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PDF K4D263238F Data sheet ( Hoja de datos )

Número de pieza K4D263238F
Descripción 1M x 32Bit x 4 Banks Double Data Rate Synchronous DRAM with Bi-directional Data Strobe and DLL
Fabricantes Samsung 
Logotipo Samsung Logotipo



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K4D263238F
128M DDR SDRAM
128Mbit DDR SDRAM
1M x 32Bit x 4 Banks
Double Data Rate Synchronous DRAM
with Bi-directional Data Strobe and DLL
Revision 1.1
May 2003
-1-
Rev 1.1 (May 2003)

1 page




K4D263238F pdf
K4D263238F
128M DDR SDRAM
INPUT/OUTPUT FUNCTIONAL DESCRIPTION
Symbol
Type
Function
CK, CK*1
Input
The differential system clock Input.
All of the inputs are sampled on the rising edge of the clock except
DQs and DMs that are sampled on both edges of the DQS.
CKE
Input
Activates the CK signal when high and deactivates the CK signal
when low. By deactivating the clock, CKE low indicates the Power
down mode or Self refresh mode.
CS Input
CS enables the command decoder when low and disabled the com-
mand decoder when high. When the command decoder is disabled,
new commands are ignored but previous operations continue.
RAS
Input
Latches row addresses on the positive going edge of the CK with
RAS low. Enables row access & precharge.
CAS
Input
Latches column addresses on the positive going edge of the CK with
CAS low. Enables column access.
WE Input
Enables write operation and row precharge.
Latches data in starting from CAS, WE active.
DQS
Input/Output
Data input and output are synchronized with both edge of DQS.
DM0 ~ DM3
Input
Data In mask. Data In is masked by DM Latency=0 when DM is high
in burst write. DM0 for DQ0 ~ DQ7, DM1 for DQ8 ~ DQ15, DM2 for
DQ16 ~ DQ23, DM3 for DQ24 ~ DQ31.
DQ0 ~ DQ31
Input/Output
Data inputs/Outputs are multiplexed on the same pins.
BA0, BA1
Input
Selects which bank is to be active.
A0 ~ A11
Input
Row/Column addresses are multiplexed on the same pins.
Row addresses : RA0 ~ RA11, Column addresses : CA0 ~ CA7.
Column address CA8 is used for auto precharge.
VDD/VSS
Power Supply
Power and ground for the input buffers and core logic.
VDDQ/VSSQ
Power Supply
Isolated power supply and ground for the output buffers to provide
improved noise immunity.
VREF
Power Supply
Reference voltage for inputs, used for SSTL interface.
MCL
Must Connect Low
Must connect Low
*1 : The timing reference point for the differential clocking is the cross point of CK and CK.
For any applications using the single ended clocking, apply VREF to CK pin.
-5-
Rev 1.1 (May 2003)

5 Page





K4D263238F arduino
K4D263238F
128M DDR SDRAM
DC CHARACTERISTICS
Recommended operating conditions Unless Otherwise Noted, TA=0 to 65°C)
Parameter
Symbol
Test Condition
Operating Current
(One Bank Active)
ICC1
Precharge Standby Current
in Power-down mode
ICC2P
Precharge Standby Current
in Non Power-down mode
ICC2N
Active Standby Current
power-down mode
ICC3P
Active Standby Current in
in Non Power-down mode
ICC3N
Operating Current
( Burst Mode)
ICC4
Refresh Current
ICC5
Self Refresh Current
ICC6
Note: 1. Measured with outputs open.
2. Refresh period is 32ms.
Burst Lenth=2 tRC tRC(min)
IOL=0mA, tCC= tCC(min)
CKE VIL(max), tCC= tCC(min)
CKE VIH(min), CS VIH(min),
tCC= tCC(min).
CKE VIL(max), tCC= tCC(min)
CKE VIH(min), CS VIH(min),
tCC= tCC(min) .
IOL=0mA ,tCC= tCC(min), Page
Burst, All Banks activated.
tRC tRFC(min)
CKE 0.2V
-40
250
60
90
110
200
500
240
Version
3
-50
215
55
80
95
170
480
220
Unit Note
mA 1
mA
mA
mA
mA
mA
mA 2
mA
AC INPUT OPERATING CONDITIONS
Recommended operating conditions(Voltage referenced to VSS=0V, VDD/ VDDQ=2.5V+ 5%, TA=0 to 65°C)
Parameter
Input High (Logic 1) Voltage; DQ
Symbol
VIH
Min
VREF+0.35
Typ
-
Max
-
Unit
V
Note
Input Low (Logic 0) Voltage; DQ
VIL -
-
VREF-0.35
V
Clock Input Differential Voltage; CK and CK
VID
0.7
-
VDDQ+0.6
V
1
Clock Input Crossing Point Voltage; CK and CK VIX 0.5*VDDQ-0.2
-
0.5*VDDQ+0.2
V
2
Note : 1. VID is the magnitude of the difference between the input level on CK and the input level on CK
2. The value of VIX is expected to equal 0.5*VDDQ of the transmitting device and must track variations in the DC level of the same
- 11 -
Rev 1.1 (May 2003)

11 Page







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