)
• Self-timed ERASE and WRITE cycles
(including auto-erase)
• Automatic ERAL before WRAL
• Power on/off data protection circuitry
• Industry standard 3-wire serial I/O
• Device status signal during ERASE/WRITE cycles
• Sequential READ function
• 10,000,000 ERASE/WRITE cycles guaranteed on
93LC56 and 93LC66
• 1,000,000 E/W cycles guaranteed on 93LC46
• Data retention > 200 years
• 8-pin PDIP/SOIC and 14-pin SOIC package
(SOIC in JEDEC and EIAJ standards)
• Temperature ranges supported
- Commercial (C):
0°C to +70°C
- Industrial (I):
-40°C to +85°C
PACKAGE TYPES
BLOCK DIAGRAM
VCC
VSS
MEMORY
ARRAY
ADDRESS
DECODER
ADDRESS
COUNTER
DI
CS
CLK
DATA REGISTER
MODE
DECODE
LOGIC
CLOCK
GENERATOR
OUTPUT
BUFFER
DO
DESCRIPTION
The Microchip Technology Inc. 93LC46/56/66 are 1K,
2K, and 4K low-voltage serial Electrically Erasable
PROMs. The device memory is configured as x8 or x16
bits, depending on the ORG pin setup. Advanced
CMOS technology makes these devices ideal for
low-power, nonvolatile memory applications. The
93LC46/56/66 is available in standard 8-pin DIP and 8/
14-pin surface mount SOIC packages. The 93LC46X/
56X/66X are only offered in an “SN” package.
SOIC
DIP
CS 1
CLK 2
DI 3
DO 4
8 VCC
CS
7 NU CLK
6 ORG DI
5 VSS
DO
SOIC
18
27
36
45
SOIC
VCC
NU
NU VCC
ORG CS
VSS CLK
1
2
3
4
8
7
6
5
NC
CS
CLK
ORG NC
VSS DI
DO DO
DI NC
1
2
3
4
5
6
7
14 NC
13 Vcc
12 NU
11 NC
10 ORG
9 VSS
8 NC
© 1997 Microchip Technology Inc.
DS11168L-page 1

1 page




93LC56-SL pdf
3.0 FUNCTIONAL DESCRIPTION
When it is connected to ground, the (x8) organization is
selected. When the ORG pin is connected to Vcc, the
(x16) organization is selected. Instructions, addresses
and write data are clocked into the DI pin on the rising
edge of the clock (CLK). The DO pin is normally held in
a HIGH-Z state, except when reading data from the
device or when checking the READY/BUSY status dur-
ing a programming operation. The READY/BUSY
status can be verified during an ERASE/WRITE opera-
tion by polling the DO pin; DO low indicates that pro-
gramming is still in progress, while DO high indicates
the device is ready. The DO will enter the HIGH-Z state
on the falling edge of the CS.
3.1 START Condition
The START bit is detected by the device if CS and DI
are both high with respect to the positive edge of CLK
for the first time.
Before a START condition is detected, CS, CLK, and DI
may change in any combination (except to that of a
START condition), without resulting in any device oper-
ation (READ, WRITE, ERASE, EWEN, EWDS, ERAL,
and WRAL). As soon as CS is high, the device is no
longer in the standby mode.
An instruction following a START condition will only be
executed if the required amount of opcodes,
addresses, and data bits for any particular instruction is
clocked in.
After execution of an instruction (i.e., clock in or out of
the last required address or data bit) CLK and DI
become don't care bits until a new START condition is
detected.
FIGURE 3-1: SYNCHRONOUS DATA TIMING
V IH
CS
V IL
TCSS
V IH
CLK
V IL
V IH
DI
V IL
TDIS
DO VOH
(READ) VOL
DO VOH
(PROGRAM)
V OL
TSV
TCKH
TDIH
TPD
93LC46/56/66
3.2 Data In (DI) and Data Out (DO)
It is possible to connect the Data In (DI) and Data Out
(DO) pins together. However, with this configuration, if
A0 is a logic-high level, it is possible for a “bus conflict”
to occur during the “dummy zero” that precedes the
READ operation. Under such a condition the voltage
level seen at DO is undefined and will depend upon the
relative impedances of Data Out, and the signal source
driving A0. The higher the current sourcing capability of
A0, the higher the voltage at the DO pin.
3.3 Data Protection
During power-up, all programming modes of operation
are inhibited until Vcc has reached a level greater than
1.4V. During power-down, the source data protection
circuitry acts to inhibit all programming modes when
Vcc has fallen below 1.4V at nominal conditions.
The ERASE/WRITE Disable (EWDS) and ERASE/
WRITE Enable (EWEN) commands give additional pro-
tection against accidentally programming during nor-
mal operation.
After power-up, the device is automatically in the
EWDS mode. Therefore, an EWEN instruction must be
performed before any ERASE or WRITE instruction can
be executed.
TCKL
TCSH
TPD
STATUS VALID
TCZ
TCZ
© 1997 Microchip Technology Inc.
DS11168L-page 5

5 Page





93LC56-SL arduino
93LC46/56/66
93LC46/56/66 PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office..
93LC46/56/66 —
/P
Package:
P = Plastic DIP (300 mil Body), 8-lead
SL = Plastic SOIC (107 mil Body), 14-lead
SN = Plastic SOIC (150 mil Body), 8-lead
SM = Plastic SOIC (207 mil Body), 8-lead
Temperature
Range:
Blank = 0˚C to +70˚C
I = –40˚C to +85˚C
Device:
93LC46
93LC46T
93LC46X
93LC46XT
93LC56
93LC56T
93LC56X
93LC56XT
93LC66
93LC66T
93LC66X
93LC66XT
1K Microwire Serial EEPROM
1K Microwire Serial EERPOM, Tape and Reel
1K Microwire Serial EEPROM in alternate
pinouts (SN package only)
1K Microwire Serial EEPROM in alternate
pinouts, Tape and Reel (SN package only)
2K Microwire Serial EEPROM
2K Microwire Serial EERPOM, Tape and Reel
2K Microwire Serial EEPROM in alternate
pinouts (SN package only)
2K Microwire Serial EEPROM in alternate
pinouts, Tape and Reel (SN package only)
4K Microwire Serial EEPROM
4K Microwire Serial EERPOM, Tape and Reel
4K Microwire Serial EEPROM in alternate
pinouts (SN package only)
4K Microwire Serial EEPROM in alternate
pinouts, Tape and Reel (SN package only)
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (602) 786-7277
3. The Microchip’s Bulletin Board, via your local CompuServe number (CompuServe membership NOT required).
© 1997 Microchip Technology Inc.
DS11168L-page 11

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