|
|
Número de pieza | K4G323222A | |
Descripción | 32Mbit SGRAM | |
Fabricantes | Samsung | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de K4G323222A (archivo pdf) en la parte inferior de esta página. Total 30 Páginas | ||
No Preview Available ! K4G323222A
CMOS SGRAM
32Mbit SGRAM
512K x 32bit x 2 Banks
Synchronous Graphic RAM
LVTTL
Revision 1.3
December 2000
Samsung Electronics reserves the right to change products or specification without notice.
Rev. 1.3 (Dec. 2000)
-1-
1 page K4G323222A
CMOS SGRAM
ABSOLUTE MAXIMUM RATINGS(Voltage referenced to VSS)
Parameter
Voltage on any pin relative to Vss
Voltage on VDD supply relative to Vss
Storage temperature
Power dissipation
Short circuit current
Symbol
VIN, VOUT
VDD, VDDQ
TSTG
PD
IOS
Value
-1.0 ~ 4.6
-1.0 ~ 4.6
-55 ~ +150
1
50
Unit
V
V
°C
W
mA
Note : Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
DC OPERATING CONDITIONS
Recommended operating conditions (Voltage referenced to VSS = 0V)
Parameter
Symbol
Min
Typ
Max
Unit
Supply voltage
VDD, VDDQ
3.0
3.3
3.6
V
Input high voltage
VIH
2.0
3.0 VDDQ+0.3
V
Input low voltage
VIL -0.3 0 0.8 V
Output high voltage
VOH
2.4
-
-
V
Output low voltage
VOL -
- 0.4 V
Input leakage current
ILI -10 - 10 uA
Output leakage current
ILO -10 - 10 uA
Output Loading Condition
see figure 1
Note : 1. VIH (max) = 5.6V AC. The overshoot voltage duration is ≤ 3ns.
2. VIL (min) = -2.0V AC. The undershoot voltage duration is ≤ 3ns.
3. Any input 0V ≤ VIN ≤ VDDQ.
Input leakage currents include HI-Z output leakage for all bi-directional buffers with Tri-State outputs.
4. Dout is disabled, 0V ≤ VOUT ≤ VDD.
5. The VDD condition of K4G323222A-45/50/7C/60 is 3.135V~3.6V.
Note
5
1
2
IOH = -2mA
IOL = 2mA
3
4
CAPACITANCE (VDD/VDDQ = 3.3V, TA = 23°C, f = 1MHz)
Pin
Clock
RAS, CAS, WE, CS, CKE, DQMi,DSF
Address
DQi
Symbol
CCLK
CIN
CADD
COUT
Min
-
-
-
-
Max
4.0
4.0
4.0
5.0
Unit
pF
pF
pF
pF
DECOUPLING CAPACITANCE GUIDE LINE
Recommended decoupling capacitance added to power line at board.
Parameter
Decoupling Capacitance between VDD and VSS
Decoupling Capacitance between VDDQ and VSSQ
Symbol
CDC1
CDC2
Value
0.1 + 0.01
0.1 + 0.01
Unit
uF
uF
Note : 1. VDD and VDDQ pins are separated each other.
All VDD pins are connected in chip. All VDDQ pins are connected in chip.
2. VSS and VSSQ pins are separated each other
All VSS pins are connected in chip. All VSSQ pins are connected in chip.
-5-
Rev. 1.3 (Dec. 2000)
5 Page K4G323222A
MODE REGISTER FIELD TABLE TO PROGRAM MODES
Register Programmed with MRS
Address
Function
BA A10
RFU
(Note 1)
A9
W.B.L
(Note 2)
A8 A7
TM
A6 A5 A4
CAS Latency
CMOS SGRAM
A3 A2 A1 A0
BT Burst Length
Test Mode
CAS Latency
A8 A7
Type
A6 A5 A4 Latency
0 0 Mode Register Set 0 0 0 Reserved
01
10
11
Vendor
Use
Only
001
010
011
-
2
3
Write Burst Length
1 0 0 Reserved
A9 Length
1 0 1 Reserved
0 Burst 1 1 0 Reserved
1 Single Bit 1 1 1 Reserved
Burst Type
A3 Type
0 Sequential
1 Interleave
Burst Length
A2 A1 A0
BT=0
000
1
001
2
010
4
011
8
1 0 0 Reserved
1 0 1 Reserved
1 1 0 Reserved
1 1 1 256(Full)
BT=1
Reserved
Reserved
4
8
Reserved
Reserved
Reserved
Reserved
(Note 3)
Special Mode Register Programmed with SMRS
Address
BA
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
Function
X
LC 0
X
Load Color
A6 Function
0 Disable
1 Enable
POWER UP SEQUENCE
SGRAMs must be powered up and initialized in a predefined manner to prevent undefined operations.
1. Apply power and start clock. Must maintain CKE= "H", DQM= "H" and the other pins are NOP condition at the inputs.
2. Maintain stable power, stable clock and NOP input condition for a minimum of 200us.
3. Issue precharge commands for all banks of the devices.
4. Issue 2 or more auto-refresh commands.
5. Issue a mode register set command to initialize the mode register.
cf.) Sequence of 4 & 5 may be changed.
The device is now ready for normal operation.
Note : 1. RFU(Reserved for Future Use) should stay "0" during MRS cycle.
2. If A9 is high during MRS cycle, "Burst Read Single Bit Write" function will be enabled.
3. The full column burst(256bit) is available only at Sequential mode of burst type.
Rev. 1.3 (Dec. 2000)
- 11
11 Page |
Páginas | Total 30 Páginas | |
PDF Descargar | [ Datasheet K4G323222A.PDF ] |
Número de pieza | Descripción | Fabricantes |
K4G323222A | 32Mbit SGRAM | Samsung |
Número de pieza | Descripción | Fabricantes |
SLA6805M | High Voltage 3 phase Motor Driver IC. |
Sanken |
SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
Analog Devices |
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |